Abstract: Input and output nodes, an output circuit and a drive circuit are provided. The output circuit includes first and second n-channel MOS transistors connected to each other in series. A drain of the first n-channel MOS transistor is connected to a first line. A source of the first n-channel MOS transistor, a drain of the second n-channel MOS transistor, and a drain of a first p-channel MOS transistor are commonly connected to the output node. A source of the second n-channel MOS transistor is connected to a second line. A source of the first p-channel MOS transistor is connected to the first line. The drive circuit generates first to third control signals in response to an input signal provided to the input node. The control signals are respectively outputted to gates of the first and second n-channel MOS transistors and to a gate of the first p-channel MOS transistor.

Abstract: A multilayer wiring board 1 includes an insulating layer 2, a copper wiring upper layer 3 and a copper wiring lower layer 4 laminated on both surfaces of the insulating layer 2, a through hole 5 pierced through the insulating layer 2 and at least one of the copper wiring layers, and a solder conductor 6 which is filled in the through hole 5 and makes connection and electric continuity between the copper wiring upper layer 3 and the copper wiring lower layer 4, where solder exposed surfaces on which a part of the solder conductor 6 is in contact with the copper wiring upper layer 3 or the copper wiring lower layer 4 and exposed to the outermost surface, and the surfaces of the copper wiring upper layer 3 and the copper wiring lower layer 4 are coated and integrated by plating films 8, and the metal-made plating films 8 are made of a metal having an ionization tendency greater than that of the solder conductor 6.

Abstract: Provided is an FPC, which comprises an insulating layer 2, wiring layers 3 and 4 laminated above and under the insulating layer 2, and a layer connection for connecting the wiring layers 3 and 4 electrically. The layer connection is constituted to comprise: a conductor press-fit hole 5 of a cone shape extending through the insulating layer 2 and the upper and lower wiring layers 3 and 4 and expanded to the side of one wiring layer 3; and a conductor 6 filled and press-fitted without any clearance in the conductor press-fit hole such that it is jointed to the wiring upper layer 3 deformed into the cone shape of the conductor press-fit hole 5, and is protruded from the other wiring lower layer 4 to have its surface partially coated and jointed.

Abstract: To provide an interlayer-connected, multi-layer flexible printed circuit board having high bonding reliability and most suitable for micropatterning the circuit layers in the device; and to provide a high-productivity method for fabricating the device. A multi-layer flexible printed circuit board, wherein a conductor is filled in the through-holes formed in the insulating layer in the direction of the thickness thereof so as to electrically interconnect the circuit layers formed on both faces of the insulating layer, and wherein the conductor contains inside it, a copper-core solder ball having a copper ball as a core thereof.

Abstract: A multi-layered flexible print circuit board comprising an insulating layer, a circuit layer formed on the front and back surfaces of the insulating layer and a hole connecting between the circuit layers via the insulating layer, wherein there is provided an electrically-conductive member having a metal layer formed thereon at least on the surface thereof which is press-fitted into the hole to electrically conduct the circuit layer.

Abstract: Provided is an FPC, which comprises an insulating layer 2, wiring layers 3 and 4 laminated above and under the insulating layer 2, and a layer connection for connecting the wiring layers 3 and 4 electrically. The layer connection is constituted to comprise: a conductor press-fit hole 5 of a cone shape extending through the insulating layer 2 and the upper and lower wiring layers 3 and 4 and expanded to the side of one wiring layer 3; and a conductor 6 filled and press-fitted without any clearance in the conductor press-fit hole such that it is jointed to the wiring upper layer 3 deformed into the cone shape of the conductor press-fit hole 5, and is protruded from the other wiring lower layer 4 to have its surface partially coated and jointed.

Abstract: An interlayer connection conductor 1 is formed of a substantially spherical interlayer connector that is formed by forced in through holes 108, in a thickness direction, on a flexible printed circuit board having wiring layers 106, 107 on at leas one surface of an insulating layer The interlayer connection conductor includes a small cylindrical piece of metal core 102 formed by cutting a metal fine wire and a solder metal 103 coated around the surface of the metal core.

Abstract: The present invention is directed to a coin detection apparatus that is specially designed to avoid coins' sticking in a coin passage and that is capable of distributing an item to a customer only when a predetermined number of valid coins are paid. Coins (C) deposited by the customer are kept in a coin shoot (13). The coins (C) stand upright on a floor plate (20) that forms a part of the coin shoot (13). The floor plate (20) is urged by a spring member to protrude into the coin shoot (13). As a rotary disk (100) rotates, one end (119) of a recessed portion (120) defined in the rotary disk (100) leans on the floor plate (20) against elastic force of the spring member to make the floor plate (20) tilt. Subsequently, recessed edge of the rotary disk (100) continues to tilt the floor plate (20). As the other end 118 of the recessed portion (120) reaches the floor plate (20), the floor plate (20) is disengaged from the rotary disk (100).

Abstract: A multi-layered flexible print circuit board comprising an insulating layer, a circuit layer formed on the front and back surfaces of the insulating layer and a hole connecting between the circuit layers via the insulating layer, wherein there is provided an electrically-conductive member having a metal layer formed thereon at least on the surface thereof which is press-fitted into the hole to electrically conduct the circuit layer.

Abstract: To provide an interlayer-connected, multi-layer flexible printed circuit board having high bonding reliability and most suitable for micropatterning the circuit layers in the device; and to provide a high-productivity method for fabricating the device. A multi-layer flexible printed circuit board, wherein a conductor is filled in the through-holes formed in the insulating layer in the direction of the thickness thereof so as to electrically interconnect the circuit layers formed on both faces of the insulating layer, and wherein the conductor contains inside it, a copper-core solder ball having a copper ball as a core thereof.

Abstract: The present invention is directed to a coin detection apparatus that is specially designed to avoid coins' sticking in a coin passage and that is capable of distributing an item to a customer only when a predetermined number of valid coins are paid. Coins (C) deposited by the customer are kept in a coin shoot (13). The coins (C) stand upright on a floor plate (20) that forms a part of the coin shoot (13). The floor plate (20) is urged by a spring member to protrude into the coin shoot (13). As a rotary disk (100) rotates, one end (119) of a recessed portion (120) defined in the rotary disk (100) leans on the floor plate (20) against elastic force of the spring member to make the floor plate (20) tilt. Subsequently, recessed edge of the rotary disk (100) continues to tilt the floor plate (20). As the other end 118 of the recessed portion (120) reaches the floor plate (20), the floor plate (20) is disengaged from the rotary disk (100).

Abstract: A method for manufacturing a fine pattern includes steps of forming a master substrate having an electrode layer patterned to a predetermined shape, forming peel layers made of a conductive water-repellent thin film on the master substrate, forming the fine pattern made of the electrodeposit resin on the peel layers, impregnating the electrodeposit resin with water, and stripping the fine pattern off the master substrate and transferring the fine pattern on a bonding layer of the media substrate. A color filter and a shading pattern filter are manufactured by the method for manufacturing the fine pattern. The color LCD element includes plastic film substrates, a transparent pixel electrode, a liquid crystal material, and color filters. The color filters are pasted on the plastic film with a bonding film laid therebetween.

Abstract: A method for manufacturing a fine pattern is provided which method makes it possible to well reproducibly and completely strip and transfer the fine pattern, repetitively use a master substrate, and simply form a high-definition and high-density fine pattern with good massproductivity. Further, a color filter and a shading pattern filter are implemented by the fine pattern. A color LCD element with the color filter is provided which enables to output a well color-reproducibly high-quality image with no color or brightness evenness. Moreover, a color LCD element is provided which enables to continuously output a coloring function for a certain length of time after light from a light source or ambient light disappears and form a brighter and more vivid image.

Abstract: An expandable composition for non-crosslinked foam comprising:(a) 80 to 99% by weight of a 1-butene copolymer,(b) 20 to 1% by weight of an ethylene polymer, and(c) a blowing agent,the percentages being based on the total weight of the 1-butene copolymer and the ethylene polymer.

Abstract: A laminated structure comprising:(1) as a substrate, a non-crosslinked foam layer having an expansion ratio of 1.5 to 5 and composed of polybutene-1 or a blend of 100 parts by weight of polybutene-1 and up to 40 parts by weight of polyproylene and/or up to 30 parts by weight of polyethylene, and(2) laminated to one or both surfaces of the non-crosslinked foam layer, a film.

Abstract: A non-crosslinked foam of a composition comprising:(A) 72 to 98% by weight of a 1-butene polymer; and(B) 28 to 2% by weight of a propylene polymer, the percentages being based on the total weight of the 1-butene polymer and the propylene polymer.

Abstract: An expandable composition for non-crosslinked foam comprising:(a) 80 to 99% by weight of a 1-butene homopolymer,(b) 20 to 1% by weight of an ethylene polymer, and(c) a blowing agent,the percentages being based on the total weight of the 1-butene homopolymer and the ethylene polymer.

Abstract: A non-crosslinked foam of a composition comprising:(A) 72 to 98% by weight of a 1-butene polymer; and(B) 28 to 2% by weight of a propylene polymer, the percentages being based on the total weight of the 1-butene polymer and the propylene polymer.