Abstract: The present invention aims to provide an electronic component capable of reducing the occurrence of cracks at the joining portion with a board etc. A capacitor 1 (laminated ceramic capacitor) being one example of the electronic component of the present invention is provided with an element assembly 10 (ceramic) and a pair of external electrodes 20 formed on both side surfaces of the element assembly. In the element assembly 10, a dielectric layer 12 and an internal electrode 14 are laminated alternately. The external electrode 14 has such constitution that a first electrode layer connected with the internal electrode 14, a second electrode layer (electroconductive resin layer) including a hardened product of epoxy resin containing an epoxy compound having a molecular weight of 2000 or more and plural epoxy groups as the base compound, a third electrode layer composed of Ni and a fourth electrode layer composed of Sn are formed in this order from the element assembly side.

Abstract: A method of producing a rare-earth magnet containing a rare-earth compound having a first rare-earth element and a second rare-earth element different from the first rare-earth element includes: a mixing step of mixing rare-earth compound powder including the first rare-earth element and subjected to a process based on hydrogenation disproportionation desorption recombination with a diffusion material including the second rare-earth element; a molding step of molding the mixed powder into a compact in a magnetic field; and a heating step of heating the compact to diffuse the second rare-earth element into the rare-earth compound powder.

Abstract: The present invention aims to provide an electronic component capable of reducing the occurrence of cracks at the joining portion to a board etc. A capacitor 1 (laminated ceramic capacitor) being one example of the electronic component is provided with an element assembly 10 (ceramic) and a pair of external electrodes 20 formed on both side surfaces of the element assembly 10. In the element assembly 10, a dielectric layer 12 and an internal electrode 14 are laminated alternately. The external electrode 20 has such constitution that a first electrode layer connected with the internal electrode, a second electrode layer (electroconductive resin layer) including a hardened product of thermohardening resin containing a polyphenol compound having a side chain composed of an aliphatic group, a third electrode layer composed of Ni and a fourth electrode layer composed of Sn are formed in this order from the element assembly side.

Abstract: The present invention aims to provide an electronic component capable of reducing the occurrence of cracks at the joining portion with a board etc. A capacitor 1 (laminated ceramic capacitor) being one example of the electronic component of the present invention is provided with an element assembly 10 (ceramic) and a pair of external electrodes 20 formed on both side surfaces of the element assembly. In the element assembly 10, a dielectric layer 12 and an internal electrode 14 are laminated alternately. The external electrode 14 has such constitution that a first electrode layer connected with the internal electrode 14, a second electrode layer (electroconductive resin layer) including a hardened product of epoxy resin containing an epoxy compound having a molecular weight of 2000 or more and plural epoxy groups as the base compound, a third electrode layer composed of Ni and a fourth electrode layer composed of Sn are formed in this order from the element assembly side.

Abstract: The present invention aims to provide an electronic component capable of reducing the occurrence of cracks at the joining portion to a board etc. A capacitor 1 (laminated ceramic capacitor) being one example of the electronic component is provided with an element assembly 10 (ceramic) and a pair of external electrodes 20 formed on both side surfaces of the element assembly 10. In the element assembly 10, a dielectric layer 12 and an internal electrode 14 are laminated alternately. The external electrode 20 has such constitution that a first electrode layer connected with the internal electrode, a second electrode layer (electroconductive resin layer) including a hardened product of thermohardening resin containing a polyphenol compound having a side chain composed of an aliphatic group, a third electrode layer composed of Ni and a fourth electrode layer composed of Sn are formed in this order from the element assembly side.

Abstract: A polarizing plate includes a polarizing layer for controlling a light and producing a polarized light, the polarizing layer having a particle dispersing medium with a property of light transmission and bar-like polarizing particles which are dispersed in the particle dispersing medium and arranged in a constant direction with a magnetic field, where each of the bar-like polarizing particles is provided with a bar-like ferromagnetic particle of chromium dioxide, whose surface is coated with a conductive film.

Abstract: An EL sheet diaphragm including a diffusion type EL sheet having a diaphragm portion exhibiting a dome shape and a flange supporting portion disposed about the outer circumference of the diffusion type EL sheet. The diffusion type EL sheet including a transparent film having an upper surface and a lower surface, a transparent electrode layer formed on the lower surface of the transparent film, a light emitting layer formed on the transparent electrode, a dielectric layer formed on the light emitting layer, a rear electrode layer formed on the dielectric layer, and an insulating layer formed on the rear electrode layer. The diffusion type EL sheet emits light from the diaphragm portion of the upper surface of the transparent film. The diffusion type EL sheet bows outwardly in an at-rest state such that the upper surface of the transparent film exhibits a convex shape, and bows inwardly when depressed for operation such that the upper surface of the transparent film exhibits a concave shape.

Abstract: A flexible wiring board includes a printed conductive circuit layer formed on an insulating film, a metallic layer formed on the printed conductive circuit layer, and an insulating layer formed on the metallic layer. A method of making a flexible wiring board includes the steps of forming a conductive circuit layer by screen printing a wiring pattern using a conductive paste, baking the printed wiring pattern, and forming a metallic layer on the printed conductive circuit layer by a plating method.

Abstract: The invention relates to a steel plate which exhibits a good resistance to a corrosive atmosphere, containing weakly acidic condensed water comprising SO.sub.2, Cl.sup.- ion, and CO.sub.2 such as the exhaust gas from a boiler which burns LNG.The steel plate having a good corrosion resistance to condensed water characterized in comprising a low C content, a low Mn content and a medium amount of Cr content, and further 0.01% or less of S in an unavoidable impurity, or further comprising at least one element of Si, Al, Cu, Ni, Mo, Nb, V, Ti, Ca, and B. More, the steel plate having a good corrosion resistance to condensed water comprising carbonic acid gas and chloride ion characterized in comprising a low C content, a low Mn content, P, Cu and Ni, and further 0.01% or less of S in an unavoidable impurity, or further comprising at least one element of Si, Al, Mo, Nb, V, Ti, Ca and B.

Abstract: A flexible printed circuit board is constituted with a first insulation film covering a first insulating resist layer, a second insulation film covering a second insulating resist layer and a printed circuit formed between the first insulating resist layer and the second insulating resist layer, and a terminal of an electronic component is disposed on the printed circuit, and the second insulation film is pressed and heated.

Abstract: A flexible printed circuit board is constituted with a first insulation film covering a first insulating resist layer, a second insulation film covering a second insulating resist layer and a printed circuit formed between the first insulating resist layer and the second insulating resist layer, and a terminal of an electronic component is disposed on the printed circuit, and the second insulation film is pressed and heated.

Abstract: A flexible wiring board includes a printed conductive circuit layer formed on an insulating film, a metallic layer formed on thed printed conductive circuit layer, and an insulating layer formed on the metallic layer. A method of making a flexible wiring board includes the steps of forming a conductive circuit layer by screen printing a wiring pattern using a conductive paste, baking the printed wiring pattern, and forming a metallic layer on the printed conductive circuit layer by a plating method.

Abstract: A method for electrically connecting an upper wiring with a lower wiring consists of the steps of arranging the upper wiring mixed with thermo-softening material on an upper insulating sheet, arranging the lower wiring mixed with thermo-softening material on a lower insulating sheet, putting the upper insulating sheet on the lower insulating sheet to bring the upper wiring into contact with the lower wiring, and providing ultrasonic vibration to the upper and lower wirings and the upper insulating sheet while pushing the upper insulating sheet toward the lower insulating sheet. In these steps, the upper and lower wirings and the upper insulating sheet are heated and melted because friction heat is generated by the ultrasonic vibration. Thereafter, the upper insulating sheet is pushed into the upper and lower wirings while pushing these wirings aside and is boded with the lower insulating sheet. Also, the upper wiring is bonded with the lower wiring so that these wirings are electrically connected.

Abstract: Anisotropic conductive material is employed instead of solder for connecting between the terminal of a component and a printed circuit board. In addition to the printed circuit board, a printed circuit sheet is provided and the terminal of the component is sandwiched between both anisotropic materials on the printed circuit board and beneath the printed circuit sheet. From both outside surfaces of the printed circuit board and the sheet, heat and pressure are simultaneously applied to the terminal part (i.e. thermocompression bonding).

Abstract: A roll for a mill includes a roll shaft having a tapered portion disposed intermediate opposite ends thereof. The tapered portion has an outer peripheral surface tapering axially of the roll shaft. A ring of a wear-resistant material is disposed around the tapered portion of the roll shaft. A tubular sleeve having an inner peripheral surface tapering axially thereof is press-fitted between the tapered portion of the roll shaft and the ring to retain the ring in place on the roll shaft for rotation therewith. The sleeve includes an inner groove formed in the inner peripheral surface thereof and a passageway formed therethrough. The passageway is communicated with the inner groove so that pressurized oil is supplied through the passageway into the inner groove.