Abstract: A path planning device configured to plan a traveling path on a future route of a vehicle includes a lane evaluation unit, a score accumulation unit, and a lane selection unit. The lane evaluation unit is configured to estimate a risk score of each chronological section of each traveling lane parallel traveling lanes, the risk score representing a traveling risk. The score accumulation unit is configured to accumulate the risk scores for each traveling lane. The lane selection unit is configured to select the traveling lane for the traveling path based on evaluation accumulated values. The lane evaluation unit is configured to estimate a base score based on static information. The static information contains a traveling difficulty for the vehicle at a change node. The lane evaluation unit is configured to estimate the base score such that the traveling risk is higher as the traveling difficulty is higher.

Abstract: A trajectory generation device configured to generate a branch trajectory as a trajectory of a first vehicle traveling from a main lane to a branch lane includes a determination unit and an adjustment unit. The determination unit is configured to determine whether a second vehicle different from the first vehicle is present in the branch lane. The adjustment unit is configured to adjust a sharpness of the branch trajectory based. The branch trajectory in a scene where it is determined that the second vehicle is present in the branch lane is a branch following trajectory. The branch trajectory in a scene where it is determined that the second vehicle is not present in the branch lane is a branch release trajectory. The branch release trajectory guides the first vehicle to the branch lane less sharply than the branch following trajectory.

Abstract: A method includes the step of receiving traffic signal display information from a traffic control unit controlling a display of a traffic signal located near an intersection when a vehicle is driving toward the intersection. The traffic signal display information includes a current display state of the traffic signal and information indicating a remaining time for which the current display state of the traffic signal will continues. The method further includes the step of acquiring traffic signal recognition information when the vehicle is driving toward the intersection. The traffic signal recognition information is recognized by a traffic signal detector mounted on the vehicle and indicating a current display of the traffic signal. The method further includes the step of controlling driving of the vehicle when the vehicle enters the intersection based on the traffic signal display information and the traffic signal recognition information.

Abstract: A method includes the step of receiving traffic signal display information from a traffic control unit controlling a display of a traffic signal located near an intersection when a vehicle is driving toward the intersection. The traffic signal display information includes a current display state of the traffic signal and information indicating a remaining time for which the current display state of the traffic signal will continues. The method further includes the step of acquiring traffic signal recognition information when the vehicle is driving toward the intersection. The traffic signal recognition information is recognized by a traffic signal detector mounted on the vehicle and indicating a current display of the traffic signal. The method further includes the step of controlling driving of the vehicle when the vehicle enters the intersection based on the traffic signal display information and the traffic signal recognition information.

Abstract: A laminated filter includes: a first dielectric layer having a first shield electrode on one principal plane; a second dielectric layer having resonator electrodes on one principal plane; a third dielectric layer having a coupling electrode provided facing part of the above-described resonator electrodes; a fourth dielectric layer having a second shield electrode on one principal plane; a fifth dielectric layer whose at least one principal plane is exposed outside; and a grounding electrode provided on the other principal plane of the above-described dielectric layer and/or the above-described one principal plane of the above-described fifth dielectric layer, and the above-described first grounding electrode and the above-described first shield electrode are electrically connected through a via hole provided in the above-described first dielectric layer.

Abstract: A laminated filter includes: a first dielectric layer 2101a having a first shield electrode on one principal plane; a second dielectric layer 2101b having resonator electrodes on one principal plane; a third dielectric layer 2101c having a coupling electrode provided facing part of the above-described resonator electrodes; a fourth dielectric layer 2101d having a second shield electrode on one principal plane; a fifth dielectric layer 2101d whose at least one principal plane is exposed outside; and a grounding electrode 2108 provided on the other principal plane of the above-described dielectric layer and/or the above-described one principal plane of the above-described fifth dielectric layer, and the above-described first grounding electrode and the above-described first shield electrode are electrically connected through a via hole 2109 provided in the above-described first dielectric layer.

Abstract: A printed circuit board includes an uncured substrate material with closed voids which are disposed with a through-hole. When the through-hole is formed, voids which exist in the substrate material open from inner wall of the through-hole to form a hollow-shaped part. By filling the through-hole and the hollow-shaped part with conductive paste, the adhesion improves by the increased holding effect between the conductive paste and the wall surface of the through-hole.

Abstract: To provide a flat ceramic sintered body without warp and waviness, and a method of producing the same.

Abstract: A connecting member of circuit substrates includes an organic porous base material provided with tackfree films on both sides, through-holes disposed at requested places which are filled with conductive resin compound up to the surface of the tackfree films. This structure enables inner-via-hole connection and can therefore attain a connecting member of circuit substrates and an electrical connector of high reliability and high quality.

Abstract: A printed circuit board includes an uncured substrate material with closed voids which are disposed with a through-hole. When the through-hole is formed, voids which exist in the substrate material open from inner wall of the through-hole to form a hollow-shaped part. By filling the through-hole and the hollow-shaped part with conductive paste, the adhesion improves by the increased holding effect between the conductive paste and the wall surface of the through-hole.

Abstract: An acceleration sensor has a piezoelectric element which includes a piezoelectric member layer in which a plurality of piezoelectric members are stacked and electrodes which are disposed in major opposed surfaces of the piezoelectric member layer; and a support member for supporting the piezoelectric element, wherein some piezoelectric members of the piezoelectric member layer are polarized. The electrodes are disposed in both surfaces of the polarized piezoelectric members. Capacitors which are formed by the polarized piezoelectric members and the electrodes in both surfaces of the polarized piezoelectric members are connected parallel to each other.

Abstract: The drive section made by bonding the piezoelectric material on part of the elastic shim and the displacement amplifying section which amplifies the amplitude of vibration vibrated in the drive section are provided in the same plane. The device is driven at drive frequencies in a region between the resonance frequency of the drive section and the resonance frequency of the displacement amplifying section.

Abstract: A printed circuit board includes an uncured substrate material with closed voids which are disposed with a through-hole. When the through-hole is formed, voids which exist in the substrate material open from inner wall of the through-hole to form a hollow-shaped part. By filling the through-hole and the hollow-shaped part with conductive paste, the adhesion improves by the increased holding effect between the conductive paste and the wall surface of the through-hole.

Abstract: A laminated ceramic device formed by laminating ceramics and conductive metals having a conductor section at a part of at least one of its upper and lower surfaces, in which the difference in level between the conductor section and the section other than the conductor section is smaller than the thickness of the conductor section. Consequently, even in the case of arranging the pattern conductors on both the upper and the lower surfaces of the device, a laminated ceramic device can be obtained in which pattern conductors can be arranged with high accuracy at low cost, no special care is required in the case of polishing, and the thickness accuracy and the bond strength of electrodes are high.

Abstract: A connecting member of circuit substrates includes an organic porous base material provided with tackfree films on both sides, through-holes disposed at requested places which are filled with conductive resin compound up to the surface of the tackfree films. This structure enables inner-via-hole connection and can therefore attain a connecting member of circuit substrates and an electrical connector of high reliability and high quality. By using a connecting member of circuit substrates including the organic porous base material provided with tackfree films on both sides and through-holes disposed at requested places which are filled with conductive resin compound up to the surface of the tackfree films, it is possible to form a high-multilayer substrate easily from double sided boards or four-layer substrates which can be manufactured rather stably.

Abstract: The invention related to a paste for via hole filling which enables inner via hole connection between electrode layers without employing through hole plating techniques, and a multi-layered printed circuit board using the same. The conductive paste composition of the invention comprises a) 70-90 wt % of copper particles of an average particle size of 0.5-8 .mu.m; b) 0.5-15 wt % of insulating particles of an average particle size of 8-20 .mu.m; and, c) 6-17 wt % of heat setting type liquid epoxy resin, in order to exhibit low viscosity and low volatility. The conductive paste is printed and filled into through holes passing through a laminated substrate which is provide with copper foils on both sides thereof, to form a printed circuit board in which the via holes are electrically connected after thermosetting.

Abstract: An acceleration sensor has a piezoelectric element which includes a piezoelectric member layer in which a plurality of piezoelectric members are stacked and electrodes which are disposed in major opposed surfaces of the piezoelectric member layer; and a support member for supporting the piezoelectric element, wherein some piezoelectric members of the piezoelectric member layer are polarized, the electrodes are disposed in the both surfaces of the polarized piezoelectric members, capacitors which are formed by the polarized piezoelectric members and the electrodes in the both surfaces of the polarized piezoelectric members are connected parallel to each other.

Abstract: A conductive paste compound for via hole filling includes a conductive filler at 80 to 92 weight percent with an average particle size of from 0.5 to 20 .mu.m and specific surface of from 0.1 to 1.5 m.sup.2 /g, a liquid epoxy resin at 4.5 to 20 weight percent containing 2 or more epoxy groups with room temperature viscosity of 15 Pa.sec or less, and a hardener at 0.5 to 5 weight percent, wherein the viscosity is 2,000 Pa.sec or less and the volatile amount is 2.0 weight percent or less. A filling paste and a printed circuit board with use thereof are provided which can conduct an inner-via-hole connection between electrode layers without using a through-hole plating technique.The conductive paste comprises a metallic particle such as copper, an epoxy resin, a hardener, and if necessary, a dispersant. The paste having low viscosity and low volatility under high shear is used to fill holes disposed in a laminated substrate.

Abstract: A printed circuit board includes an uncured substrate material with closed voids which are disposed with a through-hole. When the through-hole is formed, voids which exist in the substrate material open from inner wall of the through-hole to form a hollow-shaped part. By filling the through-hole and the hollow-shaped part with conductive paste, the adhesion improves by the increased holding effect between the conductive paste and the wall surface of the through-hole.

Abstract: The present invention provides a printed circuit board in which electrode layers can electrically be connected by an inner-through-hole connection, the coefficient of thermal expansion of the board is equal to that of a semiconductor, high thermal conductivity can be obtained and wiring can be formed at a high density. A cover film is laminated on both surfaces of a resin impregnated fabric sheet, holes are formed by laser beams in the direction of the thickness of the sheet and cover film, an electrically conductive paste that contains the electrically conductive particles and a thermosetting resin is filled in the holes. The cover film is removed, a copper foil is placed on both sides of the sheet, and pressed and heated, and the resin component of the sheet and that of the electrically conductive paste are hardened.