Abstract: An information processing apparatus performs a first estimation process based on a data set including a combination of information indicating a situation and information on power consumption when a first air conditioner, installed in a predetermined location, has been operated. The first estimation process is a process of estimating information on power consumption when the first air conditioner, installed in the predetermined location, is operated in a predetermined situation.

Abstract: A ceramic circuit substrate having high bonding performance and excellent thermal cycling resistance properties, wherein a ceramic substrate and a copper plate are bonded by a braze material containing Ag and Cu, at least one active metal component selected from Ti and Zr, and at least one element selected from among In, Zn, Cd, and Sn, wherein a braze material layer, after bonding, has a continuity ratio of 80% or higher and a Vickers hardness of 60 to 85 Hv.

Abstract: A ceramic circuit substrate having high bonding performance and excellent thermal cycling resistance properties, having a circuit pattern provided on a ceramic substrate with a braze material layer interposed therebetween, and a protruding portion formed by the braze material layer protruding from the outer edge of the circuit pattern, wherein: the braze material layer includes Ag, Cu, Ti, and Sn or In; and an Ag-rich phase is formed continuously for 300 ?m or more, towards the inside, from an outer edge of the protruding portion, along a bonding interface between the ceramic substrate and the circuit pattern, and has a bonding void ratio of 1.0% or less.

Abstract: A ceramic circuit substrate and power module with excellent heat cycle resistance characteristics, which is formed by bonding a ceramic substrate and a copper plate via a brazing material including Ag, Cu, and an active metal, wherein the bond void fraction is no greater than 1.0% and the diffusion distance of the Ag, which is a brazing material component, is 5-20 ?m. Also, a method for manufacturing a ceramic circuit substrate characterized in that the heating time in a temperature range 400-700° C. in a process for raising the temperature to a bonding temperature is 5-30 minutes and bonding is performed by maintaining the bonding temperature at 720-800° C. for 5-30 minutes.

Abstract: A ceramic circuit substrate is suitable for silver nanoparticle bonding of semiconductor elements and has excellent close adhesiveness with a power module sealing resin. A ceramic circuit substrate has a copper plate bonded, by a braze material, to both main surfaces of a ceramic substrate including aluminum nitride or silicon nitride, the copper plate of at least one of the main surfaces being subjected to silver plating, wherein: the copper plate side surfaces are not subjected to silver plating; the thickness of the silver plating is 0.1 ?m to 1.5 ?m; and the arithmetic mean roughness Ra of the surface roughness of the circuit substrate after silver plating is 0.1 ?m to 1.5 ?m.

Abstract: A ceramic circuit substrate having a metal plate bonded, by a bonding braze material, to at least one main surface of a ceramic substrate, wherein the bonding braze material contains, as metal components, 0.5 to 4.0 parts by mass of at least one active metal selected from among titanium, zirconium, hafnium, and niobium, with respect to 100 parts by mass, in total, of 93.0 to 99.4 parts by mass of Ag, 0.1 to 5.0 parts by mass of Cu, and 0.5 to 2.0 parts by mass of Sn; and Cu-rich phases in a bonding braze material layer structure between the ceramic substrate and the metal plate have an average size of 3.5 ?m or less and a number density of 0.015/?m2 or higher. A method for producing a ceramic circuit substrate includes bonding at a temperature of 855 to 900° C. for a retention time of 10 to 60 minutes.

Abstract: A ceramic circuit substrate having a metal plate bonded, by a bonding braze material, to at least one main surface of a ceramic substrate, wherein the bonding braze material contains, as metal components, 0.5 to 4.0 parts by mass of at least one active metal selected from among titanium, zirconium, hafnium, and niobium, with respect to 100 parts by mass, in total, of 93.0 to 99.4 parts by mass of Ag, 0.1 to 5.0 parts by mass of Cu, and 0.5 to 2.0 parts by mass of Sn; and Cu-rich phases in a bonding braze material layer structure between the ceramic substrate and the metal plate have an average size of 3.5 ?m or less and a number density of 0.015/?m2 or higher. A method for producing a ceramic circuit substrate includes bonding at a temperature of 855 to 900° C. for a retention time of 10 to 60 minutes.

Abstract: A ceramic circuit substrate having high bonding performance and excellent thermal cycling resistance properties, wherein a ceramic substrate and a copper plate are bonded by a braze material containing Ag and Cu, at least one active metal component selected from Ti and Zr, and at least one element selected from among In, Zn, Cd, and Sn, wherein a braze material layer, after bonding, has a continuity ratio of 80% or higher and a Vickers hardness of 60 to 85 Hv.

Abstract: A method for separating steviol glycoside, including: a separating step 55 of performing a continuous liquid chromatography for continuously separating at least one type of steviol glycoside by allowing a liquid to be separated containing plural types of steviol glycosides to pass through a separating agent in which polyethylene imine is immobilized to a carrier.

Abstract: Disclosed herein is a ceramic circuit substrate for a power module obtained by applying an insulating resin for preventing solder flow and chip displacement and an insulating resin for preventing partial discharges and the lowering of insulation to a main surface of a metal circuit and to the outer periphery of the metal circuit or between metal circuits, respectively. Also disclosed herein are methods for manufacturing a ceramic circuit substrate for a power module.

Abstract: A ceramic circuit substrate is suitable for silver nanoparticle bonding of semiconductor elements and has excellent close adhesiveness with a power module sealing resin. A ceramic circuit substrate has a copper plate bonded, by a braze material, to both main surfaces of a ceramic substrate including aluminum nitride or silicon nitride, the copper plate of at least one of the main surfaces being subjected to silver plating, wherein: the copper plate side surfaces are not subjected to silver plating; the thickness of the silver plating is 0.1 ?m to 1.5 ?m; and the arithmetic mean roughness Ra of the surface roughness of the circuit substrate after silver plating is 0.1 ?m to 1.5 ?m.

Abstract: A ceramic circuit substrate having high bonding performance and excellent thermal cycling resistance properties, having a circuit pattern provided on a ceramic substrate with a braze material layer interposed therebetween, and a protruding portion formed by the braze material layer protruding from the outer edge of the circuit pattern, wherein: the braze material layer includes Ag, Cu, Ti, and Sn or In; and an Ag-rich phase is formed continuously for 300 ?m or more, towards the inside, from an outer edge of the protruding portion, along a bonding interface between the ceramic substrate and the circuit pattern, and has a bonding void ratio of 1.0% or less.

Abstract: A ceramic circuit substrate and power module with excellent heat cycle resistance characteristics, which is formed by bonding a ceramic substrate and a copper plate via a brazing material including Ag, Cu, and an active metal, wherein the bond void fraction is no greater than 1.0% and the diffusion distance of the Ag, which is a brazing material component, is 5-20 ?m. Also, a method for manufacturing a ceramic circuit substrate characterized in that the heating time in a temperature range 400-700° C. in a process for raising the temperature to a bonding temperature is 5-30 minutes and bonding is performed by maintaining the bonding temperature at 720-800° C. for 5-30 minutes.

Abstract: A pyridonecarboxylic acid derivative or a salt thereof is represented by Formula (1), where R1 is hydrogen, a halogen atom, a lower alkyl group, or an amino group; R2 is —NH—R6, where R6 is hydrogen, a lower alkyl group, an amino lower alkyl group, or the like; —O—R7, where R7 is hydrogen, a lower alkyl group, or the like; —(CH2)m—R8, where R8 is an amino group or the like, m is 1, 2, 3 or 4; or a cyclic amino group of Formula (2), where Y represents NH or C—R9aR9b, where R9a and R9b are each independently hydrogen, a lower alkyl group, an amino group, a lower alkyl amino group, or the like; n and p are 1 or 2; R3 is hydrogen, a halogen atom, a lower alkyl group, or the like; R4 is hydrogen or a carboxyl group-protecting group; and R5 is hydrogen or a hydroxyl group-protecting group.

Abstract: A pyridonecarboxylic acid derivative or a salt thereof is represented by Formula (1), where R1 is hydrogen, a halogen atom, a lower alkyl group, or an amino group; R2 is —NH—R6, where R6 is hydrogen, a lower alkyl group, an amino lower alkyl group, or the like; —O—R7, where R7 is hydrogen, a lower alkyl group, or the like; —(CH2)m—R8, where R8 is an amino group or the like, m is 1, 2, 3 or 4; or a cyclic amino group of Formula (2), where Y represents NH or C—R9aR9b, where R9a and R9b are each independently hydrogen, a lower alkyl group, an amino group, a lower alkyl amino group, or the like; n and p are 1 or 2; R3 is hydrogen, a halogen atom, a lower alkyl group, or the like; R4 is hydrogen or a carboxyl group-protecting group; and R5 is hydrogen or a hydroxyl group-protecting group.

Abstract: [Problem] To obtain a ceramic circuit substrate for a power module wherein an insulating resin for preventing solder flow and chip displacement and an insulating resin for preventing partial discharges and lowering of insulation are applied, without lowering productivity or worsening partial discharge properties, or lowering the insulating properties due to positional displacement of the insulating resins. [Solution] A ceramic circuit substrate for a power module is obtained by applying an insulating resin for preventing solder flow and chip displacement and an insulating resin for preventing partial discharges and the lowering of insulation to a main surface of a metal circuit and to the outer periphery of the metal circuit or between metal circuits, respectively.

Abstract: An antenna apparatus used in a wireless communication medium or a wireless communication medium processing apparatus constructed by a constitution of including a magnetic member in which a magnetic ceramic powder is used as a major component thereof and which is provided with flexibility; an antenna formed at a surface or inside of the magnetic member, and a matching circuit of the antenna formed at the surface or the inside of the magnetic member.

Abstract: The fuel reservoir for a fuel cell is a fuel reservoir detachably connected with a fuel cell main body, and it is equipped with a fuel-storing vessel of a tube type for storing a liquid fuel and a fuel discharge part; the fuel discharge part is provided with a valve for sealing communication between the inside and the outside of the above fuel-storing vessel; and a follower which seals the liquid fuel and moves as the liquid fuel is consumed is disposed in the rear end part of the liquid fuel stored. The valve assumes a structure in which a slit is formed in an elastic material and a structure in which a valve member is pressed by a resilient body.

Abstract: An antenna apparatus used in a wireless communication medium or a wireless communication medium processing apparatus constructed by a constitution of including a magnetic member in which a magnetic ceramic powder is used as a major component thereof and which is provided with flexibility; an antenna formed at a surface or inside of the magnetic member, and a matching circuit of the antenna formed at the surface or the inside of the magnetic member.

Abstract: An antenna apparatus used in a wireless communication medium or a wireless communication medium processing apparatus constructed by a constitution of including a magnetic member in which a magnetic ceramic powder is used as a major component thereof and which is provided with flexibility, an antenna formed at a surface or inside of the magnetic member, and a matching circuit of the antenna formed at the surface or the inside of the magnetic member.