Patents by Inventor Koukichi Hiroshiro
Koukichi Hiroshiro has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230386855Abstract: A substrate processing method includes (A) to (C) described below. (A) A substrate having a surface in which a SiO film and a Low-k film or a SiN film are exposed is preprared. The Low-k film or the SiN film is exposed to oxygen plasma. (B) A protective film is formed on the Low-k film or the SiN film by supplying an organic compound (self-assembled monolayer (SAM) material) configured to form a SAM to the surface of the substrate. (C) The SiO film is etched by supplying hydrofluoric acid to the surface of the substrate while inhibiting etching of the Low-k film or the SiN film caused by the hydrofluoric acid with the protective film.Type: ApplicationFiled: October 6, 2021Publication date: November 30, 2023Inventors: Koji Kagawa, Koukichi Hiroshiro
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Patent number: 11723259Abstract: A method of processing a substrate includes loading the substrate to which a processing liquid is adhered, inside a processing container, removing the processing liquid adhering to the substrate by supplying a first organic solvent to the loaded substrate, causing the substrate to be water-repellent by supplying a water repellent to the substrate from which the processing liquid has been removed, supplying a second organic solvent to the water-repellent substrate, and drying the substrate by volatilizing the second organic solvent adhering to the substrate.Type: GrantFiled: June 2, 2021Date of Patent: August 8, 2023Assignee: Tokyo Electron LimitedInventors: Koukichi Hiroshiro, Jun Nonaka, Kazuya Koyama, Mitsunori Nakamori
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Publication number: 20220316059Abstract: A substrate processing method includes a protective film forming step, an insulating material depositing step, a protective film removing step, and a metal material depositing step. In the protective film forming step, a protective film is formed on a metal film among the metal film and an insulating film exposed on the surface of a substrate, using a film-forming material that is selectively adsorbed onto the metal film. In the insulating material depositing step, after the protective film forming step, an insulating material is deposited on the surface of the insulating film using an atomic layer deposition method. In the protective film removing step, the protective film is removed from the surface of the metal film after the insulating material depositing step. In the metal material depositing step, a metal material is deposited on the metal film after the protective film removing step.Type: ApplicationFiled: July 13, 2020Publication date: October 6, 2022Inventors: Koukichi HIROSHIRO, Makoto MURAMATSU, Koji KAGAWA, Kenji SEKIGUCHI
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Publication number: 20220213382Abstract: A substrate processing method includes holding a substrate; and supplying an etching liquid to the substrate held in the holding of the substrate. The etching liquid contains an etching agent configured to etch a metal-based first material and a silicon-based second material exposed on the substrate and a protection agent configured to react with the second material between the first material and the second material to form a protection layer on a surface of the second material. Here, the etching agent is a liquid which contains fluorine atoms and an organic solvent and substantially does not contain water, and the protection layer protects the second material from etching with the etching agent.Type: ApplicationFiled: March 14, 2022Publication date: July 7, 2022Inventors: Koukichi Hiroshiro, Tetsuya Sakazaki, Koji Kagawa, Kenji Sekiguchi, Kazuyoshi Mizumoto
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Patent number: 11306249Abstract: A substrate processing method includes holding a substrate; and supplying an etching liquid to the substrate held in the holding of the substrate. The etching liquid contains an etching agent configured to etch a metal-based first material and a silicon-based second material exposed on the substrate and a protection agent configured to react with the second material between the first material and the second material to form a protection layer on a surface of the second material. Here, the etching agent is a liquid which contains fluorine atoms and an organic solvent and substantially does not contain water, and the protection layer protects the second material from etching with the etching agent.Type: GrantFiled: January 23, 2019Date of Patent: April 19, 2022Assignee: TOKYO ELECTRON LIMITEDInventors: Koukichi Hiroshiro, Tetsuya Sakazaki, Koji Kagawa, Kenji Sekiguchi, Kazuyoshi Mizumoto
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Publication number: 20210391539Abstract: A method of processing a substrate includes loading the substrate to which a processing liquid is adhered, inside a processing container, removing the processing liquid adhering to the substrate by supplying a first organic solvent to the loaded substrate, causing the substrate to be water-repellent by supplying a water repellent to the substrate from which the processing liquid has been removed, supplying a second organic solvent to the water-repellent substrate, and drying the substrate by volatilizing the second organic solvent adhering to the substrate.Type: ApplicationFiled: June 2, 2021Publication date: December 16, 2021Inventors: Koukichi HIROSHIRO, Jun NONAKA, Kazuya KOYAMA, Mitsunori NAKAMORI
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Patent number: 11049723Abstract: A substrate processing method includes: maintaining an atmosphere in contact with at least a surface of a substrate on which a first material that is a metal and a second material that is a material other than the first material are exposed, as a deoxidized atmosphere; supplying a film forming material, which selectively forms a film on the first material among the first material and the second material, to the surface of the substrate in a state where the deoxidized atmosphere is maintained by the maintaining; performing a surface treatment of the second material in a state where the film is formed on a surface of the first material supplied in the supplying the film forming material; and removing the film from the surface of the first material after the performing the surface treatment.Type: GrantFiled: January 8, 2020Date of Patent: June 29, 2021Assignee: TOKYO ELECTRON LIMITEDInventors: Koukichi Hiroshiro, Rintaro Higuchi, Koji Kagawa, Kenji Sekiguchi
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Publication number: 20210032537Abstract: A substrate processing method includes holding a substrate; and supplying an etching liquid to the substrate held in the holding of the substrate. The etching liquid contains an etching agent configured to etch a metal-based first material and a silicon-based second material exposed on the substrate and a protection agent configured to react with the second material between the first material and the second material to form a protection layer on a surface of the second material. Here, the etching agent is a liquid which contains fluorine atoms and an organic solvent and substantially does not contain water, and the protection layer protects the second material from etching with the etching agent.Type: ApplicationFiled: January 23, 2019Publication date: February 4, 2021Inventors: Koukichi Hiroshiro, Tetsuya Sakazaki, Koji Kagawa, Kenji Sekiguchi, Kazuyoshi Mizumoto
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Publication number: 20200219730Abstract: A substrate processing method includes: maintaining an atmosphere in contact with at least a surface of a substrate on which a first material that is a metal and a second material that is a material other than the first material are exposed, as a deoxidized atmosphere; supplying a film forming material, which selectively forms a film on the first material among the first material and the second material, to the surface of the substrate in a state where the deoxidized atmosphere is maintained by the maintaining; performing a surface treatment of the second material in a state where the film is formed on a surface of the first material supplied in the supplying the film forming material; and removing the film from the surface of the first material after the performing the surface treatment.Type: ApplicationFiled: January 8, 2020Publication date: July 9, 2020Inventors: Koukichi Hiroshiro, Rintaro Higuchi, Koji Kagawa, Kenji Sekiguchi
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Patent number: 9415356Abstract: The present invention provides a chemical-liquid mixing method and a chemical-liquid mixing apparatus capable of sufficiently generating a peroxomonosulfuric acid that is effective in removing a resist from a substrate, when a sulfuric acid and a hydrogen peroxide solution are mixed with each other. At first, an inner tank 10 is filled up with a sulfuric acid and the sulfuric acid overflowing from the inner tank 10 is allowed to flow into an outer tank 12. Then, a hydrogen peroxide solution is supplied into the inner tank 10 and the hydrogen peroxide solution is allowed to flow into the outer tank 12 whereby the two kinds of liquids of the hydrogen peroxide solution and the sulfuric acid are stored in the outer tank 12. Simultaneously when the hydrogen peroxide solution flows into the outer tank 12, a return pump 16 is activated.Type: GrantFiled: April 15, 2016Date of Patent: August 16, 2016Assignee: TOKYO ELECTRON LIMITEDInventors: Hiroshi Tanaka, Koukichi Hiroshiro, Fumihiro Kamimura
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Publication number: 20160228832Abstract: The present invention provides a chemical-liquid mixing method and a chemical-liquid mixing apparatus capable of sufficiently generating a peroxomonosulfuric acid that is effective in removing a resist from a substrate, when a sulfuric acid and a hydrogen peroxide solution are mixed with each other. At first, an inner tank 10 is filled up with a sulfuric acid and the sulfuric acid overflowing from the inner tank 10 is allowed to flow into an outer tank 12. Then, a hydrogen peroxide solution is supplied Into the inner tank 10 and the hydrogen peroxide solution is allowed to flow into the outer tank 12 whereby the two kinds of liquids of the hydrogen peroxide solution and the sulfuric acid are stored in the outer tank 12. Simultaneously when the hydrogen peroxide solution flows into the outer tank 12, a return pump 16 is activated.Type: ApplicationFiled: April 15, 2016Publication date: August 11, 2016Applicant: TOKYO ELECTRON LIMITEDInventors: Hiroshi TANAKA, Koukichi HIROSHIRO, Fumihiro KAMIMURA
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Patent number: 9339775Abstract: The present invention provides a chemical-liquid mixing method and a chemical-liquid mixing apparatus capable of sufficiently generating a peroxornonosulfuric acid that is effective in removing a resist from a substrate, when a sulfuric acid and a hydrogen peroxide solution are mixed with each other. At first, an inner tank 10 is filled up with a sulfuric acid and the sulfuric acid overflowing from the inner tank 10 is allowed to flow into an outer tank 12. Then, a hydrogen peroxide solution is supplied into the inner tank 10 and the hydrogen peroxide solution is allowed to flow into the outer tank 12 whereby the two kinds of liquids of the hydrogen peroxide solution and the sulfuric acid are stored in the outer tank 12. Simultaneously when the hydrogen peroxide solution flows into the outer tank 12, a return pump 16 is activated.Type: GrantFiled: June 25, 2015Date of Patent: May 17, 2016Assignee: TOKYO ELECTRON LIMITEDInventors: Hiroshi Tanaka, Koukichi Hiroshiro, Fumihiro Kamimura
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Publication number: 20150290599Abstract: The present invention provides a chemical-liquid mixing method and a chemical-liquid mixing apparatus capable of sufficiently generating a peroxornonosulfuric acid that is effective in removing a resist from a substrate, when a sulfuric acid and a hydrogen peroxide solution are mixed with each other. At first, an inner tank 10 is filled up with a sulfuric acid and the sulfuric acid overflowing from the inner tank 10 is allowed to flow into an outer tank 12. Then, a hydrogen peroxide solution is supplied into the inner tank 10 and the hydrogen peroxide solution is allowed to flow into the outer tank 12 whereby the two kinds of liquids of the hydrogen peroxide solution and the sulfuric acid are stored in the outer tank 12. Simultaneously when the hydrogen peroxide solution flows into the outer tank 12, a return pump 16 is activated.Type: ApplicationFiled: June 25, 2015Publication date: October 15, 2015Applicant: TOKYO ELECTRON LIMITEDInventors: Hiroshi TANAKA, Koukichi HIROSHIRO, Fumihiro KAMIMURA
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Patent number: 9099502Abstract: The present invention provides a chemical-liquid mixing method and a chemical-liquid mixing apparatus capable of sufficiently generating a peroxomonosulfuric acid that is effective in removing a resist from a substrate, when a sulfuric acid and a hydrogen peroxide solution are mixed with each other. At first, an inner tank 10 is filled up with a sulfuric acid and the sulfuric acid overflowing from the inner tank 10 is allowed to flow into an outer tank 12. Then, a hydrogen peroxide solution is supplied into the inner tank 10 and the hydrogen peroxide solution is allowed to flow into the outer tank 12 whereby the two kinds of liquids of the hydrogen peroxide solution and the sulfuric acid are stored in the outer tank 12. Simultaneously when the hydrogen peroxide solution flows into the outer tank 12, a return pump 16 is activated.Type: GrantFiled: August 1, 2007Date of Patent: August 4, 2015Assignee: TOKYO ELECTRON LIMITEDInventors: Hiroshi Tanaka, Koukichi Hiroshiro, Fumihiro Kamimura
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Patent number: 8701308Abstract: A fluid heater includes a duct pipe through which a fluid to be heated flows, and a heating part configured to heat the duct pipe. One or more fillers is provided inside the duct pipe. A substrate processing apparatus includes: a supply source configured to supply a liquid of a volatile organic solvent; the aforementioned fluid heater configured to heat the liquid of the organic solvent supplied by the supply source so as to generate a steam of the organic solvent; and a chamber configured to accommodate a substrate W and to dry the substrate W accommodated therein, to which the steam of the organic solvent generated by the fluid heater is supplied.Type: GrantFiled: February 12, 2009Date of Patent: April 22, 2014Assignee: Tokyo Electron LimitedInventors: Koukichi Hiroshiro, Takayuki Toshima
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Patent number: 8522712Abstract: In a template treatment of forming a film of a release agent on a treatment surface of a template, the treatment surface of the template is first cleaned. Thereafter, in a coating unit, the release agent is applied to the treatment surface of the template. The release agent on the template is then dried. Then, alcohol is applied to the release agent on the template to make the release agent adhere to the treatment surface of the template and to remove an unreacted portion of the release agent. Thereafter, the alcohol on the template is dried and removed. In this manner, a film of the release agent is formed in a predetermined film thickness on the treatment surface of the template.Type: GrantFiled: November 10, 2010Date of Patent: September 3, 2013Assignee: Tokyo Electron LimitedInventors: Koukichi Hiroshiro, Takanori Nishi, Takahiro Kitano, Shoichi Terada
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Patent number: 8468943Abstract: The present invention provides a method for applying an application liquid between a template and a substrate, and transferring the transfer pattern onto the application liquid. The template is inclinedly arranged with respect to the substrate in a manner that a first distance between a first end portion of the template and the substrate is a distance that causes a capillary action of the application liquid to occur, and a second distance between a second end portion of the template that opposes the first end portion and the substrate is a distance that does not cause the capillary action of the application liquid to occur. Thereafter, the application liquid is supplied from an outer side of the first end portion to the first end portion. Thereafter, the second end portion and the substrate are relatively moved so that the second distance becomes equal to the first distance.Type: GrantFiled: August 25, 2010Date of Patent: June 25, 2013Assignee: Tokyo Electron LimitedInventors: Koukichi Hiroshiro, Takanori Nishi, Shoichi Terada, Takahiro Kitano
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Patent number: 8303724Abstract: Disclosed is a substrate processing apparatus for cleaning and drying a substrate such as a semiconductor wafer. This substrate processing apparatus includes a liquid processing unit for processing a substrate by immersing the substrate in stored purified water, a drying unit arranged above the liquid processing unit and configured to dry the substrate, a substrate transfer apparatus for transferring the substrate between the liquid processing unit and drying unit, a fluid supply mechanism for supplying a fluid mixture containing vapor or mist of purified water and vapor or mist of a volatile organic solvent to the drying unit, and a controller for controlling the supply of the fluid mixture.Type: GrantFiled: August 9, 2011Date of Patent: November 6, 2012Assignee: Tokyo Electron LimitedInventors: Koukichi Hiroshiro, Yuji Kamikawa, Takayuki Toshima, Naoki Shindo
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Publication number: 20120152136Abstract: The present invention provides a method for applying an application liquid between a template and a substrate, and transferring the transfer pattern onto the application liquid. The template is inclinedly arranged with respect to the substrate in a manner that a first distance between a first end portion of the template and the substrate is a distance that causes a capillary action of the application liquid to occur, and a second distance between a second end portion of the template that opposes the first end portion and the substrate is a distance that does not cause the capillary action of the application liquid to occur. Thereafter, the application liquid is supplied from an outer side of the first end portion to the first end portion. Thereafter, the second end portion and the substrate are relatively moved so that the second distance becomes equal to the first distance.Type: ApplicationFiled: August 25, 2010Publication date: June 21, 2012Applicant: Tokyo Electron LimitedInventors: Koukichi Hiroshiro, Takanori Nishi, Shoichi Terada, Takahiro Kitano
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Patent number: 8152928Abstract: A substrate cleaning method can uniformly removing particles from substrates at a high removing efficiency. The substrate cleaning method includes the steps of immersing substrates W in a cleaning liquid in a cleaning tank 12, and generating ultrasonic waves in the cleaning liquid contained in the cleaning tank. A region in the cleaning tank toward which the cleaning liquid is supplied is varied with respect to a vertical level in the step of generating ultrasonic waves in the cleaning liquid while the cleaning liquid is being supplied into the cleaning tank.Type: GrantFiled: May 15, 2007Date of Patent: April 10, 2012Assignee: Tokyo Electron LimitedInventors: Tsukasa Watanabe, Naoki Shindo, Koukichi Hiroshiro, Yuji Kamikawa