Abstract: There is provided a semiconductor device which comprises capacitors having lower electrodes, which are formed of platinum on a first insulating film over a semiconductor substrate to have a contact region, and upper electrodes formed on the lower electrodes via a dielectric film respectively, a second insulating film formed on the capacitors, a hole formed in the second insulating film on the contact region of the lower electrode, and a wiring constructed by forming an underlying conductive film, a minimum thickness of which is thicker than 30 nm at a bottom of the hole, and an aluminum film sequentially, and formed from an inside of the hole to an upper surface of the second insulating film.

Abstract: A semiconductor device includes a ferroelectric capacitor and a protective film of Al2O3 for blocking penetration of H2 atmosphere into the ferroelectric capacitor, wherein the Al2O3 protective film has a density of about 3.0 g/cm3 or more when the thickness of said protective film exceeds about 20 nm and a density of about 3.1 g/cm3 or more when the thickness of the protective film is about 20 nm or less.