Patents by Inventor Kouki Ogawa

Kouki Ogawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed wiring board, core substrate, and method for fabricating the core substrate
    Patent number: 6214445
    Abstract: A printed wiring board includes a core substrate, one or more insulating resin layers laminated on at least one side of the core substrate, and a wiring layer formed at least between the core substrate and the insulating resin layer or between the insulating resin layers. The core substrate includes a composite dielectric layer that contains resin and a high-permittivity powder, and a plurality of metal layers disposed such that the composite dielectric layer is sandwiched therebetween. The composite dielectric layer and the metal layers constitute a laminated capacitor.
    Type: Grant
    Filed: December 14, 1999
    Date of Patent: April 10, 2001
    Assignee: NGK Spark Plug Co., Ltd.
    Inventors: Rokuro Kanbe, Yukihiro Kimura, Kouki Ogawa
  • High heat conductive body and wiring base substrate fitted with the same
    Patent number: 5545598
    Abstract: Disclosed is a high heat conductive body which consists of 30-99 wt. % of at least one of molybdenum and tungsten and 1 or more wt. % ceramic. A wiring base substrate fitted with such a high heat conductive body is also disclosed. Methods of producing such a high heat conductive body and a wiring base substrate are further disclosed.
    Type: Grant
    Filed: February 14, 1994
    Date of Patent: August 13, 1996
    Assignee: NGK Spark Plug Co., Ltd.
    Inventors: Kouki Ogawa, Kozo Yamasaki, Naomiki Kato