Abstract: A wiring structure having a wiring-terminal-connection adhesive that includes a curing agent capable of generating a free radical upon heating, a radically polymerizable substance and silicone particles.

Abstract: This invention provides a wiring-terminal-connecting adhesive comprising a curing agent capable of generating a free radical upon heating, a radically polymerizable substance and silicone particles, and a wiring-terminal-connecting method and a wiring structure which make use of such an adhesive.

Abstract: The invention intends to provide an electronic component mounting adhesive that can inhibit cracks and peelings in an electronic component mounting structure obtained by joining electronic components each other from occurring and an electronic component mounting structure obtained by joining electronic components with such an electronic component mounting adhesive. In an electronic component mounting structure, a first circuit board and a second circuit board are bonded with an electronic component mounting adhesive. Here, the electronic component mounting adhesive is obtained by dispersing metal particles having the melting temperature Mp lower than the glass transition temperature Tg of a cured material of a thermosetting resin in the thermosetting resin.

Abstract: This invention provides a wiring-terminal-connecting adhesive comprising a curing agent capable of generating a free radical upon heating, a radically polymerizable substance and silicone particles, and a wiring-terminal-connecting method and a wiring structure which make use of such an adhesive.

Abstract: This invention provides a wiring-terminal-connecting adhesive comprising a curing agent capable of generating a free radical upon heating, a radically polymerizable substance and silicone particles, and a wiring-terminal-connecting method and a wiring structure which make use of such an adhesive.

Abstract: A wiring structure having a wiring-terminal-connection adhesive that includes a curing agent capable of generating a free radical upon heating, a radically polymerizable substance and silicone particles.

Abstract: The invention intends to provide an electronic component mounting adhesive that can inhibit cracks and peelings in an electronic component mounting structure obtained by joining electronic components each other from occurring and an electronic component mounting structure obtained by joining electronic components with such an electronic component mounting adhesive. In an electronic component mounting structure, a first circuit board and a second circuit board are bonded with an electronic component mounting adhesive. Here, the electronic component mounting adhesive is obtained by dispersing metal particles having the melting temperature Mp lower than the glass transition temperature Tg of a cured material of a thermosetting resin in the thermosetting resin.

Abstract: An object is to provide an electronic components mounting adhesive capable of lowering the probability of occurrence of short-circuiting and increasing the reliability of the joining of electrodes in an electronic components mounted structure obtained by bonding electronic components to each other, as well as a manufacturing method of such an electronic components mounting adhesive, a resulting electronic component mounted structure, and a manufacturing method of such an electronic component mounted structure. In an electronic components mounted structure 10, a first circuit board 11 and a second circuit board 13 are bonded to each other with an electronic components mounting adhesive 20. The electronic components mounting adhesive 20 is such that solder particles 22 are dispersed in a thermosetting resin 21. The solder particles 22 are subjected to heating treatment in an oxygen-containing atmosphere before being dispersed in the thermosetting resin 21.

Abstract: A wiring structure having a wiring-terminal-connection adhesive that includes a curing agent capable of generating a free radical upon heating, a radically polymerizable substance and silicone particles.

Abstract: This invention provides a wiring-terminal-connecting adhesive comprising a curing agent capable of generating a free radical upon heating, a radically polymerizable substance and silicone particles, and a wiring-terminal-connecting method and a wiring structure which make use of such an adhesive.

Abstract: This invention provides a wiring-terminal-connecting adhesive comprising a curing agent capable of generating a free radical upon heating, a radically polymerizable substance and silicone particles, and a wiring-terminal-connecting method and a wiring structure which make use of such an adhesive.

Abstract: This invention provides a wiring-terminal-connecting adhesive comprising a curing agent capable of generating a free radical upon heating, a radically polymerizable substance and silicone particles, and a wiring-terminal-connecting method and a wiring structure which make use of such an adhesive.

Abstract: This invention provides a wiring-terminal-connecting adhesive comprising a curing agent capable of generating a free radical upon heating, a radically polymerizable substance and silicone particles, and a wiring-terminal-connecting method and a wiring structure which make use of such an adhesive.