Abstract: A power QFN package includes signal leads, a die pad, support leads, and an adhesive for die bonding. These elements are encapsulated with a resin encapsulant. The lower parts of the signal leads are exposed from the resin encapsulant to function as external electrodes. A middle part of the die pad is formed at a higher level than a peripheral part thereof. This permits the formation of through holes in a thin part of the die pad. This enhances the degree of flexibility in the size of a semiconductor chip and the moisture resistance thereof.

Abstract: A power QFN package includes signal leads, a die pad, support leads, and an adhesive for die bonding. These elements are encapsulated with a resin encapsulant. The lower parts of the signal leads are exposed from the resin encapsulant to function as external electrodes. A middle part of the die pad is formed at a higher level than a peripheral part thereof. This permits the formation of through holes in a thin part of the die pad. This enhances the degree of flexibility in the size of a semiconductor chip and the moisture resistance thereof.

Abstract: On a surface of an electronic component facing a substrate, a plurality of electrode terminals are provided which are of circular plane shapes. On regions of the main surface of the substrate facing the electrode terminals, a plurality of interconnect electrodes are provided which are of circular plane shapes.

Abstract: On a surface of an electronic component facing a substrate, a plurality of electrode terminals are provided which are of circular plane shapes. On regions of the main surface of the substrate facing the electrode terminals, a plurality of interconnect electrodes are provided which are of circular plane shapes.

Abstract: An apparatus for continuously cooling a metal strip, which comprises: at least one cooling roll, which is freely rotatable and in contact with a metal strip continuously travelling in the longitudinal direction thereof, for continuously cooling the metal strip, a cooling liquid flowing through the interior of the cooling roll to continuously cool same, a contact area between the surface of the cooling roll and the surface of the metal strip being controllable; and a gas cooler, arranged on the exist side of the at least one cooling roll, for continuously cooling the metal strip by blowing a cooling gas onto the surface of the metal strip so as to achieve a uniform temperature distribution in the width direction of the metal strip after the final cooling thereof, the gas cooler comprising a plurality of mutually independent nozzle headers for blowing the cooling gas onto the surface of the metal strip, and the plurality of nozzle headers controlling at least one of a flow rate and a flow velocity of the coolin