Abstract: A laminated electronic component is provided which comprises a layered body of generally rectangular shape, including alternately laminated dielectric layers 4 and internal electrode layers 3a and 3b, and external electrodes 5b formed on both ends of the layered body and are connected to the internal electrode layers 3a and 3b. Adjacent internal electrode layers 3a and 3b are exposed alternately on either ends of the layered body. The layered body includes a capacitance generation portion 6 where the adjacent internal electrode layers 3a and 3b are overlapped, and electrode extraction portions 7 where the adjacent internal electrode layers 3a and 3b are not overlapped. The internal electrode 3a and 3b have a first end that is connected to the external electrode 5b and a second end that is not connected to the external electrode 5b.

Abstract: A laminated electronic component is provided which comprises a layered body of generally rectangular shape, including alternately laminated dielectric layers 4 and internal electrode layers 3a and 3b, and external electrodes 5b formed on both ends of the layered body and are connected to the internal electrode layers 3a and 3b. Adjacent internal electrode layers 3a and 3b are exposed alternately on either ends of the layered body. The layered body includes a capacitance generation portion 6 where the adjacent internal electrode layers 3a and 3b are overlapped, and electrode extraction portions 7 where the adjacent internal electrode layers 3a and 3b are not overlapped. The internal electrode 3a and 3b have a first end that is connected to the external electrode 5b and a second end that is not connected to the external electrode 5b.

Abstract: A high pressure discharge lamp having a thick film resistor comprising a plurality of resistive elements. A first resistive element is included in a starting circuit for the lamp and a second resistive element is in series with the arc tube during lamp operation for flicker elimination. The integral thick film resistor facilitates mounting and connection of the resistor elements within the lamp envelope. Favorably, the resistor substrate has a surface emissivity of greater than about 0.5, and preferably greater than about 0.9, to provide sufficient radiation cooling within an evacuated outer lamp envelope to prevent resistor failure while keeping the size of the resistor small enough for use as a component in an HID lamp. Additionally, a suitable coating of low vapor pressure thickness covers the solder connecting the metallic resistor terminals to the substrate to prevent evaporation of the solder and its deposition on the inner surface of the outer lamp envelope.