Patents by Inventor Kouki Uefume

Kouki Uefume has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Disk drive device
    Patent number: 7872836
    Abstract: In a disk drive device in which low-density gas is sealed, embodiments of the present invention help to improve joint reliability at a solder joint section between a feedthrough and an enclosure with respect to stress applied by deformation due to changes in temperature environment in use. According to one embodiment, helium gas is sealed in an interior space of an HDD. A feedthrough is solder jointed to a feedthrough mounting surface of a base. At a part with relatively large thermal stress, a width of the feedthrough mounting surface is increased, and at a part with relatively small thermal stress, a width of the feedthrough mounting surface is decreased. This prevents a crack penetrating path from being generated at the solder joint section due to the thermal stress and prevents the solder joint section from contacting pins.
    Type: Grant
    Filed: January 9, 2008
    Date of Patent: January 18, 2011
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Hitoshi Shindo, Teruhiro Nakamiya, Kouki Uefume, Takako Hayakawa
  • Disk drive device
    Publication number: 20080165449
    Abstract: In a disk drive device in which low-density gas is sealed, embodiments of the present invention help to improve joint reliability at a solder joint section between a feedthrough and an enclosure with respect to stress applied by deformation due to changes in temperature environment in use. According to one embodiment, helium gas is sealed in an interior space of an HDD. A feedthrough is solder jointed to a feedthrough mounting surface of a base. At a part with relatively large thermal stress, a width of the feedthrough mounting surface is increased, and at a part with relatively small thermal stress, a width of the feedthrough mounting surface is decreased. This prevents a crack penetrating path from being generated at the solder joint section due to the thermal stress and prevents the solder joint section from contacting pins.
    Type: Application
    Filed: January 9, 2008
    Publication date: July 10, 2008
    Applicant: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Hitoshi Shindo, Teruhiro Nakamiya, Kouki Uefume, Takako Hayakawa