Abstract: The purposes of the present invention are: to provide a layered semiconductor device capable of improving production yield; and to provide a method for producing said layered semiconductor device. This layered semiconductor device has, layered therein, a plurality of semiconductor chips, a reserve semiconductor chip which is used as a reserve for the semiconductor chips, and a control chip for controlling the operating states of the plurality of semiconductor chips and the operating state of the reserve semiconductor chip. In such a configuration, the semiconductor chips and the reserve semiconductor chip include contactless communication units and operating switches. The semiconductor chips and the reserve semiconductor chip are capable of contactlessly communicating with another of the semiconductor chips via the contactless communication units.

Abstract: The purposes of the present invention are: to provide a layered semiconductor device capable of improving production yield; and to provide a method for producing said layered semiconductor device. This layered semiconductor device has, layered therein, a plurality of semiconductor chips, a reserve semiconductor chip which is used as a reserve for the semiconductor chips, and a control chip for controlling the operating states of the plurality of semiconductor chips and the operating state of the reserve semiconductor chip. In such a configuration, the semiconductor chips and the reserve semiconductor chip include contactless communication units and operating switches. The semiconductor chips and the reserve semiconductor chip are capable of contactlessly communicating with another of the semiconductor chips via the contactless communication units.

Abstract: A layered semiconductor device capable of improving production yield and a method for producing the layered semiconductor device. The layered semiconductor device has, layered therein, a plurality of semiconductor chips, a reserve semiconductor chip which is used as a reserve for the semiconductor chips, and a control chip for controlling the operating states of the plurality of semiconductor chips and the operating state of the reserve semiconductor chip. The semiconductor chips and the reserve semiconductor chip include contactless communication units and operating switches, and are capable of contactlessly communicating with another of the semiconductor chips via the contactless communication units. The control chip controls the operating states of the semiconductor chips by switching the operating switches of the semiconductor chips, and controls the operating state of the reserve semiconductor chip by switching the operating switch of the reserve semiconductor chip.

Abstract: A layered semiconductor device capable of improving production yield and a method for producing the layered semiconductor device. The layered semiconductor device has, layered therein, a plurality of semiconductor chips, a reserve semiconductor chip which is used as a reserve for the semiconductor chips, and a control chip for controlling the operating states of the plurality of semiconductor chips and the operating state of the reserve semiconductor chip. The semiconductor chips and the reserve semiconductor chip include contactless communication units and operating switches, and are capable of contactlessly communicating with another of the semiconductor chips via the contactless communication units. The control chip controls the operating states of the semiconductor chips by switching the operating switches of the semiconductor chips, and controls the operating state of the reserve semiconductor chip by switching the operating switch of the reserve semiconductor chip.

Abstract: The present invention provides a curable resin composition including: a composite resin (A) in which a polysiloxane segment (a1), which has a structural unit represented by a general formula (1) and/or a general formula (2) as well as having a silanol group and/or a hydrolyzable silyl group, and a vinyl-based polymer segment (a2) having an alcoholic hydroxyl group are bound to each other through a bond represented by a general formula (3); and a polyisocyanate (B), wherein the content of said polysiloxane segment (a1) is from 10 to 60% by weight with respect to the total solid content of the curable resin composition, and the content of the polyisocyanate (B) is from 5 to 50% by weight with respect to the total solid content of the curable resin composition.

Abstract: The present invention provides a curable resin composition including: a composite resin (A) in which a polysiloxane segment (a1), which has a structural unit represented by a general formula (1) and/or a general formula (2) as well as having a silanol group and/or a hydrolyzable silyl group, and a vinyl-based polymer segment (a2) having an alcoholic hydroxyl group are bound to each other through a bond represented by a general formula (3); and a polyisocyanate (B), wherein the content of said polysiloxane segment (a1) is from 10 to 60% by weight with respect to the total solid content of the curable resin composition, and the content of the polyisocyanate (B) is from 5 to 50% by weight with respect to the total solid content of the curable resin composition.