Abstract: A pressure sensor has a stem in which a pressure introduction hole into which a pressure medium is introduced and a diaphragm deformable according to the pressure of the pressure medium are formed, and a strain detecting element which is arranged on the diaphragm via an insulating film and being configured to output a detection signal according to the deformation of the diaphragm. The strain detecting element is configured to have a portion made of polysilicon. A low doping layer having a higher electrical resistivity than polysilicon and a higher crystallinity than the insulating film is arranged between the insulating film and the strain detecting element.

Abstract: Provided is a method for producing a cell population containing embryonic erythroblasts, including the steps of: (1) subjecting pluripotent stem cells to suspension culture to form a cell aggregate; and (2) obtaining the cell population from the cell aggregate obtained in step (1), step (2) including step (2a) of subjecting the cell aggregate to adhesion culture. In addition, provided are an embryonic erythroblast-containing cell population, a cell culture composition containing the cell population, and a compound test method that uses the embryonic erythroblast-containing cell population.

Abstract: A pressure sensor has a stem in which a pressure introduction hole into which a pressure medium is introduced and a diaphragm deformable according to the pressure of the pressure medium are formed, and a strain detecting element which is arranged on the diaphragm via an insulating film and being configured to output a detection signal according to the deformation of the diaphragm. The strain detecting element is configured to have a portion made of polysilicon. A low doping layer having a higher electrical resistivity than polysilicon and a higher crystallinity than the insulating film is arranged between the insulating film and the strain detecting element.

Abstract: According to the present invention, there is provided a method for producing artificial trophoblasts derived from human cells, that includes the steps of: adhesion culturing human pluripotent stem cells in a culture medium containing a BMP signal transduction activator, and during the culturing bringing the cells under culturing into contact with at least one selected from the group consisting of a ? aminobutyric acid B receptor activator, a peroxisome proliferator-activated receptor ? activator, a retinoid X receptor activator, and a retinoic acid receptor activator, thereby obtaining a culture containing trophoblasts differentiated from the human pluripotent stem cells, and so on.

Abstract: Provided is an optical fiber cable having excellent flame retardancy, long-term heat resistance and mechanical characteristics. An optical fiber cable according to the present invention comprises an optical fiber and a cladding layer that is provided on the outer circumference of the optical fiber. The cladding layer contains a chlorinated polyolefin resin (A) and a polyolefin resin (B).

Abstract: Provided is an optical fiber cable having excellent flame retardancy, long-term heat resistance and mechanical characteristics. An optical fiber cable according to the present invention comprises an optical fiber and a cladding layer that is provided on the outer circumference of the optical fiber. The cladding layer contains a chlorinated polyolefin resin (A) and a polyolefin resin (B).

Abstract: An optical fiber cable is formed with an optical fiber and a coating layer made up of at least one layer provided on the outer periphery of the optical fiber. The material for forming the coating layer is made of a halogen-free resin composition containing polyolefin resin (A) and melt tension enhancer (B).

Abstract: An optical fiber cable is formed with an optical fiber and a coating layer made up of at least one layer provided on the outer periphery of the optical fiber. The material for forming the coating layer is made of a halogen-free resin composition containing polyolefin resin (A) and melt tension enhancer (B).

Abstract: Provided is a plastic optical fiber cable including a plastic optical fiber 12 comprising of a core 11A and a cladding 11B, and a jacketing layer covering the plastic optical fiber 12, in which the jacketing layer includes at least two layers of an inner layer 13 and an outer layer 14, the inner layer 13 is formed of a resin comprising of a copolymer of ethylene and a (meth)acrylic compound, and the outer layer 14 is formed of a fluorine-based resin. A plastic optical fiber cable excellent in flame retardance, appearance, and processability at the time of use is obtained from the plastic optical fiber cable described above.

Abstract: Provided is a plastic optical fiber cable including a plastic optical fiber 12 comprising of a core 11A and a cladding 11B, and a jacketing layer covering the plastic optical fiber 12, in which the jacketing layer includes at least two layers of an inner layer 13 and an outer layer 14, the inner layer 13 is formed of a resin comprising of a copolymer of ethylene and a (meth)acrylic compound, and the outer layer 14 is formed of a fluorine-based resin. A plastic optical fiber cable excellent in flame retardance, appearance, and processability at the time of use is obtained from the plastic optical fiber cable described above.

Abstract: A composition for jacketing an optical fiber including a modified PPE resin containing a polyphenylene ether resin and a thermoplastic resin compatible with the polyphenylene ether resin, and a non halogen-based flame retardant, in which a nitrogen compound is included as the non halogen-based flame retardant and the content of nitrogen element in the composition is in the range of 100000 to 300000 ppm as measured by an elementary analysis.

Abstract: An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 ?m) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be prevented. Thus, the reliability of the connection of the via holes can be improved.

Abstract: An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 ?m) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be improved.

Abstract: An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 ?m) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be improved.

Abstract: An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 ?m) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be improved.

Abstract: An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 ?m) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be improved.

Abstract: An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 ?m) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be improved.

Abstract: A deflector which deflects a charged particle beam includes a substrate having an opening through which the charged particle beam should pass, and a deflection electrode which is arranged in the opening to deflect the charged particle beam and has a first conductive member and second conductive member which are formed by plating. The second conductive member is formed on a surface of the first conductive member and is essentially made of a material that is more difficult to oxidize than the first conductive member.

Abstract: A printed wiring board has a circuit substrate 6 having a conductor circuit 5 and a through hole 60, and also has a joining pin 1 inserted into the through hole. The joining pin is manufactured by using a material unmelted at a heating temperature in joining the joining pin to an opposite party pad 81. The joining pin is constructed by a joining head portion 11 having a greater diameter than an opening diameter of the through hole. The joining pin forms a joining portion for joining and connection to the opposite party pad. The joining pin has a leg portion 12 having a diameter smaller than the through hole. The leg portion is inserted into the through hole and is joined to the through hole by a conductive material such as a soldering material 20, etc. In lieu of a joining pin, a joining ball approximately having a spherical shape can be joined to the through hole by the conductive material.

Abstract: A deflector which deflects a charged particle beam includes a substrate having an opening through which the charged particle beam should pass, and a deflection electrode which is arranged in the opening to deflect the charged particle beam and has a first conductive member and second conductive member which are formed by plating. The second conductive member is formed on a surface of the first conductive member and is essentially made of a material that is more difficult to oxidize than the first conductive member.