Abstract: An outer covering wall (26) and an inner covering wall (27), which are capable of surrounding a rotor (24), can be horizontally moved. A wafer carrier waiting portion (30) is disposed right below the rotor (24). A wafer holding member (41) included in a wafer lifter (40) moves into a wafer carrier (C) containing wafers (W) and mounted on a stage (31) (sliding table 32) included in the wafer carrier waiting portion (30), lifts up the wafers (W) and transfers the wafers (W) to the rotor (24). The outer covering wall (26) or the inner covering wall (27) surrounds the rotor (24) to define a processing chamber. The wafers (W) held on the rotor (24) are subjected to a cleaning process in the processing chamber.

Abstract: An outer covering wall (26) and an inner covering wall (27), which are capable of surrounding a rotor (24), can be horizontally moved. A wafer carrier waiting portion (30) is disposed right below the rotor (24). A wafer holding member (41) included in a wafer lifter (40) moves into a wafer carrier (C) containing wafers (W) and mounted on a stage (31) (sliding table 32) included in the wafer carrier waiting portion (30), lifts up the wafers (W) and transfers the wafers (W) to the rotor (24). The outer covering wall (26) or the inner covering wall (27) surrounds the rotor (24) to define a processing chamber. The wafers (W) held on the rotor (24) are subjected to a cleaning process in the processing chamber.

Abstract: An outer covering wall (26) and an inner covering wall (27), which are capable of surrounding a rotor (24), can be horizontally moved. A wafer carrier waiting portion (30) is disposed right below the rotor (24). A wafer holding member (41) included in a water lifter (40) moves into a wafer carrier (C) containing wafers (W) and mounted on a stage (31) (sliding table 32) included in the wafer carrier waiting portion (30), lifts up the wafers (W) and transfers the wafers (W) to the rotor (24). The outer covering wall (26) or the inner covering wall (27) surrounds the rotor (24) to define a processing chamber. The wafers (W) held on the rotor (24) are subjected to a cleaning process in the processing chamber.

Abstract: A substrate arranging apparatus has a carrier support table 40 for supporting thereon carriers C holding a plurality of wafers in arranged in a row, first support mechanisms 42, 43 capable of moving upward relative to the table 40 to support the wafers contained in the carriers C, and a second support mechanism 60 capable of supporting the even or the odd wafers among the wafers supported by the first support mechanisms 60 and of raising the wafers supported thereon relative to the rest of the wafers. The first support mechanisms 42, 43 or the second support mechanism is able to turn through an angle of 180° relative to the other. As a result, the wafer are arranged in a front-to-front and back-to-back disposition. Thus, the carrier support table, the loader mechanism and the substrate arranging section are integrally combined and the time needed for the transfer of the wafers is shortened.

Abstract: A substrate arranging apparatus has a carrier support table 40 for supporting thereon carriers C holding a plurality of wafers in arranged in a row, first support mechanisms 42, 43 capable of moving upward relative to the table 40 to support the wafers contained in the carriers C, and a second support mechanism 60 capable of supporting the even or the odd wafers among the wafers supported by the first support mechanisms 60 and of raising the wafers supported thereon relative to the rest of the wafers. The first support mechanisms 42, 43 or the second support mechanism is able to turn through an angle of 180° relative to the other. As a result, the wafer are arranged in a front-to-front and back-to-back disposition. Thus, the carrier support table, the loader mechanism and the substrate arranging section are integrally combined and the time needed for the transfer of the wafers is shortened.