Abstract: A semiconductor substrate is bonded to a glass board in a peripheral portion of the semiconductor substrate by an adhesive layer. A hollow region is formed in a portion surrounded by the semiconductor substrate, the glass board, and the adhesive layer. In the hollow region, reinforcing adhesive layers are formed on a back surface of the semiconductor substrate and at positions corresponding to bumps provided at regular intervals. The reinforcing adhesive layers allow the semiconductor substrate to have strength withstanding to a load of a testing probe.

Abstract: An optical pick-up apparatus includes: a semiconductor laser light source that generates an optical beam; a diffraction grating that divides the optical beam into a main beam and side beams; an optical element that guides the main beam and the side beams that are generated by the diffraction grating onto an optical information medium; and a photodetector that detects a signal from reflected light reflected from the optical information medium. The semiconductor laser light source is configured with a 2-wavelength semiconductor laser device in which a semiconductor laser chip that generates an optical beam having a wavelength of ?1 and a semiconductor laser chip that generates an optical beam having a wavelength of ?2 are integrated into one chip or are arranged in proximity to each other.

Abstract: An optical pick-up apparatus includes: a semiconductor laser light source that generates an optical beam; a diffraction grating that divides the optical beam into a main beam and side beams; an optical element that guides the main beam and the side beams that are generated by the diffraction grating onto an optical information medium; and a photodetector that detects a signal from reflected light reflected from the optical information medium. The semiconductor laser light source is configured with a 2-wavelength semiconductor laser device in which a semiconductor laser chip that generates an optical beam having a wavelength of &lgr;1 and a semiconductor laser chip that generates an optical beam having a wavelength of &lgr;2 are integrated into one chip or are arranged in proximity to each other.