Patents by Inventor Kouji Kishita

Kouji Kishita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090014162
    Abstract: A counter-stream-mode oscillating-flow heat transport apparatus improves heat transport capability by imparting oscillatory displacement to a fluid located near a heat-generating element such that the fluid is directed toward the heat-generating element. Turning portions of serpentine flow paths are disposed to face the heat-generating element. The flow paths are stacked in multiple layers in the direction from the heat-generating element to the flow paths, and a plurality of flow paths are disposed adjacent to the heat-generating element in the direction of fluid oscillation.
    Type: Application
    Filed: September 8, 2008
    Publication date: January 15, 2009
    Inventors: Kenichi Nara, Yasumasa Hagiwara, Kimio Kohara, Shinichi Yatsuzuka, Seiji Inoue, Akito Akimoto, Makoto Sugiura, Kouji Kishita, Nobunao Suzuki
  • Publication number: 20040035555
    Abstract: A counter-stream-mode oscillating-flow heat transport apparatus improves heat transport capability by imparting oscillatory displacement to a fluid located near a heat-generating element such that the fluid is directed toward the heat-generating element. Turning portions of serpentine flow paths are disposed to face the heat-generating element. The flow paths are stacked in multiple layers in the direction from the heat-generating element to the flow paths, and a plurality of flow paths are disposed adjacent to the heat-generating element in the direction of fluid oscillation.
    Type: Application
    Filed: August 5, 2003
    Publication date: February 26, 2004
    Inventors: Kenichi Nara, Yasumasa Hagiwara, Kimio Kohara, Shinichi Yatsuzuka, Seiji Inoue, Akito Akimoto, Makoto Sugiura, Kouji Kishita, Nobunao Suzuki
  • Patent number: 6131647
    Abstract: In a cooling system to cool down a hot object contained in a closed container, a heat exchanger is used in addition to an air-conditioner to share thermal load to dissipate heat generated by the hot object. Since the heat exchanger which requires almost no operating power shares heat load with the air-conditioner which consumes a high operating power, a total power consumption of the cooling system is considerably reduced. An evaporator and a condenser of the heat exchanger are separately installed in the cooling system, and both are connected by pipes through which refrigerant is circulated. The evaporator is placed to an optimum position to effectively absorb heat generated by the hot object. The condenser is installed outside the container to exhaust heat most effectively to outside air. The evaporator and the condenser may be combined before installation, if a whole structure of the cooling system permits.
    Type: Grant
    Filed: August 26, 1998
    Date of Patent: October 17, 2000
    Assignee: DENSO Corporation
    Inventors: Yukinori Suzuki, Tetsuya Takeuchi, Kouji Kishita
  • Patent number: 6039111
    Abstract: A cooling device includes: a partition plate for partitioning an interior of a case into a first fluid passage through which first fluid having a high temperature flows and a second fluid passage through which second fluid having a low temperature flows; a heat receiving portion disposed in the first fluid passage; a heat radiating portion disposed in the second fluid passage; and a connection pipe for communicating the heat receiving portion and the heat radiating portion. The heat radiating portion is disposed at an upper side of the heat receiving portion in such a manner that the second fluid from a front side of the heat radiating portion flows into a rear side of the heat radiating portion through a pipe space between the heat radiating portion and the heat receiving portion, and further passes through the heat radiating portion from the rear side toward the front side of the heat radiating portion. Thus, the cooling device has a small size while improving the cooling capacity of the cooling device.
    Type: Grant
    Filed: February 16, 1998
    Date of Patent: March 21, 2000
    Assignee: Denso Corporation
    Inventors: Kiyoshi Kawaguchi, Shigeru Kadota, Kouji Kishita