Abstract: In a game machine, image display not giving the player a feeling of oddness or disadvantage during game progress even if a non-display at a physical distance is present between different display screen areas. The game machine executes program for controlling image display of first and second display screens on both sides of a non-display area. To move an object from the first to the second display screen and display it there. The movement angle and movement speed are calculated at the display coordinate position of the object displayed on the first display screen, and the movement distance which the object moves through the non-display area from the movement angle is determined. Further, a preset additional distance corresponding to the object to the movement distance is added to use it as a virtual movement distance. The object on the second display screen is displayed when the time required for the object to move the virtual movement distance has elapsed.

Abstract: The invention provides a method for analyzing minute amounts of Pd, Rh and Ru with high accuracy by a high-frequency plasma mass spectroscope. The method comprises (1) a step of pretreating a sample by an alkali fusion method using a sodium compound; and (2) a step of analyzing the pretreated sample using a high-frequency plasma mass spectroscope; wherein, in step (2), the distance between a sampling cone and a skimmer cone is adjusted such that the concentration of 40Ar65Cu which interferes with Pd, the concentrations of 40Ar63Cu and 40Ar40Ar23Na which interfere with Rh, and the concentrations of 38Ar63Cu and 40Ar38Ar23Na which interfere with Ru are all equal to or less than 0.05 ppb.

Abstract: The purpose of the present invention is to provide a backup memory management system capable of indicating any misuse of data in a backup memory and imposing an appropriate sanction. The backup memory management device comprises a data saving system 10. When the generated and renewed parameter data is stored into the backup memory 3, the data saving system 10 determines whether or not parameter data already stored in the backup memory 3 is proper data, and if the parameter data is determined as proper data, the generated and renewed parameter data is written over the parameter data saved in the backup memory 3, and if the parameter data is determined as improper data, executes predetermined special processing. Special processing means processing such as imposing a penalty in the course of a game.

Abstract: An object of the present invention is to present a voice chat system suitable for networked games. The voice chat system of the present invention comprises a plurality of game apparatuses connected to a communications network and a server apparatus that manages voice chat between the game apparatuses. The server apparatus obtains from a game apparatus the IP address of the game apparatus which is to be the partner for the voice chat. The voice information inputted into the game apparatus is relayed over the IP network as a VoIP packet and is delivered to the chat partner's game apparatus via the server apparatus. Through this configuration, chat sounds are not outputted to all game apparatuses connected to the network but, instead, are outputted only to the game apparatuses specified by a player, so the object can be achieved without an increase in network traffic above what is necessary.

Abstract: The invention provides a method for analyzing minute amounts of Pd, Rh and Ru with high accuracy by a high-frequency plasma mass spectroscope. The method comprises (1) a step of pretreating a sample by an alkali fusion method using a sodium compound; and (2) a step of analyzing the pretreated sample using a high-frequency plasma mass spectroscope; wherein, in step (2), the distance between a sampling cone and a skimmer cone is adjusted such that the concentration of 40Ar65Cu which interferes with Pd, the concentrations of 40Ar63Cu and 40Ar40Ar23Na which interfere with Rh, and the concentrations of 38Ar63Cu and 40Ar38Ar23Na which interfere with Ru are all equal to or less than 0.05 ppb.

Abstract: In a game machine, image display not giving the player a feeling of oddness or disadvantage during game progress even if a non-display at a physical distance is present between different display screen areas. The game machine executes program for controlling image display of first and second display screens on both sides of a non-display area. To move an object from the first to the second display screen and display it there. The movement angle and movement speed are calculated at the display coordinate position of the object displayed on the first display screen, and the movement distance which the object moves through the non-display area from the movement angle is determined. Further, a preset additional distance corresponding to the object to the movement distance is added to use it as a virtual movement distance. The object on the second display screen is displayed when the time required for the object to move the virtual movement distance has elapsed.

Abstract: The back side of a strip substrate with plural semiconductor chips mounted thereon is vacuum-chucked to a lower mold half of a mold, and in this state the plural semiconductor chips are sealed with resin simultaneously to form a seal member. Thereafter, the strip substrate and the seal member are released from the mold and are cut into plural semiconductor devices. The semiconductor devices thus obtained are improved in their mounting reliability.

Abstract: The back side of a strip substrate with plural semiconductor chips mounted thereon is vacuum-chucked to a lower mold half of a mold, and in this state the plural semiconductor chips are sealed with resin simultaneously to form a seal member. Thereafter, the strip substrate and the seal member are released from the mold and are cut into plural semiconductor devices. The semiconductor devices thus obtained are improved in their mounting reliability.

Abstract: The semiconductor device comprises: a tub for supporting a semiconductor chip; a sealing body formed by sealing the semiconductor chip with a resin; a plurality of leads made of a copper alloy, exposed to the back face of the sealing body, and having a soldered layer on the exposed mounted face; and wires for connecting the pads of the semiconductor chip and the corresponding leads. In the manufacture method, the sealing body is polished, after resin-molded, at its back face with a brush to form the two widthwise edge portions, as exposed from the back face of the sealing body, of the lead into rounded faces, and the mounted face of the lead including the rounded faces is protruded at its central portion from the back face of the sealing body thereby to improve the connection reliability at the packaging time.

Abstract: The back side of a strip substrate with plural semiconductor chips mounted thereon is vacuum-chucked to a lower mold half of a mold, and in this state the plural semiconductor chips are sealed with resin simultaneously to form a seal member. Thereafter, the strip substrate and the seal member are released from the mold and are cut into plural semiconductor devices. The semiconductor devices thus obtained are improved in their mounting reliability.

Abstract: The back side of a strip substrate with plural semiconductor chips mounted thereon is vacuum-chucked to a lower mold half of a mold, and in this state the plural semiconductor chips are sealed with resin simultaneously to form a seal member. Thereafter, the strip substrate and the seal member are released from the mold and are cut into plural semiconductor devices. The semiconductor devices thus obtained are improved in their mounting reliability.

Abstract: An object of the present invention is to present a voice chat system suitable for networked games. The voice chat system of the present invention comprises a plurality of game apparatuses connected to a communications network and a server apparatus that manages voice chat between the game apparatuses. The server apparatus obtains from a game apparatus the IP address of the game apparatus which is to be the partner for the voice chat. The voice information inputted into the game apparatus is relayed over the IP network as a VoIP packet and is delivered to the chat partner's game apparatus via the server apparatus. Through this configuration, chat sounds are not outputted to all game apparatuses connected to the network but, instead, are outputted only to the game apparatuses specified by a player, so the object can be achieved without an increase in network traffic above what is necessary.

Abstract: The back side of a strip substrate with plural semiconductor chips mounted thereon is vacuum-chucked to a lower mold half of a mold, and in this state the plural semiconductor chips are sealed with resin simultaneously to form a seal member. Thereafter, the strip substrate and the seal member are released from the mold and are cut into plural semiconductor devices. The semiconductor devices thus obtained are improved in their mounting reliability.

Abstract: To improve the connection reliability at the time of packaging a semiconductor device and to make the method management easy in a semiconductor device manufacturing method.

Abstract: To improve the connection reliability at the time of packaging a semiconductor device and to make the method management easy in a semiconductor device manufacturing method. The semiconductor device comprises: a tub 1e for supporting a semiconductor chip 2; a sealing body 3 formed by sealing the semiconductor chip 2 with a resin; a plurality of leads 1a made of a copper alloy, exposed to the back face 3a of the sealing body 3, and having a soldered layer 8 on the exposed mounted face 1d; and wires 4 for connecting the pads 2a of the semiconductor chip 2 and the corresponding leads 1a.

Abstract: The back side of a strip substrate with plural semiconductor chips mounted thereon is vacuum-chucked to a lower mold half of a mold, and in this state the plural semiconductor chips are sealed with resin simultaneously to form a seal member. Thereafter, the strip substrate and the seal member are released from the mold and are cut into plural semiconductor devices. The semiconductor devices thus obtained are improved in their mounting reliability.

Abstract: The back side of a strip substrate with plural semiconductor chips mounted thereon is vacuum-chucked to a lower mold half of a mold, and in this state the plural semiconductor chips are sealed with resin simultaneously to form a seal member. Thereafter, the strip substrate and the seal member are released from the mold and are cut into plural semiconductor devices. The semiconductor devices thus obtained are improved in their mounting reliability.

Abstract: The semiconductor device comprises: a tub for supporting a semiconductor chip; a sealing body formed by sealing the semiconductor chip with a resin; a plurality of leads made of a copper alloy, exposed to the back face of the sealing body, and having a soldered layer on the exposed mounted face; and wires for connecting the pads of the semiconductor chip and the corresponding leads. In the manufacture method, the sealing body is polished, after resin-molded, at its back face with a brush to form the two widthwise edge portions, as exposed from the back face of the sealing body, of the lead into rounded faces, and the mounted face of the lead including the rounded faces is protruded at its central portion from the back face of the sealing body thereby to improve the connection reliability at the packaging time.

Abstract: In separately excited DC brush motors ML and MR, an armature current control circuit for feeding power to armatures 61 and a field current control circuit for feeding power to a field system 62 form separate systems and are independently controllable except that both the control circuits share a battery B2 between them. When the overrotation of the motors ML and MR is detected from the backflow of an armature current and a rise in the voltage of the battery B2 or when the reverse rotation of the motors ML and MR is detected from an increase in the armature current and a decrease in PWM for the armature current, the generation of counter electromotive force is restrained by reducing the field current of the motors ML and MR so as to prevent the armature current control circuit from being damaged.

Abstract: To improve the connection reliability at the time of packaging a semiconductor device and to make the method management easy in a semiconductor device manufacturing method.