Abstract: Provided is a pressure-sensitive adhesive sheet for protecting a semiconductor element that appropriately protects a semiconductor wafer without reducing a yield. The pressure-sensitive adhesive sheet for protecting a semiconductor element includes: a pressure-sensitive adhesive layer; and a base material. The pressure-sensitive adhesive layer has a surface resistivity of 1.0×1011?/? or less. After the pressure-sensitive adhesive layer and a silicon wafer have been bonded to each other, and have been left at rest at 50° C. for 24 hours, and the pressure-sensitive adhesive sheet has been peeled from the silicon wafer, a halogen element ratio with respect to a total element content of a surface of the silicon wafer that was bonded to the pressure-sensitive adhesive layer is 0.3 atomic % or less.

Abstract: Provided is a pressure-sensitive adhesive tape for protecting a semiconductor that can satisfactorily fill an uneven surface and is prevented from an adhesive residue. The pressure-sensitive adhesive tape for protecting a semiconductor includes: a base material; a pressure-sensitive adhesive layer arranged on at least one side of the base material; and an intermediate layer arranged between the base material and the pressure-sensitive adhesive layer, wherein a storage modulus of elasticity A (MPa) of the pressure-sensitive adhesive layer, a thickness B (?m) of the intermediate layer, a thickness C (?m) of the pressure-sensitive adhesive layer, and a tack value D (N) of the pressure-sensitive adhesive layer satisfy the formula A×(B/C)×D?20 (MPa·N).

Abstract: Provided is a pressure-sensitive adhesive tape having excellent pressure-sensitive adhesive strength to an adherend before ultraviolet (UV) irradiation and excellent peelability after UV irradiation. The pressure-sensitive adhesive tape includes: a pressure-sensitive adhesive layer containing a UV-curable pressure-sensitive adhesive and a photopolymerization initiator; an intermediate layer containing the photopolymerization initiator and being free from a UV-curable component; and a base material. When the intermediate layer contains the photopolymerization initiator, excellent peelability can be exhibited after UV irradiation.

Abstract: Provided is a pressure-sensitive adhesive tape for protecting a semiconductor that can satisfactorily fill an uneven surface and is prevented from an adhesive residue. The pressure-sensitive adhesive tape for protecting a semiconductor includes: a base material; a pressure-sensitive adhesive layer arranged on at least one side of the base material; and an intermediate layer arranged between the base material and the pressure-sensitive adhesive layer, wherein a storage modulus of elasticity A (MPa) of the pressure-sensitive adhesive layer, a thickness B (?m) of the intermediate layer, a thickness C (?m) of the pressure-sensitive adhesive layer, and a tack value D (N) of the pressure-sensitive adhesive layer satisfy the formula A×(B/C)×D?20 (MPa·N).

Abstract: A re-peelable adhesive sheet for grinding a semiconductor wafer comprises: a base film, and an adhesive layer laminated on the base film, the re-peelable adhesive sheet has a modulus of elasticity of at least 103 MPa, and a heating shrinkage factor of 1% or less, after heating for 10 minutes to 60° C., and the adhesive layer is set to a thickness at which the maximum point stress is 200 g/cm or less, at a pressing amount of 30 ?m from the adhesive layer side in a three-point bend test. The present invention can provide a re-peelable adhesive sheet that can reduce wafer warping, cracking, and edge chipping, that can improve the adhesive force in relation to temperature variations and/or reduce contamination of the adherend when re-peeling, and that can facilitate film re-peel.

Abstract: An adhesive sheet for supporting and protecting a semiconductor wafer has an intermediate layer and an adhesive layer formed on a one side of a base film in this order, the adhesive layer being made of a radiation curing type adhesive, and having a thickness of 1 to 50 ?m and a shear stress of 0.5 to 10 MPa, the intermediate layer having a thickness of 10 to 500 ?m and an elastic modulus of 0.01 to 3 MPa. The adhesive sheet of the present invention is useful in the broader application such as an adhesive sheet for affixing a wafer and for protecting a wafer, and the like in various steps of working the semiconductor wafers, that needs re-peelable.

Abstract: An adhesive sheet for supporting and protecting a semiconductor wafer has an adhesive layer formed on one side of a base film, the adhesive layer having a thickness of 4 to 42 ?m and an elastic modulus at 25° C. of 0.5 to 9 MPa. The adhesive sheet of the present invention is useful in the broader application such as an adhesive sheet for affixing a wafer and for protecting a wafer, and the like in various steps of working the semiconductor wafers, that needs re-peelable.

Abstract: As cams provided on platen-side attachments move from a lock-releasing position to a locking position while the ball-supporting members of the platen-side attachments remain inserted in the ball-receiving members of mold-side attachments, locking balls sliding in inclined-locking grooves are moved outward in a direction at right angles to the direction in which the cams move, and are set in engaging-locking grooves and abut on the curved parts of the engaging-locking grooves. Therefore, the mold-side attachments are closely attached and fixed to the platen-side attachments. As the cams move from the locking position to the lock-releasing position, the pushing balls sliding in inclined-pushing grooves are moved outward in a direction at right angles to the direction in which the cams move, and abut on the curved parts of the engaging-pushing grooves. In this case, the mold-side attachments can project from the platen-side attachments.

Abstract: Even if the coupling surface of an arm side attachment and a tool side attachment is directed in a direction other than the horizontal direction, the tool side attachment can be automatically separated and detached from the arm side attachment. When exchanging a tool, the worker does not have to forcibly pull out and detach a tool side attachment from an arm side attachment, a tool can be exchanged automatically, and the exchange work can be performed easily in a short period of time. When the cam member 17 is shifted from the unlocking position to the locking position, locking balls 13 which slide on locking inclined tapered surfaces 17a to be shifted to the outside along the radius direction are engaged with engaging inclined tapered surface 23a so as to mutually couple an arm side attachment 3 and a tool side attachment 5.

Abstract: As cams provided on platen-side attachments move from a lock-releasing position to a locking position while the ball-supporting members of the platen-side attachments remain inserted in the ball-receiving members of mold-side attachments, locking balls sliding in inclined-locking grooves are moved outward in a direction at right angles to the direction in which the cams move, and are set in engaging-locking grooves and abut on the curved parts of the engaging-locking grooves. Therefore, the mold-side attachments are closely attached and fixed to the platen-side attachments. As the cams move from the locking position to the lock-releasing position, the pushing balls sliding in inclined-pushing grooves are moved outward in a direction at right angles to the direction in which the cams move, and abut on the curved parts of the engaging-pushing grooves. In this case, the mold-side attachments can project from the platen-side attachments.

Abstract: Even if the coupling surface of an arm side attachment and a tool side attachment is directed in a direction other than the horizontal direction, the tool side attachment can be automatically separated and detached from the arm side attachment. When exchanging a tool, the worker does not have to forcibly pull out and detach a tool side attachment from an arm side attachment, a tool can be exchanged automatically, and the exchange work can be performed easily in a short period of time. When the cam member 17 is shifted from the unlocking position to the locking position, locking balls 13 which slide on locking inclined tapered surfaces 17a to be shifted to the outside along the radius direction are engaged with engaging inclined tapered surface 23a so as to mutually couple an arm side attachment 3 and a tool side attachment 5.

Abstract: An object of the present invention is to provide a recombinant LPA phosphatase capable of specifically hydrolyzing LPA, which is useful for elucidation of the metabolism pathway of LPA, and also for diagnosis and treatment of various diseases with which LPA is associated; a method capable of simply and inexpensively determining LPA associated with various diseases; and a kit for determination suitable for the method. The present invention has succeeded in purifying the LPA phosphatase using bovine brain as raw material, and further in cloning human LPA phosphatase gene.

Abstract: An object of the present invention is to provide a recombinant LPA phosphatase capable of specifically hydrolyzing LPA, which is useful for elucidation of the metabolism pathway of LPA, and also for diagnosis and treatment of various diseases with which LPA is associated; a method capable of simply and inexpensively determining LPA associated with various diseases; and a kit for determination suitable for the method. The present invention has succeeded in purifying the LPA phosphatase using bovine brain as a raw material, and further in cloning human LPA phosphatase gene.

Abstract: An object of the present invention is to provide a recombinant LPA phosphates capable of specifically hydrolyzing LPA, which is useful for elucidation of the metabolic pathway of LPA, and also for diagnosis and treatment of various diseases with which LPA is associated. The present invention also provides for a method capable of simply and inexpensively determining LPA associated with various diseases. The present invention also provides for a kit for determination suitable for the method. The present invention has succeeded in purifying the LPA phosphatase using bovine brain as a raw material, and further in cloning human LPA phosphatase gene.

Abstract: In the digital image-forming apparatus of the present invention, when, for example, a liquid crystal video camera is connected thereto as an external input device, display data related to the shape of the operation section of the liquid crystal video camera is read based upon recognition data so that the operation section of the liquid crystal video camera is displayed on a display device placed on one part of the operation panel of the digital image-forming apparatus. In the operation section, a monitor and key switches are displayed in the same manner as the actual operation section of the liquid crystal video camera connected to the digital image-forming apparatus, and the liquid video camera connected thereto is operated through operations on the key switches, and images, recorded in the liquid crystal video camera, are displayed on the monitor.

Abstract: In the digital image-forming apparatus of the present invention, when, for example, a liquid crystal video camera is connected thereto as an external input device, display data related to the shape of the operation section of the liquid crystal video camera is read based upon recognition data so that the operation section of the liquid crystal video camera is displayed on a display device placed on one part of the operation panel of the digital image-forming apparatus. In the operation section, a monitor and key switches are displayed in the same manner as the actual operation section of the liquid crystal video camera connected to the digital image-forming apparatus, and the liquid video camera connected thereto is operated through operations on the key switches, and images, recorded in the liquid crystal video camera, are displayed on the monitor.