Abstract: A motor includes a shaft, a rotor, a stator including a coil and opposed to the rotor, and a bearing configured to support the shaft. In addition, the motor further includes a first temperature sensor disposed farther toward an outer periphery side than the coil, and a second temperature sensor disposed farther toward an inner periphery side than the coil.

Abstract: An optical fiber cable includes: a slotted core which houses and holds an optical fiber in a rectilinear slotted groove disposed along a longitudinal direction of the cable; a cylindrical sheath covering the entire slotted core; a rectilinear hanger line integrally provided continuously to the sheath; and a rectilinear tension member mounted in the slotted core. The tension member is located in a region having an angle about the cable center line within a predetermined value with respect to a plane including a center line of the suspension wire and the cable center line.

Abstract: According to one embodiment, a reproducing device of an information storage medium sufficiently reproduces resource data of advanced contents as much as possible. The device uses a ring buffer to temporarily store packets of resource data of a video stream. Packets read out from the buffer are basically transferred to a file cache in response to a playlist. If a storage area in the cache cannot be secured, a packet list storage unit stores a packet list to be stored in the buffer. The packet list includes a pointer on the buffer of packets composing the resource data. When the cache makes it possible to store the packets therein, the buffer can transfer the packets to the cache at a high speed.

Abstract: Disclosed is a recording and reproducing apparatus which includes: a type information requesting unit configured to request other recording and reproducing apparatuses connected via a network to transmit type information of storage devices mounted in the other recording and reproducing apparatuses via the network; a type information receiving unit configured to receive the type information of the storage devices which is transmitted in response to the request; and an addressing unit configured to assign, if the received type information of the storage devices is information indicating a storage device of unregistered type, address information secured for an unregistered type in advance to the storage device.

Abstract: A semiconductor device having a package of a single in-line type includes a semiconductor chip, a package body that accommodates the semiconductor chip therein and defined by a pair of opposing major surfaces and a plurality of interconnection leads held by the package body to extend substantially perpendicularly to a bottom surface. Each of the interconnection leads consists of an inner lead part located inside the package body and an outer lead part located outside the package body, the outer lead part being bent laterally at a boundary between the inner part and the outer part, in one of first and second directions that are opposite from each other and substantially perpendicular to the opposing major surfaces of the package body. A plurality of support legs extend laterally at the bottom surface of the package body for supporting the package body upright when the semiconductor device is placed on a substrate.

Abstract: A semiconductor device having a package of a single in-line type includes a semiconductor chip, a package body that accommodates the semiconductor chip therein and defined by a pair of opposing major surfaces and a plurality of interconnection leads held by the package body to extend substantially perpendicularly to a bottom surface. Each of the interconnection leads consists of an inner lead part located inside the package body and an outer lead part located outside the package body, the outer lead part being bent laterally at a boundary between the inner part and the outer part, in one of first and second directions that are opposite from each other and substantially perpendicular to the opposing major surfaces of the package body. A plurality of support legs extend laterally at the bottom surface of the package body for supporting the package body upright when the semiconductor device is placed on a substrate.

Abstract: An operating valve assembly incorporates a pressure compensation valve and is capable of contributing down-sizing of a hydraulic circuit. The valve assembly includes an operating valve, compensation valves and a load pressure detecting portion. A valve body of the operating valve defines a spool bore extending laterally through the valve body at a vertically intermediate portion of the valve body, a load pressure detecting port at a laterally intermediate portion of the spool bore, and a respective pump port, actuator port and tank port at each side of the load pressure detecting port. The operating valve also includes a spool within the spool bore. The pressure compensation valves are arranged at left and right sides of an upper portion of the valve body and the load pressure detecting portion, for supplying load pressure to the load pressure detecting port, is formed in the spool.

Abstract: A method of producing a semiconductor device includes the steps of fitting a bottom part of a radiator block within a tapered hole which is provided at a bottom of a recess of a jig and positioning on the jig a lead frame having inner and outer leads and wherein the lead frame has an opening at a central part thereof, the opening being located above a top surface of the radiator block. The semiconductor chip is then mounted on the top surface part of the radiator block and bonded to the lead frame by plurality of wires.

Abstract: A semiconductor device having a package of a single in-line type includes a semiconductor chip, a package body that accommodates the semiconductor chip therein and defined by a pair of opposing major surfaces and a plurality of interconnection leads held by the package body to extend substantially perpendicularly to a bottom surface. Each of the interconnection leads consists of an inner lead part located inside the package body and an outer lead part located outside the package body, the outer lead part being bent laterally at a boundary between the inner part and the outer part, in one of first and second directions that are opposite from each other and substantially perpendicular to the opposing major surfaces of the package body. A plurality of support legs extend laterally at the bottom surface of the package body for supporting the package body upright when the semiconductor device is placed on a substrate.

Abstract: An operating valve assembly incorporates a pressure compensation valve and is capable of contributing down-sizing of a hydraulic circuit. The valve assembly includes an operating valve, compensation valves and a load pressure detecting portion. A valve body of the operating valve defines a spool bore extending laterally through the valve body at a vertically intermediate portion of the valve body, a load pressure detecting port at a laterally intermediate portion of the spool bore, and a respective pump port, actuator port and tank port at each side of the load pressure detecting port. The operating valve also includes a spool within the spool bore. The pressure compensation valves are arranged at left and right sides of an upper portion of the valve body and the load pressure detecting portion for supplying load pressure to the load pressure detecting port is formed in the spool.

Abstract: An electromagnetic flow meter for industries includes a transducer and a signal processor provided separately from the transducer. The transducer having an exciting circuit, an amplifying and calculating part and a transmitting part outputs an analog flow rate signal and digital signals which are superimposed to the an analog flow rate signal to the signal processor. The analog signal sent to the signal processor is passed through the signal processor without receiving any signal processing and the digital signals are sent into the transducer or taken into the signal processor through alternating current coupling means. The data transmission is diagnosed by checking the conformity between the data stored in the signal sending part and the received data. Data set in a data setting part provided in the signal processor are sent to the transducer through a transmitting cable in which the flow rate data are also transmitted.

Abstract: A method of producing a semiconductor device includes the steps of fitting a bottom part of a radiator block within a tapered hole which is provided at a bottom of a recess of a jig and positioning on the jig a lead frame having inner and outer leads and wherein the lead frame has an opening at a central part thereof, the opening being located above a top surface of the radiator block. The semiconductor chip is then mounted on the top surface part of the radiator block and bonded to the lead frame by plurality of wires.

Abstract: A semiconductor device includes a semiconductor chip mounted in a resin package body. A plurality of interconnection leads are provided on the resin package body along a lower edge thereof and project outwardly from the lower edge. A heat dissipation lead is connected to the resin package body for dissipating heat generated by the semiconductor chip. The heat dissipation lead includes a plate of a heat conducting material having a stage part and a heat sink part, wherein the stage part is held inside the resin package body and supports the semiconductor chip thereon. The heat sink part projects outwardly from the resin package body and includes a part that extends in a downward direction.

Abstract: In a drawer type enclosed switchboard in which equipment constituting a main circuit are built and which includes an inner truck device for connecting or disconnecting the main circuit through its horizontal movement, and an outer truck device supporting the inner truck device and being received in the switchboard proper; a drawer type enclosed switchboard comprising an automatic grounding device which is held in engagement with an operating mechanism permitted to electrically connect and disconnect the inner truck device by means of an operating handle grip at the front surface of the outer truck device serving as the panel of the switchboard, and which automatically grounds the load side of the main circuit only in case of an entire disconnecting operation.

Abstract: An ultrasonic Doppler flowmeter in which a received signal processing part includes a reference signal generator for generating a reference signal corresponding to the magnitude of a received signal, and a comparator for comparing the received signal with the reference signal. The reference signal varies in accordance with the magnitude of the received signal, and further may possess a hysteresis width corresponding to the output of the comparator. Therefore, a noise signal is effectively removed from the received signal at the comparator, and only a Doppler shift frequency is detected.

Abstract: A process for recovery of chemicals from a sodium sulfite pulping waste liquor is disclosed in which a smelt obtained from the waste liquor is introduced into an aqueous slurry containing solidified smelt while make up water and a weak aqueous slurry are supplied to effect incomplete dissolution of the smelt into the aqueous slurry to maintain the content of total solid and the temperature of the slurry at constant levels, the resulting aqueous slurry is subjected to a solid-liquid separation to obtain a wet cake having the molar ratio of S/Na.sub.

Abstract: A process for recovery of chemicals from a sodium sulfite pulping waste liquor is disclosed in which a smelt obtained from the waste liquor is introduced into an aqueous slurry containing solidified smelt while make up water and a weak aqueous slurry are supplied to effect incomplete dissolution of the smelt into the aqueous slurry to maintain the content of total solid and the temperature of the slurry at constant levels, the resulting aqueous slurry is subjected to a solid-liquid separation to obtain a wet cake having the molar ratio of S/Na.sub.