Patents by Inventor Kouji Fujisaki

Kouji Fujisaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for producing thin film multilayer wiring board
    Patent number: 5707749
    Abstract: A thin film multilayer wiring material excellent in reliability, yield, productivity, and higher positioning accuracy includes an insulation organic film having a wiring pattern on one surface and an adhesive layer on another principal surface. The insulation organic film is a polyimide film having a heat resistance at a pyrolysis beginning temperature of 350.degree. to 550.degree. C., a dielectric constant of 3.5-2.2 and a flame retardance of V-0 or V-1 according to the UL-94 standard. The adhesive layer contains an ether bismaleimide compound.
    Type: Grant
    Filed: June 26, 1995
    Date of Patent: January 13, 1998
    Assignee: Hitachi, Ltd.
    Inventors: Junichi Katagiri, Akio Takahashi, Akira Nagai, Haruo Akahoshi, Kouji Fujisaki, Akio Mukoh, Fumiyuki Kobayashi