Patents by Inventor Kouji Uchihata

Kouji Uchihata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Holder for polished work and manufacturing method thereof
    Patent number: 6579160
    Abstract: The inner circumferential surface of through holes in a metal plate is chamfered or put to anchor fabrication and a thermoplastic resin is injection molding to the inner circumferential surface of the through hole thereby forming a resin portion over the entire surface of the through hole and the resin portion is removed by grinding while leaving the peripheral portion of the resin portion thereby forming a polished work holding hole. Thus, when a resin portion is formed to the inner circumference of the holding hole in a polished work holder comprising a metal plate, the production is high and the cost is reduced, and the resin portion is not detached from the bonding portion with no use of the adhesive.
    Type: Grant
    Filed: July 9, 2001
    Date of Patent: June 17, 2003
    Assignees: Sumitomo Bakelite Company Limited, Artlite Kogyo Co., Ltd., UTK System Co., Ltd., C.R.T. Co., Ltd.
    Inventors: Motoyuki Nanjo, Kouji Uchihata, Akihiko Uzawa, Kuniyuki Kanai
  • Holder for polished work and manufacturing method thereof
    Publication number: 20020077046
    Abstract: The inner circumferential surface of through holes in a metal plate is chamfered or put to anchor fabrication and a thermoplastic resin is injection molding to the inner circumferential surface of the through hole thereby forming a resin portion over the entire surface of the through hole and the resin portion is removed by grinding while leaving the peripheral portion of the resin portion thereby forming a polished work holding hole. Thus, when a resin portion is formed to the inner circumference of the holding hole in a polished work holder comprising a metal plate, the production is high and the cost is reduced, and the resin portion is not detached from the bonding portion with no use of the adhesive.
    Type: Application
    Filed: July 9, 2001
    Publication date: June 20, 2002
    Applicant: SUMITOMO BAKELITE COMPANY LIMITED
    Inventors: Motoyuki Nanjo, Kouji Uchihata, Akihiko Uzawa, Kuniyuki Kanai