Patents by Inventor Kouji HATORI

Kouji HATORI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9302435
    Abstract: A bus bar assembly comprises a plurality of conductive plate-shaped bus bars and a resin mold section in which a plurality of conductive plate-shaped bus bars are partially embedded. In a method for manufacturing the bus bar assembly, firstly a plurality of conductive plate-shaped bus bars are disposed within a cavity formed by a die such as to be stacked in a thickness direction Z with a predetermined amount of space therebetween. Second, a first end and a second end of each bus bar are respectively supported by jigs in the width direction Y. Next, the cavity in the die is filled with the insulating resin and the plurality of bus bars are molded into a single body. After that, jigs are removed from the bus bars and jig placement portions are formed in the resin mold section.
    Type: Grant
    Filed: September 24, 2013
    Date of Patent: April 5, 2016
    Assignee: DENSO CORPORATION
    Inventor: Kouji Hatori
  • Publication number: 20140116751
    Abstract: A bus bar assembly comprises a plurality of conductive plate-shaped bus bars and a resin mold section in which a plurality of conductive plate-shaped bus bars are partially embedded. In a method for manufacturing the bus bar assembly, firstly a plurality of conductive plate-shaped bus bars are disposed within a cavity formed by a die such as to be stacked in a thickness direction Z with a predetermined amount of space therebetween. Second, a first end and a second end of each bus bar are respectively supported by jigs in the width direction Y. Next, the cavity in the die is filled with the insulating resin and the plurality of bus bars are molded into a single body. After that, jigs are removed from the bus bars and jig placement portions are formed in the resin mold section.
    Type: Application
    Filed: September 24, 2013
    Publication date: May 1, 2014
    Applicant: DENSO CORPORATION
    Inventor: Kouji HATORI