Patents by Inventor Kouroche Kian
Kouroche Kian has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8062445Abstract: A method of making a radio frequency identification (RFID) device includes temporarily adhering an RFID interposer to an antenna, and subsequently ultrasonically welding the interposer leads to the antenna. The temporary adhering may involve use of any of variety of suitable adhering materials, such as an adhesive, wax, or even water. The adhering and the ultrasonic welding may be parts of a process that involves mostly continuous movement of an antenna web that has multiple antennas on it. The adhering material temporarily holds the interposer in place prior to the ultrasonic welding, which is important in a process that involves a moving web. The adhering may be such that there is no material between the conductive material interposer leads, and conductive material of the antenna. This allows the ultrasonic welding to proceed without any need to push intervening material aside.Type: GrantFiled: August 6, 2007Date of Patent: November 22, 2011Assignee: Avery Dennison CorporationInventor: Kouroche Kian
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Patent number: 7989313Abstract: A process is disclosed for creating semiconductor devices such as RFID assemblies wherein an array of dies mounted to a substrate is spaced apart at a first pitch, and the substrate is removed after the positions of the dies in the array is fixed by a solidifiable substance. The solidifiable substance is then removed without changing the relative positions of the dies in the array. All or a selected portion of the array of dies is then electrically attached to a plurality of straps or interposers arranged in a corresponding array. The spacing, or pitch, between the dies in the die array may be changed before or after the substrate is removed to match the pitch of the straps or interposers in the corresponding array. An RFID device created using the process inventive is also disclosed.Type: GrantFiled: April 16, 2008Date of Patent: August 2, 2011Assignee: Avery Dennison CorporationInventors: Haochuan Wang, Ali Mehrabi, Kouroche Kian, Dave N. Edwards, Akiko Tanabe, Mark Licon, Jay Akhave
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Patent number: 7560303Abstract: A method for assembling a semiconductor device including the steps of providing a penetrable substrate having an adhesive surface and a plurality of dies disposed on the adhesive surface; providing a strap lead substrate having a plurality of strap leads disposed thereon; dispensing a first plurality of strap leads from the plurality of strap leads; providing a plurality of pins; bringing the penetrable substrate into close proximity with the strap lead substrate so as to bringing the first plurality of strap leads into contact with the plurality of dies; pressing the first plurality of strap leads against the plurality of dies using the plurality of pins; and, moving the penetrable substrate away from the strap lead substrate while using the plurality of pins to maintain contact between the first plurality of strap leads and the plurality of dies. An apparatus for assembling a semiconductor device is also disclosed.Type: GrantFiled: November 7, 2006Date of Patent: July 14, 2009Assignee: Avery Dennison CorporationInventors: Haochuan Wang, Ali Mehrabi, Kouroche Kian, Xiaoming He, Stephen Li
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Publication number: 20090038735Abstract: A method of making a radio frequency identification (RFID) device includes temporarily adhering an RFID interposer to an antenna, and subsequently ultrasonically welding the interposer leads to the antenna. The temporary adhering may involve use of any of variety of suitable adhering materials, such as an adhesive, wax, or even water. The adhering and the ultrasonic welding may be parts of a process that involves mostly continuous movement of an antenna web that has multiple antennas on it. The adhering material temporarily holds the interposer in place prior to the ultrasonic welding, which is important in a process that involves a moving web. The adhering may be such that there is no material between the conductive material interposer leads, and conductive material of the antenna. This allows the ultrasonic welding to proceed without any need to push intervening material aside.Type: ApplicationFiled: August 6, 2007Publication date: February 12, 2009Inventor: Kouroche Kian
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Publication number: 20080194059Abstract: A process is disclosed for creating semiconductor devices such as RFID assemblies wherein an array of dies mounted to a substrate is spaced apart at a first pitch, and the substrate is removed after the positions of the dies in the array is fixed by a solidifiable substance. The solidifiable substance is then removed without changing the relative positions of the dies in the array. All or a selected portion of the array of dies is then electrically attached to a plurality of straps or interposers arranged in a corresponding array. The spacing, or pitch, between the dies in the die array may be changed before or after the substrate is removed to match the pitch of the straps or interposers in the corresponding array. An RFID device created using the process inventive is also disclosed.Type: ApplicationFiled: April 16, 2008Publication date: August 14, 2008Inventors: Haochuan Wang, Ali Mehrabi, Kouroche Kian, Dave N. Edwards, Akiko Tanabe, Mark Licon, Jay Akhave
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Publication number: 20080122119Abstract: A method for creating a plurality of semiconductor assemblies that includes the steps of creating a plurality of quasi-wafers, each quasi-wafer comprising a plurality of semiconductor devices; transferring the plurality of semiconductor devices on each quasi-wafers onto a carrier having a functional adhesive; and bonding the plurality of semiconductor devices to a substrate.Type: ApplicationFiled: August 31, 2006Publication date: May 29, 2008Applicant: AVERY DENNISON CORPORATIONInventors: Kouroche Kian, Xiaoming He, Ali Mehrabi, Haochuan Wang
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Publication number: 20080124842Abstract: A method for assembling a semiconductor device including the steps of providing a penetrable substrate having an adhesive surface and a plurality of dies disposed on the adhesive surface; providing a strap lead substrate having a plurality of strap leads disposed thereon; dispensing a first plurality of strap leads from the plurality of strap leads; providing a plurality of pins; bringing the penetrable substrate into close proximity with the strap lead substrate so as to bringing the first plurality of strap leads into contact with the plurality of dies; pressing the first plurality of strap leads against the plurality of dies using the plurality of pins; and, moving the penetrable substrate away from the strap lead substrate while using the plurality of pins to maintain contact between the first plurality of strap leads and the plurality of dies. An apparatus for assembling a semiconductor device is also disclosed.Type: ApplicationFiled: November 7, 2006Publication date: May 29, 2008Applicant: AVERY DENNISON CORPORATIONInventors: Haochuan Wang, Ali Mehrabi, Kouroche Kian, Xiaoming He, Stephen Li
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Patent number: 7364983Abstract: A process is disclosed for creating semiconductor devices such as RFID assemblies wherein an array of dies mounted to a substrate is spaced apart at a first pitch, and the substrate is removed after the positions of the dies in the array is fixed by a solidifiable substance. The solidifiable substance is then removed without changing the relative positions of the dies in the array. All or a selected portion of the array of dies is then electrically attached to a plurality of straps or interposers arranged in a corresponding array. The spacing, or pitch, between the dies in the die array may be changed before or after the substrate is removed to match the pitch of the straps or interposers in the corresponding array. An RFID device created using the process inventive is also disclosed.Type: GrantFiled: May 4, 2005Date of Patent: April 29, 2008Assignee: Avery Dennison CorporationInventors: Haochuan Wang, Ali Mehrabi, Kouroche Kian, Dave N. Edwards, Akiko Tanabe, Mark Licon, Jay Akhave
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Publication number: 20080060750Abstract: A method for assembling a semiconductor device from a plurality of chips is disclosed. The method includes providing a penetrable carrier having a penetrable carrier substrate and an adhesive layer; providing a plurality of chips disposed on a surface of the adhesive layer; providing a second substrate; bringing the surface of the adhesive layer of the penetrable carrier close to the second substrate; pinning the plurality of chips against the second substrate through the penetrable carrier; and, moving the penetrable carrier away from the second substrate such that the plurality of pinned chips are removed from the surface of the adhesive layer on the penetrable carrier.Type: ApplicationFiled: August 31, 2006Publication date: March 13, 2008Applicant: AVERY DENNISON CORPORATIONInventors: Haochuan Wang, Ali Mehrabi, Stephen Li, Kouroche Kian, Xiaoming He, Peikang Liu
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Publication number: 20060264006Abstract: A process is disclosed for creating semiconductor devices such as RFID assemblies wherein an array of dies is spaced apart at a pitch matching the pitch of straps on a web of straps before they are mounted to a chip carrier substrate. The substrate is then cut into strips to form one or more linear aggregations of dies. The linear aggregation of dies is then transferred by an assembly mechanism onto the web of straps and electrically attached to a plurality of straps or interposers arranged in a corresponding array. The spacing, or pitch, between the dies in the die array may be changed to match the pitch of the straps or interposers in the corresponding array before or after a wafer substrate is removed from the die array. An RFID device created using the process inventive is also disclosed.Type: ApplicationFiled: May 19, 2006Publication date: November 23, 2006Applicant: AVERY DENNISON CORPORATIONInventors: Kouroche Kian, Xiao He
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Publication number: 20060252182Abstract: A process is disclosed for creating semiconductor devices such as RFID assemblies wherein an array of dies mounted to a substrate is spaced apart at a first pitch, and the substrate is removed after the positions of the dies in the array is fixed by a solidifiable substance. The solidifiable substance is then removed without changing the relative positions of the dies in the array. All or a selected portion of the array of dies is then electrically attached to a plurality of straps or interposers arranged in a corresponding array. The spacing, or pitch, between the dies in the die array may be changed before or after the substrate is removed to match the pitch of the straps or interposers in the corresponding array. An RFID device created using the process inventive is also disclosed.Type: ApplicationFiled: May 4, 2005Publication date: November 9, 2006Applicant: AVERY DENNISON CORPORATIONInventors: Haochuan Wang, Ali Mehrabi, Kouroche Kian, Dave Edwards, Akiko Tanabe, Mark Licon, Jay Akhave
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Publication number: 20050282355Abstract: A method of thermocompressive bonding of one or more electrical devices using individual heating elements and a resilient member to force the individual heating elements into compressive engagement with the electrical devices is provided. The individual heating elements may be Curie-point heating elements or conventional resistive heating elements. A method of thermocompressive bonding of one or more electrical devices using a transparent flexible platen and thermal radiation is also provided. In one embodiment, the thermal radiation is near infra-red thermal radiation and the transparent flexible platen is composed of silicone rubber. The bonding material may be an adhesive or a thermoplastic bonding material. A method of capacitively coupling a semiconductor chip to an electrical component with a pressure sensitive adhesive is also provided. The method includes compressing the chip by forcing a flexible platen of a bonding device into compressive engagement with the semiconductor chip.Type: ApplicationFiled: June 18, 2004Publication date: December 22, 2005Inventors: David Edwards, Jason Munn, Kouroche Kian, Reza Mehrabi, Ian Forster, Thomas Weakley
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Patent number: 6762124Abstract: A method for patterning a multilayered conductor/substrate structure includes the steps of: providing a multilayered conductor/substrate structure which includes a plastic substrate and at least one conductive layer overlying the plastic substrate; and irradiating the multilayered conductor/substrate structure with ultraviolet radiation such that portions of the at least one conductive layer are ablated therefrom. In a preferred embodiment, a projection-type excimer laser system is employed to rapidly and precisely ablate a pattern from a mask into the at least one conductive layer. Preferably, the excimer laser is controlled in consideration of how well the at least one conductive layer absorbs radiation at particular wavelengths. Preferably, a fluence of the excimer laser is controlled in consideration of an ablation threshold level of at least one conductive layer.Type: GrantFiled: February 14, 2001Date of Patent: July 13, 2004Assignee: Avery Dennison CorporationInventors: Kouroche Kian, Ramin Heydarpour
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Patent number: 6602790Abstract: A method for patterning a multilayered conductor/substrate structure includes the steps of: providing a multilayered conductor/substrate structure which includes a plastic substrate and at least one conductive layer overlying the plastic substrate; and irradiating the multilayered conductor/substrate structure with ultraviolet radiation such that portions of the at least one conductive layer are ablated therefrom. In a preferred embodiment, a projection-type excimer laser system is employed to rapidly and precisely ablate a pattern from a mask into the at least one conductive layer. Preferably, the excimer laser is controlled in consideration of how well the at least one conductive layer absorbs radiation at particular wavelengths. Preferably, a fluence of the excimer laser is controlled in consideration of an ablation threshold level of at least one conductive layer.Type: GrantFiled: November 13, 2001Date of Patent: August 5, 2003Assignee: Avery Dennison CorporationInventors: Kouroche Kian, Ramin Heydarpour
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Publication number: 20030092267Abstract: A method for patterning a multilayered conductor/substrate structure includes the steps of: providing a multilayered conductor/substrate structure which includes a plastic substrate and at least one conductive layer overlying the plastic substrate; and irradiating the multilayered conductor/substrate structure with ultraviolet radiation such that portions of the at least one conductive layer are ablated therefrom. In a preferred embodiment, a projection-type excimer laser system is employed to rapidly and precisely ablate a pattern from a mask into the at least one conductive layer. Preferably, the excimer laser is controlled in consideration of how well the at least one conductive layer absorbs radiation at particular wavelengths. Preferably, a fluence of the excimer laser is controlled in consideration of an ablation threshold level of at least one conductive layer.Type: ApplicationFiled: November 13, 2001Publication date: May 15, 2003Applicant: Avery Dennison CorporationInventors: Kouroche Kian, Ramin Heydarpour
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Publication number: 20020110673Abstract: Multilayered electrode/substrate structures and display devices incorporating the same include a plastic substrate and at least one conductive layer overlying the plastic substrate. The at least one conductive layer is laser-etched into discrete conductive elements. In a preferred embodiment, the multilayered electrode/substrate structure includes a flexible “glass replacement” structure or composite which incorporates one or more functional layers therein. One or more functional layers of the multilayered electrode/substrate structure serve to insulate, promote adhesion, protect layers underneath from laser irradiation, provide protection from environmental damage, and/or provide protection from structural damage.Type: ApplicationFiled: February 14, 2001Publication date: August 15, 2002Inventors: Ramin Heydarpour, Ming Kun Shi, Kouroche Kian, Kuolih Tsai
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Publication number: 20020110944Abstract: A method for patterning a multilayered conductor/substrate structure includes the steps of: providing a multilayered conductor/substrate structure which includes a plastic substrate and at least one conductive layer overlying the plastic substrate; and irradiating the multilayered conductor/substrate structure with ultraviolet radiation such that portions of the at least one conductive layer are ablated therefrom. In a preferred embodiment, a projection-type excimer laser system is employed to rapidly and precisely ablate a pattern from a mask into the at least one conductive layer. Preferably, the excimer laser is controlled in consideration of how well the at least one conductive layer absorbs radiation at particular wavelengths. Preferably, a fluence of the excimer laser is controlled in consideration of an ablation threshold level of at least one conductive layer.Type: ApplicationFiled: February 14, 2001Publication date: August 15, 2002Inventors: Kouroche Kian, Ramin Heydarpour
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Patent number: RE44071Abstract: A method for patterning a multilayered conductor/substrate structure includes the steps of: providing a multilayered conductor/substrate structure which includes a plastic substrate and at least one conductive layer overlying the plastic substrate; and irradiating the multilayered conductor/substrate structure with ultraviolet radiation such that portions of the at least one conductive layer are ablated therefrom. In a preferred embodiment, a projection-type excimer laser system is employed to rapidly and precisely ablate a pattern from a mask into the at least one conductive layer. Preferably, the excimer laser is controlled in consideration of how well the at least one conductive layer absorbs radiation at particular wavelengths. Preferably, a fluence of the excimer laser is controlled in consideration of an ablation threshold level of at least one conductive layer.Type: GrantFiled: July 13, 2006Date of Patent: March 12, 2013Assignee: Streaming Sales LLCInventors: Kouroche Kian, Ramin Heydarpour