Patents by Inventor Koushiro Hamaguchi

Koushiro Hamaguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8920894
    Abstract: Disclosed is a vulcanized rubber laminate, wherein a thermoplastic resin layer and an unvulcanized epichlorohydrin rubber composition layer containing a specific maleimide compound, vulcanizing agent, and acid acceptor are heated and bonded. Specifically disclosed is a laminate configured by heating and bonding an unvulcanized epichlorohydrin rubber composition layer (A) and a thermoplastic resin (B), wherein the unvulcanized epichlorohydrin rubber composition contains: an epichlorohydrin rubber (a), a compound containing one or more maleimide group within the molecule (b), a vulcanizing agent (c), and an acid acceptor (d).
    Type: Grant
    Filed: June 1, 2010
    Date of Patent: December 30, 2014
    Assignee: Daiso Co., Ltd.
    Inventors: Toyofumi Otaka, Koushiro Hamaguchi, Yoritaka Yasuda, Taro Ozaki
  • Patent number: 8871118
    Abstract: The present invention provides a rubber composition, which realizes low hardness and low compression set while maintaining semi-conductivity, and a vulcanizate thereof. Also the rubber composition can be obtained by blending an epichlorohydrin-based rubber having satisfactory semi-conductivity and an acrylonitrile-butadiene-based rubber as a reactive plasticizer, and also blending zinc oxide, a thiuram-based compound and a quinoxaline-based compound.
    Type: Grant
    Filed: October 28, 2009
    Date of Patent: October 28, 2014
    Assignee: Daiso Co., Ltd.
    Inventors: Yoritaka Yasuda, Toyofumi Otaka, Tadahiro Ono, Koushiro Hamaguchi
  • Publication number: 20120141712
    Abstract: Disclosed is a vulcanized rubber laminate, wherein a thermoplastic resin layer and an unvulcanized epichlorohydrin rubber composition layer containing a specific maleimide compound, vulcanizing agent, and acid acceptor are heated and bonded. Specifically disclosed is a laminate configured by heating and bonding an unvulcanized epichlorohydrin rubber composition layer (A) and a thermoplastic resin (B), wherein the unvulcanized epichlorohydrin rubber composition contains: an epichlorohydrin rubber (a), a compound containing one or more maleimide group within the molecule (b), a vulcanizing agent (c), and an acid acceptor (d).
    Type: Application
    Filed: June 1, 2010
    Publication date: June 7, 2012
    Applicant: DAISO CO., LTD.
    Inventors: Toyofumi Otaka, Koushiro Hamaguchi, Yoritaka Yasuda, Taro Ozaki
  • Publication number: 20110210296
    Abstract: The present invention provides a rubber composition, which realizes low hardness and low compression set while maintaining semi-conductivity, and a vulcanizate thereof. Also the rubber composition can be obtained by blending an epichlorohydrin-based rubber having satisfactory semi-conductivity and an acrylonitrile-butadiene-based rubber as a reactive plasticizer, and also blending zinc oxide, a thiuram-based compound and a quinoxaline-based compound.
    Type: Application
    Filed: October 28, 2009
    Publication date: September 1, 2011
    Applicant: DAISO CO., LTD.
    Inventors: Yoritaka Yasuda, Toyofumi Otaka, Tadahiro Ono, Koushiro Hamaguchi