Patents by Inventor Kouji Enokida

Kouji Enokida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate processing apparatus and substrate processing method
    Patent number: 12255081
    Abstract: A substrate processing apparatus includes multiple first substrate processing devices, one or more second substrate processing devices and a transfer unit. Each of the multiple first substrate processing devices is configured to process a substrate one by one. The one or more second substrate processing devices are configured to simultaneously process multiple substrates, which are processed in the multiple first substrate processing devices. The transfer unit is configured to simultaneously carry the multiple substrates, which are processed in the multiple first substrate processing devices, into a same second substrate processing device.
    Type: Grant
    Filed: April 4, 2022
    Date of Patent: March 18, 2025
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Shinichi Hayashi, Hiroaki Inadomi, Shota Umezaki, Suguru Enokida, Kouji Kimoto
  • Electromagnetic wave absorber and high-frequency circuit package using the same
    Patent number: 6822541
    Abstract: The electromagnetic wave absorber of the present invention is made of a sintered body that contains Fe and at least one element selected from Si, Mg, Zr, Ni, Al and Co, and an attenuation of electromagnetic wave is 2 dB or more at frequencies of 10 GHz and higher so as to provide good electromagnetic wave absorbing characteristic with no corrosive gas generated at all, and is easy to manufacture. The electromagnetic wave absorber is used mainly as a component of a high-frequency circuit package.
    Type: Grant
    Filed: April 25, 2003
    Date of Patent: November 23, 2004
    Assignee: Kyocera Corporation
    Inventors: Toshiyuki Sue, Kouji Enokida, Yoshihiro Okawa
  • Electromagnetic wave absorber and high-frequency circuit package using the same
    Publication number: 20040036559
    Abstract: The electromagnetic wave absorber of the present invention is made of a sintered body that contains Fe and at least one element selected from Si, Mg, Zr, Ni, Al and Co, and an attenuation of electromagnetic wave is 2 dB or more at frequencies of 10 GHz and higher so as to provide good electromagnetic wave absorbing characteristic with no corrosive gas generated at all, and is easy to manufacture. The electromagnetic wave absorber is used mainly as a component of a high-frequency circuit package.
    Type: Application
    Filed: April 25, 2003
    Publication date: February 26, 2004
    Applicant: KYOCERA CORPORATION
    Inventors: Toshiyuki Sue, Kouji Enokida, Yoshihiro Okawa