Patents by Inventor Kouki Nakama

Kouki Nakama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flexible printed wiring board
    Patent number: 8309853
    Abstract: A flexible printed wiring board includes a substrate, conductor wirings, a coverlay film, a jumper wiring, and through holes. The conductor wirings are disposed on a first surface of the substrate. The coverlay film covers at least part of the conductor wirings. The jumper wiring electrically connects the conductor wirings to each other. The through holes are formed in the substrate and respectively open to the surfaces of the conductor wirings. The jumper wiring is composed of a hardened material of a conductive paste and is formed so that a second surface of the substrate is continuous with respective surfaces of the conductor wirings to which the through holes open.
    Type: Grant
    Filed: February 15, 2008
    Date of Patent: November 13, 2012
    Assignees: Sumitomo Electric Industries, Ltd., Sumitomo Electric Printed Circuits, Inc.
    Inventors: Yoshio Oka, Takashi Kasuga, Jinjoo Park, Kouki Nakama
  • FLEXIBLE PRINTED WIRING BOARD
    Publication number: 20100116525
    Abstract: A flexible printed wiring board includes a substrate, conductor wirings, a coverlay film, a jumper wiring, and through holes. The conductor wirings are disposed on a first surface of the substrate. The coverlay film covers at least part of the conductor wirings. The jumper wiring electrically connects the conductor wirings to each other. The through holes are formed in the substrate and respectively open to the surfaces of the conductor wirings. The jumper wiring is composed of a hardened material of a conductive paste and is formed so that a second surface of the substrate is continuous with respective surfaces of the conductor wirings which the through holes open.
    Type: Application
    Filed: February 15, 2008
    Publication date: May 13, 2010
    Inventors: Yoshio Oka, Takashi Kasuga, Jinjoo Park, Kouki Nakama