Abstract: A laser processing method according to a viewpoint of the present disclosure includes radiating ultraviolet pulse laser light onto a workpiece having a stacked structure in which a conductor layer, an insulating layer, and a sacrificial layer are stacked on each other in the presented order, the pulse laser light radiated from the side facing the sacrificial layer, to change a laser ablation processing mode in the sacrificial layer and form a through hole in the sacrificial layer, radiating the pulse laser light onto the insulating layer through the through hole to form an opening in the insulating layer, and removing the sacrificial layer after the formation of the opening.

Abstract: A laser device according to an aspect of the present disclosure includes a chamber into which laser gas is introduced; a pair of electrodes arranged in the chamber; a power source configured to apply a voltage between the electrodes; a nozzle structure which includes an internal passage for receiving the laser gas and a slit connected to the internal passage and is configured to generate flow of the laser gas between the electrodes due to the laser gas blowing out from the slit; a gas flow path which has a suction port through which the laser gas in the chamber is suctioned and introduces, to the nozzle structure, the laser gas suctioned through the suction port; and a blower device configured to cause the laser gas to blow toward the internal passage of the nozzle structure through the gas flow path.

Abstract: A laser apparatus includes: (A) a solid-state laser apparatus that outputs burst seed pulsed light containing a plurality of pulses; (B) an excimer amplifier that amplifies the burst seed pulsed light in a discharge space in a single occurrence of discharge and outputs the amplified light as amplified burst pulsed light; (C) an energy sensor that measures the energy of the amplified burst pulsed light; and (D) a laser controller that corrects the timing at which the solid-state laser apparatus is caused to output the burst seed pulsed light based on the relationship of the difference between the timing at which the solid-state laser apparatus outputs the burst seed pulsed light and the timing at which the discharge occurs in the discharge space with a measured value of the energy.

Abstract: A laser processing system includes: a wavelength-variable laser device configured to output each of a laser beam at an absorption line as a wavelength at which light is absorbed by oxygen and a laser beam at a non-absorption line as a wavelength at which the amount of light absorption by oxygen is smaller than at the absorption line; an optical system configured to irradiate a workpiece with the laser beam; and a laser control unit configured to control the wavelength-variable laser device, set the wavelength of the laser beam output from the wavelength-variable laser device to be the non-absorption line when laser processing is performed on the surface of the workpiece in gas containing oxygen, and set the wavelength of the laser beam output from the wavelength-variable laser device to be the absorption line when ozone cleaning is performed on the surface of the workpiece in gas containing oxygen.

Abstract: A laser system includes A. a laser apparatus configured to output pulsed laser light; B. a rare gas chamber; C. a light focusing optical system configured to focus the pulsed laser light in the rare gas chamber to excite the rare gas; D. a filter chamber configured to selectively transmit EUV light contained in harmonic light produced in the rare gas chamber; E. an exhauster connected to the filter chamber; F. at least one through hole disposed in the optical path between the rare gas chamber and the filter chamber; G. a rare gas supplier; H. a flow rate control valve configured to control the flow rate of the rare gas flowing from the rare gas supplier into the rare gas chamber; I. a first pressure sensor configured to detect the pressure of the rare gas in the rare gas chamber; J. a first controller configured to control the flow rate control valve in such a way that the pressure detected with the first pressure sensor falls within a reference range; and K.

Abstract: A laser system includes A. a laser apparatus configured to output pulsed laser light; B. a rare gas chamber; C. a light focusing optical system configured to focus the pulsed laser light in the rare gas chamber to excite the rare gas; D. a filter chamber configured to selectively transmit EUV light contained in harmonic light produced in the rare gas chamber; E. an exhauster connected to the filter chamber; F. at least one through hole disposed in the optical path between the rare gas chamber and the filter chamber; G. a rare gas supplier; H. a flow rate control valve configured to control the flow rate of the rare gas flowing from the rare gas supplier into the rare gas chamber; I. a first pressure sensor configured to detect the pressure of the rare gas in the rare gas chamber; J. a first controller configured to control the flow rate control valve in such a way that the pressure detected with the first pressure sensor falls within a reference range; and K.

Abstract: A laser processing method of performing laser processing on a transparent material that is transparent to ultraviolet light includes: A. a positioning step of performing positioning so that a transfer position of a transfer image is set at a position inside the transparent material at a predetermined depth ?Zsf from a surface of the transparent material in an optical axis direction; B. an irradiation condition acquisition step; C. a determination step of determining whether a maximum fluence of a pulse laser beam at the surface of the transparent material is within a predetermined range based on irradiation conditions; and D. a control step of allowing irradiation with the pulse laser beam when the maximum fluence is determined to be in the predetermined range.

Abstract: A laser processing system includes a wavelength tunable laser apparatus capable of changing the wavelength of pulsed laser light to be outputted, an optical system irradiating a workpiece with the pulsed laser light, a reference wavelength acquisition section acquiring a reference wavelength corresponding to photon absorption according to the material of the workpiece, a laser processing controller controlling the wavelength tunable laser apparatus to perform preprocessing before final processing performed on the workpiece, changes the wavelength of the pulsed laser light over a predetermined range containing the reference wavelength, and performs wavelength search preprocessing at a plurality of wavelengths, a processed state measurer measuring a processed state on a wavelength basis achieved by the wavelength search preprocessing performed at the plurality of wavelengths, and an optimum wavelength determination section assessing the processed state on a wavelength basis to determine an optimum wavelength us

Abstract: A laser exposure system may include a plurality of laser devices configured to output laser beams with which an irradiated subject is irradiated, and at least one beam property adjustment unit disposed on optical paths of the laser beams outputted from the plurality of laser devices, and configured to allow beam properties of the laser beams to be approximately a same as each other.

Abstract: A laser processing system includes: a wavelength-variable laser device configured to output each of a laser beam at an absorption line as a wavelength at which light is absorbed by oxygen and a laser beam at a non-absorption line as a wavelength at which the amount of light absorption by oxygen is smaller than at the absorption line; an optical system configured to irradiate a workpiece with the laser beam; and a laser control unit configured to control the wavelength-variable laser device, set the wavelength of the laser beam output from the wavelength-variable laser device to be the non-absorption line when laser processing is performed on the surface of the workpiece in gas containing oxygen, and set the wavelength of the laser beam output from the wavelength-variable laser device to be the absorption line when ozone cleaning is performed on the surface of the workpiece in gas containing oxygen.

Abstract: A laser processing system includes a wavelength tunable laser apparatus capable of changing the wavelength of pulsed laser light to be outputted, an optical system irradiating a workpiece with the pulsed laser light, a reference wavelength acquisition section acquiring a reference wavelength corresponding to photon absorption according to the material of the workpiece, a laser processing controller controlling the wavelength tunable laser apparatus to perform preprocessing before final processing performed on the workpiece, changes the wavelength of the pulsed laser light over a predetermined range containing the reference wavelength, and performs wavelength search preprocessing at a plurality of wavelengths, a processed state measurer measuring a processed state on a wavelength basis achieved by the wavelength search preprocessing performed at the plurality of wavelengths, and an optimum wavelength determination section assessing the processed state on a wavelength basis to determine an optimum wavelength us

Abstract: A laser apparatus includes: (A) a solid-state laser apparatus that outputs burst seed pulsed light containing a plurality of pulses; (B) an excimer amplifier that amplifies the burst seed pulsed light in a discharge space in a single occurrence of discharge and outputs the amplified light as amplified burst pulsed light; (C) an energy sensor that measures the energy of the amplified burst pulsed light; and (D) a laser controller that corrects the timing at which the solid-state laser apparatus is caused to output the burst seed pulsed light based on the relationship of the difference between the timing at which the solid-state laser apparatus outputs the burst seed pulsed light and the timing at which the discharge occurs in the discharge space with a measured value of the energy.

Abstract: A system includes a chamber, a laser beam apparatus configured to generate a laser beam to be introduced into the chamber, a laser controller for the laser beam apparatus to control at least a beam intensity and an output timing of the laser beam, and a target supply unit configured to supply a target material into the chamber, the target material being irradiated with the laser beam for generating extreme ultraviolet light.

Abstract: A system includes a chamber, a laser beam apparatus configured to generate a laser beam to be introduced into the chamber, a laser controller for the laser beam apparatus to control at least a beam intensity and an output timing of the laser beam, and a target supply unit configured to supply a target material into the chamber, the target material being irradiated with the laser beam for generating extreme ultraviolet light.

Abstract: A system includes a chamber, a laser beam apparatus configured to generate a laser beam to be introduced into the chamber, a laser controller for the laser beam apparatus to control at least a beam intensity and an output timing of the laser beam, and a target supply unit configured to supply a target material into the chamber, the target material being irradiated with the laser beam for generating extreme ultraviolet light.

Abstract: A system includes a chamber, a laser beam apparatus configured to generate a laser beam to be introduced into the chamber, a laser controller for the laser beam apparatus to control at least a beam intensity and an output timing of the laser beam, and a target supply unit configured to supply a target material into the chamber, the target material being irradiated with the laser beam for generating extreme ultraviolet light.

Abstract: The excimer laser apparatus may include a laser chamber configured to contain gas, a pair of electrodes provided in the laser chamber, a power source unit configured to supply a pulse voltage between the pair of electrodes, a gas supply unit configured to supply gas into the laser chamber, a gas exhaust unit configured to partially exhaust gas from within the laser chamber, and a gas control unit configured to control the gas supply unit and the gas exhaust unit, where a replacement ratio of gas to be replaced from within the laser chamber increases as deterioration of the pair of electrodes progresses, the deterioration being represented by a deterioration parameter of the pair of electrodes.

Abstract: A system includes a chamber, a laser beam apparatus configured to generate a laser beam to be introduced into the chamber, a laser controller for the laser beam apparatus to control at least a beam intensity and an output timing of the laser beam, and a target supply unit configured to supply a target material into the chamber, the target material being irradiated with the laser beam for generating extreme ultraviolet light.

Abstract: The excimer laser device receives data on a target value of pulse energy from an external device and outputs a pulse laser beam. The excimer laser device includes a master oscillator, at least one power amplifier including a chamber provided in an optical path of the pulse laser beam outputted from the master oscillator, a pair of electrodes provided in the chamber, and an electric power source configured to apply voltage to the pair of electrodes, and a controller configured to control the electric power source of one power amplifier of the at least one power amplifier to stop applying the voltage to the pair of electrodes based on the target value of the pulse energy.

Abstract: A gas laser device may include: a laser chamber containing laser gas; a first discharge electrode disposed in the laser chamber; a second discharge electrode disposed to face the first discharge electrode in the laser chamber; and a condenser including a polyimide dielectric and configured to supply power to between the first discharge electrode and the second discharge electrode.