Abstract: The metal bonded diamond wheel of the invention has a sintered body of a mixture of a diamond powder and a bonding metal powder. The particles of the bonding metal powder or, preferably, particles of both of the diamond powder and the bonding metal powder are provided, prior to powder metallurgical sintering, with a coating layer of iron, cobalt or nickel, in a thickness of 0.5 to 15 .mu.m. When sintered under adequate conditions, the sintered body has pores in a porosity of 10 to 25% and exhibits greatly improved grinding performance relative to the durability in grinding works and sharpness of grinding with a decreased resistance of grinding.

Abstract: A bonding tool to be employed for preparing semiconductor parts, e.g., IC, comprizing a tool-head made of a super hard material, e.g., a single crystal of diamond, etc., which comes into contact with a workpiece in the use of the bonding tool and a shank to which the tool-head is bonded by brazing with a brazing material is prepared by using a silver solder based brazing composition obtained by adding a fine powder for shrinkage-stress-relieving material, e.g., fine diamond powder, etc., to a conventional silver solder based brazing material to which titanium has been added as the brazing material. The method is advantageous in that bonding tools having improved properties; i.e., high brazing strength, high stability in practical use, low brazing strain, low thermal stress etc., can be prepared in a good yield with preventing a crack in the super hard material used as a tool-head of the bonding tools.