Patents by Inventor Kousik Ganesan

Kousik Ganesan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190103348
    Abstract: According to various embodiments of the present disclosure, a substrate for an integrated circuit includes a dielectric layer. The substrate further includes a conductive layer extending in an x or y direction. The conductive layer is at least partially embedded within the dielectric layer. The conductive layer includes a via having a first end and an opposite second end. The via has a first height in a z-direction and a constant cross-sectional shape between the first end and the second end. A trace is adjacent to the via and has a second height in the z-direction that is different than the first height.
    Type: Application
    Filed: September 29, 2017
    Publication date: April 4, 2019
    Inventors: Rahul N. Manepalli, Kousik Ganesan, Marcel Arlan Wall, Srinivas Pietambaram
  • Publication number: 20180038007
    Abstract: In one aspect, an apparatus includes a plating cell, a degassing device configured to remove oxygen from the plating solution prior to the plating solution flowing into the plating cell; an oxidation station configured to increase an oxidizing strength of the plating solution after the plating solution flows out of the plating cell; and a controller. The controller includes program instructions for causing a process that includes operations of: reducing an oxygen concentration of the plating solution where the plating solution contains a plating accelerator; then, contacting a wafer substrate with the plating solution having reduced oxygen concentration and electroplating a metal such that the electroplating causes a net conversion of the accelerator to a less-oxidized accelerator species within the plating cell; then increasing the oxidizing strength of the plating solution causing a net re-conversion of the less-oxidized accelerator species back to the accelerator outside the plating cell.
    Type: Application
    Filed: October 16, 2017
    Publication date: February 8, 2018
    Inventors: Kousik Ganesan, Tighe A. Spurlin, Jonathan David Reid, Shantinath Ghongadi, Andrew John McKerrow, James E. Duncan
  • Patent number: 9816193
    Abstract: Methods, systems, and apparatus for plating a metal onto a work piece with a plating solution having a low oxygen concentration are described. In one aspect, a method includes reducing an oxygen concentration of a plating solution. The plating solution includes about 100 parts per million or less of an accelerator. After reducing the oxygen concentration of the plating solution, a wafer substrate is contacted with the plating solution in a plating cell. The oxygen concentration of the plating solution in the plating cell is about 1 part per million or less. A metal is electroplated with the plating solution onto the wafer substrate in the plating cell. After electroplating the metal onto the wafer substrate, an oxidizing strength of the plating solution is increased.
    Type: Grant
    Filed: December 13, 2011
    Date of Patent: November 14, 2017
    Assignee: Novellus Systems, Inc.
    Inventors: Kousik Ganesan, Tighe Spurlin, Jonathan D. Reid, Shantinath Ghongadi, Andrew McKerrow, James E. Duncan
  • Patent number: 9685353
    Abstract: Chemical etching methods and associated modules for performing the removal of metal from the edge bevel region of a semiconductor wafer are described. The methods and systems provide the thin layer of pre-rinsing liquid before applying etchant at the edge bevel region of the wafer. The etchant is less diluted and diffuses faster through a thinned layer of rinsing liquid. An edge bevel removal embodiment involving that is particularly effective at reducing process time, narrowing the metal taper and allowing for subsequent chemical mechanical polishing, is disclosed.
    Type: Grant
    Filed: April 5, 2013
    Date of Patent: June 20, 2017
    Assignee: Novellus Systems, Inc.
    Inventors: Kousik Ganesan, Shantinath Ghongadi, Tariq Majid, Aaron Labrie, Steven T. Mayer
  • Patent number: 9138784
    Abstract: An apparatus for conditioning deionized water and delivering it to a semiconductor wafer in a post electrofill module includes a degassing station configured to remove dissolved gas from the deionized water flow, a heating station configured to heat the deionized water flow, and a nozzle configured to deliver the deionized water flow to the wafer. The heating and degassing are performed before the delivery of the deionized water flow to the wafer. In some implementations the degassing station includes a contact degasser or an inert gas bubbler, and the heating station is configured to heating the deionized water flow to a temperature of between about 35-40° C. In some embodiments the deionized water flow is passed through the degassing station before being passed through the heating station.
    Type: Grant
    Filed: December 6, 2010
    Date of Patent: September 22, 2015
    Assignee: Novellus Systems, Inc.
    Inventors: Jeffrey Alan Hawkins, Charles Lorenzo Merrill, Jason Daniel Marchetti, Kousik Ganesan, Bryan L. Buckalew
  • Publication number: 20140190529
    Abstract: Chemical etching methods and associated modules for performing the removal of metal from the edge bevel region of a semiconductor wafer are described. The methods and systems provide the thin layer of pre-rinsing liquid before applying etchant at the edge bevel region of the wafer. The etchant is less diluted and diffuses faster through a thinned layer of rinsing liquid. An edge bevel removal embodiment involving that is particularly effective at reducing process time, narrowing the metal taper and allowing for subsequent chemical mechanical polishing, is disclosed.
    Type: Application
    Filed: April 5, 2013
    Publication date: July 10, 2014
    Inventors: Kousik Ganesan, Shanthinath Ghongadi, Tariq Majid, Aaron Labrie, Steven T. Mayer
  • Patent number: 8540857
    Abstract: An apparatus for electroplating a layer of metal onto a work piece surface includes a membrane separating the chamber of the apparatus into a catholyte chamber and an anolyte chamber. In the catholyte chamber is a catholyte manifold region that includes a catholyte manifold and at least one flow distribution tube. The catholyte manifold and at least one flow distribution tube serve to mix and direct catholyte flow in the catholyte chamber. The provided configuration effectively reduces failure and improves the operational ranges of the apparatus.
    Type: Grant
    Filed: August 9, 2012
    Date of Patent: September 24, 2013
    Assignee: Novellus Systems, Inc.
    Inventors: Steven Mayer, Shantinath Ghongadi, Kousik Ganesan, Zhian He, Jingbin Feng
  • Patent number: 8419964
    Abstract: Chemical etching methods and associated modules for performing the removal of metal from the edge bevel region of a semiconductor wafer are described. The methods and systems provide the thin layer of pre-rinsing liquid before applying etchant at the edge bevel region of the wafer. The etchant is less diluted and diffuses faster through a thinned layer of rinsing liquid. An edge bevel removal embodiment involving that is particularly effective at reducing process time, narrowing the metal taper and allowing for subsequent chemical mechanical polishing, is disclosed.
    Type: Grant
    Filed: August 27, 2008
    Date of Patent: April 16, 2013
    Assignee: Novellus Systems, Inc.
    Inventors: Kousik Ganesan, Shanthinath Ghongadi, Tariq Majid, Aaron Labrie, Steven T. Mayer
  • Patent number: 8398831
    Abstract: Embodiments of a closed-contact electroplating cup assembly that may be rapidly cleaned while an electroplating system is on-line are disclosed. One disclosed embodiment comprises a cup assembly and a cone assembly, wherein the cup assembly comprises a cup bottom comprising an opening, a seal surrounding the opening, an electrical contact structure comprising a plurality of electrical contacts disposed around the opening, and an interior cup side that is tapered inwardly in along an axial direction of the cup from a cup top toward the cup bottom.
    Type: Grant
    Filed: April 4, 2011
    Date of Patent: March 19, 2013
    Assignee: Novellus Systems, Inc.
    Inventors: Shantinath Ghongadi, Robert Rash, Jeff Hawkins, Seshasayee Varadarajan, Tariq Majid, Kousik Ganesan, Bryan Buckalew, Brian Evans
  • Patent number: 8377268
    Abstract: Embodiments of a closed-contact electroplating cup are disclosed. One embodiment comprises a cup bottom comprising an opening, and a seal disposed on the cup bottom around the opening. The seal comprises a wafer-contacting peak located substantially at an inner edge of the seal. The embodiment also comprises an electrical contact structure disposed over a portion of the seal, wherein the electrical contact structure comprises an outer ring and a plurality of contacts extending inwardly from the outer ring, and wherein each contact has a generally flat wafer-contacting surface. The embodiment further comprises a wafer-centering mechanism configured to center a wafer in the cup.
    Type: Grant
    Filed: June 6, 2011
    Date of Patent: February 19, 2013
    Assignee: Novellus Systems, Inc.
    Inventors: Robert Rash, Shantinath Ghongadi, Kousik Ganesan, Zhian He, Tariq Majid, Jeff Hawkins, Seshasayee Varadarajan, Bryan Buckalew
  • Patent number: 8262871
    Abstract: An apparatus for electroplating a layer of metal onto a work piece surface includes a membrane separating the chamber of the apparatus into a catholyte chamber and an anolyte chamber. In the catholyte chamber is a catholyte manifold region that includes a catholyte manifold and at least one flow distribution tube. The catholyte manifold and at least one flow distribution tube serve to mix and direct catholyte flow in the catholyte chamber. The provided configuration effectively reduces failure and improves the operational ranges of the apparatus.
    Type: Grant
    Filed: December 17, 2009
    Date of Patent: September 11, 2012
    Assignee: Novellus Systems, Inc.
    Inventors: Steven T. Mayer, Shantinath Ghongadi, Kousik Ganesan, Zhian He, Jingbin Feng
  • Publication number: 20120181170
    Abstract: Methods, apparatuses, and various apparatus components, such as base plates, lipseals, and contact ring assemblies are provided for reducing contamination of the contact area in the apparatuses. Contamination may happen during removal of semiconductor wafers from apparatuses after the electroplating process. In certain embodiments, a base plate with a hydrophobic coating, such as polyamide-imide (PAI) and sometimes polytetrafluoroethylene (PTFE), are used. Further, contact tips of the contact ring assembly may be positioned further away from the sealing lip of the lipseal. In certain embodiments, a portion of the contact ring assembly and/or the lipseal also include hydrophobic coatings.
    Type: Application
    Filed: March 28, 2012
    Publication date: July 19, 2012
    Inventors: Vinay Prabhakar, Bryan L. Buckalew, Kousik Ganesan, Shantinath Ghongadi, Zhian He, Steven T. Mayer, Robert Rash, Jonathan D. Reid, Yuichi Takada, James R. Zibrida
  • Publication number: 20120175263
    Abstract: Methods, systems, and apparatus for plating a metal onto a work piece with a plating solution having a low oxygen concentration are described. In one aspect, a method includes reducing an oxygen concentration of a plating solution. The plating solution includes about 100 parts per million or less of an accelerator. After reducing the oxygen concentration of the plating solution, a wafer substrate is contacted with the plating solution in a plating cell. The oxygen concentration of the plating solution in the plating cell is about 1 part per million or less. A metal is electroplated with the plating solution onto the wafer substrate in the plating cell. After electroplating the metal onto the wafer substrate, an oxidizing strength of the plating solution is increased.
    Type: Application
    Filed: December 13, 2011
    Publication date: July 12, 2012
    Inventors: Kousik GANESAN, Tighe SPURLIN, Jonathan D. REID, Shantinath GHONGADI, Andrew McKERROW, James E. DUNCAN
  • Patent number: 8172992
    Abstract: Methods, apparatuses, and various apparatus components, such as base plates, lipseals, and contact ring assemblies are provided for reducing contamination of the contact area in the apparatuses. Contamination may happen during removal of semiconductor wafers from apparatuses after the electroplating process. In certain embodiments, a base plate with a hydrophobic coating, such as polyamide-imide (PAI) and sometimes polytetrafluoroethylene (PTFE), are used. Further, contact tips of the contact ring assembly may be positioned further away from the sealing lip of the lipseal. In certain embodiments, a portion of the contact ring assembly and/or the lipseal also include hydrophobic coatings.
    Type: Grant
    Filed: December 8, 2009
    Date of Patent: May 8, 2012
    Assignee: Novellus Systems, Inc.
    Inventors: Vinay Prabhakar, Bryan L. Buckalew, Kousik Ganesan, Shantinath Ghongadi, Zhian He, Steven T. Mayer, Robert Rash, Jonathan D. Reid, Yuichi Takada, James R. Zibrida
  • Patent number: 8172646
    Abstract: Provided are magnetically actuated wafer chucks that permit a wafer to be clamped or unclamped at any time during a process and at any rotational speed, as desired. Such wafer chucks may include constraining members that are movable between open and closed positions. In a closed position, a constraining member aligns the wafer after wafer handoff and/or clamps the wafer during rotation to prevent it from flying off the chuck. In an open position, the constraining member moves away from the wafer to allow liquid etchant to flow from the wafer edge without obstruction. The constraining members may be, for example, cams, attached to arms or links of the chuck. The cams or other constraining members move between open and closed positions by self-balancing forces including a first force, such as a spring force, that acts to move a cam in a first direction, and a non-contact actuate-able force, such as a magnetic force, that acts to move the cam in the opposite direction.
    Type: Grant
    Filed: February 27, 2009
    Date of Patent: May 8, 2012
    Assignee: Novellus Systems, Inc.
    Inventors: Jingbin Feng, Aaron LaBrie, Kousik Ganesan
  • Publication number: 20110233056
    Abstract: Embodiments of a closed-contact electroplating cup are disclosed. One embodiment comprises a cup bottom comprising an opening, and a seal disposed on the cup bottom around the opening. The seal comprises a wafer-contacting peak located substantially at an inner edge of the seal. The embodiment also comprises an electrical contact structure disposed over a portion of the seal, wherein the electrical contact structure comprises an outer ring and a plurality of contacts extending inwardly from the outer ring, and wherein each contact has a generally flat wafer-contacting surface. The embodiment further comprises a wafer-centering mechanism configured to center a wafer in the cup.
    Type: Application
    Filed: June 6, 2011
    Publication date: September 29, 2011
    Applicant: NOVELLUS SYSTEMS, INC.
    Inventors: Robert Rash, Shantinath Ghongadi, Kousik Ganesan, Zhian He, Tariq Majid, Jeff Hawkins, Seshasayee Varadarajan, Bryan Buckalew
  • Publication number: 20110181000
    Abstract: Embodiments of a closed-contact electroplating cup assembly that may be rapidly cleaned while an electroplating system is on-line are disclosed. One disclosed embodiment comprises a cup assembly and a cone assembly, wherein the cup assembly comprises a cup bottom comprising an opening, a seal surrounding the opening, an electrical contact structure comprising a plurality of electrical contacts disposed around the opening, and an interior cup side that is tapered inwardly in along an axial direction of the cup from a cup top toward the cup bottom.
    Type: Application
    Filed: April 4, 2011
    Publication date: July 28, 2011
    Applicant: NOVELLUS SYSTEMS, INC.
    Inventors: Shantinath Ghongadi, Robert Rash, Jeff Hawkins, Seshasayee Varadarajan, Tariq Majid, Kousik Ganesan, Bryan Buckalew, Brian Evans
  • Patent number: 7985325
    Abstract: Embodiments of a closed-contact electroplating cup are disclosed. One embodiment comprises a cup bottom comprising an opening, and a seal disposed on the cup bottom around the opening. The seal comprises a wafer-contacting peak located substantially at an inner edge of the seal. The embodiment also comprises an electrical contact structure disposed over a portion of the seal, wherein the electrical contact structure comprises an outer ring and a plurality of contacts extending inwardly from the outer ring, and wherein each contact has a generally flat wafer-contacting surface. The embodiment further comprises a wafer-centering mechanism configured to center a wafer in the cup.
    Type: Grant
    Filed: October 30, 2007
    Date of Patent: July 26, 2011
    Assignee: Novellus Systems, Inc.
    Inventors: Robert Rash, Shantinath Ghongadi, Kousik Ganesan, Zhian He, Tariq Majid, Jeff Hawkins, Seshasayee Varadarajan, Bryan Buckalew
  • Patent number: 7935231
    Abstract: Embodiments of a closed-contact electroplating cup assembly that may be rapidly cleaned while an electroplating system is on-line are disclosed. One disclosed embodiment comprises a cup assembly and a cone assembly, wherein the cup assembly comprises a cup bottom comprising an opening, a seal surrounding the opening, an electrical contact structure comprising a plurality of electrical contacts disposed around the opening, and an interior cup side that is tapered inwardly in along an axial direction of the cup from a cup top toward the cup bottom.
    Type: Grant
    Filed: October 31, 2007
    Date of Patent: May 3, 2011
    Assignee: Novellus Systems, Inc.
    Inventors: Shantinath Ghongadi, Robert Rash, Jeff Hawkins, Seshasayee Varadarajan, Tariq Majid, Kousik Ganesan, Bryan Buckalew, Brian Evans
  • Publication number: 20100219920
    Abstract: Provided are magnetically actuated wafer chucks that permit a wafer to be clamped or undamped at any time during a process and at any rotational speed, as desired. Such wafer chucks may include constraining members that are movable between open and closed positions. In a closed position, a constraining member aligns the wafer after wafer handoff and/or clamps the wafer during rotation to prevent it from flying off the chuck. In an open position, the constraining member moves away from the wafer to allow liquid etchant to flow from the wafer edge without obstruction. The constraining members may be, for example, cams, attached to arms or links of the chuck. The cams or other constraining members move between open and closed positions by self-balancing forces including a first force, such as a spring force, that acts to move a cam in a first direction, and a non-contact actuate-able force, such as a magnetic force, that acts to move the cam in the opposite direction.
    Type: Application
    Filed: February 27, 2009
    Publication date: September 2, 2010
    Applicant: Novellus Systems, Inc.
    Inventors: Jingbin Feng, Aaron LaBrie, Kousik Ganesan