Patents by Inventor Kouji Shika

Kouji Shika has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of positioning lead frame on molding die to seal semiconductor element with resin
    Patent number: 5288698
    Abstract: A reference pin (150) is provided on a bottom die (108) of a molding device (100). A lead frame (3) is carried with a chucking device (120) attached to an X-Y table mechanism (110). A hole (132) is formed in a stage (131) of the X-Y table mechanism. Respective images of the hole and the pin are detected by a TV camera (142) to control the relative position of the bottom die and the lead frame by driving the X-Y stage.
    Type: Grant
    Filed: March 27, 1992
    Date of Patent: February 22, 1994
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Toshinobu Banjo, Kouji Shika, Minoru Tanaka
  • Molding device for sealing semiconductor element with resin
    Patent number: 5123823
    Abstract: A reference pin (150) is provided on a bottom die (108) of a molding device (100). A lead frame (3) is carried with a chucking device (120) attached to an X-Y table mechanism (110). A hole (132) is formed in a stage (131) of the X-Y table mechanism. Respective images of the hole and the pin are detected by a TV camera (142) to control the relative position of the bottom die and the lead frame by driving the X-Y stage.
    Type: Grant
    Filed: January 15, 1991
    Date of Patent: June 23, 1992
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Toshinobu Banjo, Kouji Shika, Minoru Tanaka