Abstract: An object of the present invention is to provide an electrical connection box in which reduction in weight can be achieved by simplification of the construction, while preventing short-circuiting of a positive electrode side busbar and a negative electrode side busbar. An electrical connection box includes: a positive electrode side busbar connected to a positive electrode of a battery; a negative electrode side busbar connected to a negative electrode of the battery; and a case in which the positive electrode side busbar and the negative electrode side busbar are accommodated. The case includes: a bottom wall; a circumferential wall erected from the bottom wall; and a partition wall erected from the bottom wall. The partition wall is a waterproof partition that partitions a positive electrode side busbar accommodating area and a negative electrode side busbar accommodating area.

Abstract: An object of the present invention is to provide an electrical connection box in which reduction in weight can be achieved by simplification of the construction, while preventing short-circuiting of a positive electrode side busbar and a negative electrode side busbar. An electrical connection box includes: a positive electrode side busbar connected to a positive electrode of a battery; a negative electrode side busbar connected to a negative electrode of the battery; and a case in which the positive electrode side busbar and the negative electrode side busbar are accommodated. The case includes: a bottom wall; a circumferential wall erected from the bottom wall; and a partition wall erected from the bottom wall. The partition wall is a waterproof partition that partitions a positive electrode side busbar accommodating area and a negative electrode side busbar accommodating area.

Abstract: A service providing system for improving convenience of users by quickly executing a membership registration process in a system in which plural shops and groups jointly administrate its members. In the system, an external reading/writing unit stores a write data table in which provider-side data is correlated with information notification level, a portable information terminal enables the user to select the information notification level in accordance to a control of a portable terminal-side application and writes user-side data correlated with the information notification level selected by the user in the notification data table and the information notification level selected by the user to a non-contact IC. The external reading/writing unit reads the user-side data and the information notification level out of the non-contact IC, stores the user-side data and writes the provider-side data correlated with the information notification level in the write data table to the non-contact IC.

Abstract: A service providing system for improving convenience of users by quickly executing a membership registration process in a system in which plural shops and groups jointly administrate its members. In the system, an external reading/writing unit stores a write data table in which provider-side data is correlated with information notification level, a portable information terminal enables the user to select the information notification level in accordance to a control of a portable terminal-side application and writes user-side data correlated with the information notification level selected by the user in the notification data table and the information notification level selected by the user to a non-contact IC. The external reading/writing unit reads the user-side data and the information notification level out of the non-contact IC, stores the user-side data and writes the provider-side data correlated with the information notification level in the write data table to the non-contact IC.

Abstract: A method for manufacturing a semiconductor device including providing first and second semiconductor chips each having a main surface having a semiconductor element and a plurality of external terminals, and a lower surface respectively opposing the main surface. A first lead frame is provided which has a frame body which supports outer portions and inner portions extending from the outer portions, and a second lead frame is provided which has a frame body which supports outer portions and inner portions extending from the outer portions. After electrically connecting the external terminals to the inner portions of the lead frames and resin-sealing the first and second semiconductor chips so that the first and second lead frames are superimposed, the frame body of the second lead frame is removed and a first processing fluid is applied to the outer portions of the first lead frame and the second lead frame.

Abstract: A semiconductor device according to this invention, wherein two semiconductor chips are sealed by one resin body using two lead frames, includes a wide part extending in the width direction of dam bars, the width of one dam bar being narrower than the width of another dam bar, and the two lead frames are joined by welding outside the resin body after sealing them with resin.

Abstract: A semiconductor device according to this invention, wherein two semiconductor chips are sealed by one resin body using two lead frames, includes a wide part extending in the width direction of dam bars, the width of one dam bar being narrower than the width of another dam bar, and the two lead frames are joined by welding outside the resin body after sealing them with resin.

Abstract: A semiconductor device according to this invention, wherein two semiconductor chips are sealed by one resin body using two lead frames, comprises a wide part extending in the width direction of dam bars, the width of one dam bar being narrower than the width of another dam bar, and the two lead frames are joined by soldering outside the resin body after sealing them with resin.

Abstract: A semiconductor device according to this invention, wherein two semiconductor chips are sealed by one resin body using two lead frames, includes a wide part extending in the width direction of dam bars, the width of one dam bar being narrower than the width of another dam bar, and the two lead frames are joined by welding outside the resin body after sealing them with resin.

Abstract: A semiconductor device according to this invention, wherein two semiconductor chips are sealed by one resin body using two lead frames, comprises a wide part extending in the width direction of dam bars, the width of one dam bar being narrower than the width of another dam bar, and the two lead frames are joined by soldering outside the resin body after sealing them with resin.