Patents by Inventor Kouji Ichinose
Kouji Ichinose has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230089044Abstract: Provided is an optical connector that includes a ferrule and an optical fiber as a plastic optical fiber. The ferrule has a leading end face and a through hole for holding a fiber, the through hole having an opening end in the leading end face. The optical fiber has a leading end. The leading end of the optical fiber is inserted in the through hole and located at a retraction position retracted from the leading end face.Type: ApplicationFiled: March 26, 2021Publication date: March 23, 2023Applicant: NITTO DENKO CORPORATIONInventors: Naoto KONEGAWA, Seiki TERAJI, Kouji ICHINOSE
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Patent number: 10264684Abstract: First and second measurement probes come into contact with first and second electrode pads, respectively, and third and fourth measurement probes come into contact with the first and second electrode pads, respectively. A current flows in a current path including the first and second electrode pads and a plurality of lines through the first and second measurement probes. A value of the current in the current path is measured, and a value of a voltage between the third and fourth measurement probes is measured. Conductivity between the first and second electrode pads is inspected based on the measured value of the current and the measured value of the voltage.Type: GrantFiled: September 4, 2014Date of Patent: April 16, 2019Assignee: NITTO DENKO CORPORATIONInventors: Terukazu Ihara, Kouji Ichinose
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Patent number: 9648726Abstract: A plurality of suspension boards are integrally supported by a support frame. A plurality of inspection substrates are provided to correspond to the plurality of suspension boards. In each suspension board, lines are formed on a conductive support substrate with a base insulating layer sandwiched therebetween. The support substrate and the line are electrically connected by a via in the base insulating layer. In each inspection substrate, a conductor layer is formed on a conductive support substrate with a base insulating layer sandwiched therebetween. The support substrate and the conductor layer are electrically connected by a via in the base insulating layer.Type: GrantFiled: December 10, 2014Date of Patent: May 9, 2017Assignee: NITTO DENKO CORPORATIONInventors: Kouji Ichinose, Terukazu Ihara
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Patent number: 9295156Abstract: A wired circuit board includes a metal supporting layer, a first insulating layer, a conductive pattern, and a second insulating layer. The first and second insulating layers include first and second openings which expose both surfaces of the conductive pattern. The conductive pattern has the surface on the other side thereof in a thickness direction which is exposed through the first opening and configured as a first terminal portion, and the surface on one side thereof in the thickness direction which is exposed through the second opening and configured as a second terminal portion. The metal supporting layer includes a third opening which exposes the first terminal portion and a covering portion of the first insulating layer which covers the conductive pattern continued to the first terminal portion, and a reinforcing portion located on a surface on the other side of the covering portion in the thickness direction.Type: GrantFiled: May 21, 2014Date of Patent: March 22, 2016Assignee: NITTO DENKO CORPORATIONInventors: Kouji Ichinose, Jun Ishii, Yoshito Fujimura
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Publication number: 20150181695Abstract: A plurality of suspension boards are integrally supported by a support frame. A plurality of inspection substrates are provided to correspond to the plurality of suspension boards. In each suspension board, lines are formed on a conductive support substrate with a base insulating layer sandwiched therebetween. The support substrate and the line are electrically connected by a via in the base insulating layer. In each inspection substrate, a conductor layer is formed on a conductive support substrate with a base insulating layer sandwiched therebetween. The support substrate and the conductor layer are electrically connected by a via in the base insulating layer.Type: ApplicationFiled: December 10, 2014Publication date: June 25, 2015Inventors: Kouji ICHINOSE, Terukazu IHARA
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Publication number: 20150059162Abstract: First and second measurement probes come into contact with first and second electrode pads, respectively, and third and fourth measurement probes come into contact with the first and second electrode pads, respectively. A current flows in a current path including the first and second electrode pads and a plurality of lines through the first and second measurement probes. A value of the current in the current path is measured, and a value of a voltage between the third and fourth measurement probes is measured. Conductivity between the first and second electrode pads is inspected based on the measured value of the current and the measured value of the voltage.Type: ApplicationFiled: September 4, 2014Publication date: March 5, 2015Inventors: Terukazu IHARA, Kouji ICHINOSE
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Publication number: 20140353007Abstract: A wired circuit board includes a metal supporting layer, a first insulating layer, a conductive pattern, and a second insulating layer. The first and second insulating layers include first and second openings which expose both surfaces of the conductive pattern. The conductive pattern has the surface on the other side thereof in a thickness direction which is exposed through the first opening and configured as a first terminal portion, and the surface on one side thereof in the thickness direction which is exposed through the second opening and configured as a second terminal portion. The metal supporting layer includes a third opening which exposes the first terminal portion and a covering portion of the first insulating layer which covers the conductive pattern continued to the first terminal portion, and a reinforcing portion located on a surface on the other side of the covering portion in the thickness direction.Type: ApplicationFiled: May 21, 2014Publication date: December 4, 2014Applicant: NITTO DENKO CORPORATIONInventors: Kouji ICHINOSE, Jun ISHII, Yoshito FUJIMURA
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Patent number: 8658903Abstract: A wired circuit board includes an insulating base layer, a conductive pattern that is laminated on the insulating base layer, and an insulating cover layer that is laminated on the insulating base layer so as to cover the conductive pattern. The conductive pattern includes, when projected in a laminating direction of the insulating base layer, the conductive pattern, and the insulating cover layer, a terminal portion that is exposed from the insulating base layer and the insulating cover layer. The terminal portion includes an exposed surface that is exposed toward an external terminal side. A protruded portion that protrudes toward the contact direction with the external terminal is formed on the exposed surface.Type: GrantFiled: October 17, 2011Date of Patent: February 25, 2014Assignee: Nitto Denko CorporationInventors: Katsutoshi Kamei, Kouji Ichinose, Yuu Sugimoto
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Publication number: 20120111608Abstract: A wired circuit board includes an insulating base layer, a conductive pattern that is laminated on the insulating base layer, and an insulating cover layer that is laminated on the insulating base layer so as to cover the conductive pattern. The conductive pattern includes, when projected in a laminating direction of the insulating base layer, the conductive pattern, and the insulating cover layer, a terminal portion that is exposed from the insulating base layer and the insulating cover layer. The terminal portion includes an exposed surface that is exposed toward an external terminal side. A protruded portion that protrudes toward the contact direction with the external terminal is formed on the exposed surface.Type: ApplicationFiled: October 17, 2011Publication date: May 10, 2012Applicant: NITTO DENKO CORPORATIONInventors: Katsutoshi Kamei, Kouji Ichinose, Yuu Sugimoto