Patents by Inventor Kousuke Azuma

Kousuke Azuma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200292514
    Abstract: A plant monitoring apparatus 100 includes: a soil state estimation unit 200 that estimates a state of soil by, with use of frequency association information calculated based on vibration measured via the soil, referencing soil state estimation information in which the frequency association information and information indicating states of the soil are associated with soil states; and a plant state estimation unit 300 that estimates a state of a plant by, with use of growth association information that was calculated based on vibration of the plant and indicates growth of the plant, referencing plant state estimation information in which the growth association information and information indicating states of the plant above a plant soil surface are associated with plant states above the plant soil surface.
    Type: Application
    Filed: March 13, 2020
    Publication date: September 17, 2020
    Applicant: NEC CORPORATION
    Inventors: Tan Azuma, Yusuke Kikuchi, Kousuke Ishida, Shunsuke Akimoto, Kenichiro Fujiyama, Shinji Oominato
  • Publication number: 20200292502
    Abstract: A plant monitoring apparatus 1 includes: an extraction unit 2 that extracts a feature amount in a frequency response of vibration of a target plant with use of the vibration; a calculation unit 3 that calculates a change that indicates growth of the plant, based on the extracted feature amount and a reference feature amount that corresponds to a reference state of the plant; and an estimation unit 4 that estimates a state of the plant by, with use of the calculated change, referencing state information in which changes of the feature amount from the reference feature amount corresponding to growth of the plant are associated with states of the plant.
    Type: Application
    Filed: March 13, 2020
    Publication date: September 17, 2020
    Applicant: NEC CORPORATION
    Inventors: Tan AZUMA, Yusuke KIKUCHI, Kousuke ISHIDA, Shunsuke AKIMOTO, Kenichiro FUJIYAMA, Shinji OOMINATO
  • Publication number: 20200292517
    Abstract: A soil condition estimation apparatus 1 includes a selection unit 2 that, by using a propagation time that vibrations take to propagate through a soil, selects vibrations measured from the soil, according the depth of the soil; an extraction unit 3 that extracts a feature of the selected vibrations; and an estimation unit 4 that estimates conditions of the soil by referencing soil estimation information in which the feature and conditions of the soil are associated with each other, using the feature.
    Type: Application
    Filed: March 6, 2020
    Publication date: September 17, 2020
    Applicant: NEC CORPORATION
    Inventors: Tan AZUMA, Yusuke KIKUCHI, Kousuke ISHIDA, Shunsuke AKIMOTO, Kenichiro FUJIYAMA, Shinji OOMINATO
  • Publication number: 20010002067
    Abstract: The present invention provides a resin-encapsulated semiconductor device having inner leads and at least a heat spreader, wherein at least an electrical insulator is provided between the inner leads and the heat spreader, or wherein suspension pins for suspending an island mounting a semiconductor device are formed to have a lower level than the inner leads, or wherein the heat spreader has a fixing means for fixing the heat spreader over position, or wherein the heat spreader has an elevated center region having a light level than a peripheral region of the heat spreader.
    Type: Application
    Filed: November 29, 2000
    Publication date: May 31, 2001
    Applicant: NEC CORPORATION
    Inventor: Kousuke Azuma
  • Patent number: 5766649
    Abstract: There is provided a mold die set for molding a package body which is composed of a lead frame and a semiconductor chip mounted on the lead frame, and the lead frame has a hole. The mold die set is composed of an upper mold die and a lower mold die and the package body being clamped by the upper mold die and the lower mold die. The lower mold die includes a runner section, a table section connected to the runner section and protruding from a bottom of the runner section, a lower concave section connected to the table section, and a lower gate disposed between the table section and the lower concave section.
    Type: Grant
    Filed: November 21, 1996
    Date of Patent: June 16, 1998
    Assignee: NEC Corporation
    Inventor: Kousuke Azuma
  • Patent number: 5635220
    Abstract: A molding die for sealing a semiconductor element with a resin includes an upper and a lower mold half. A leadframe having a resin passage aperture is sandwiched between the lower mold half and the upper mold half. The lower mold half has a lower runner space, a lower cavity, and a lower gate provided between the lower runner space and the lower cavity. The upper mold half has an upper resin well, an upper cavity, and an upper gate provided between the resin well and the upper cavity. The length of the upper resin well in the direction of the flow of resin is equal to or greater than the distance from the lower gate to the front edge of a lower runner rising slope, to thereby obtain a final product which is free from resin burrs formed in the upper resin well.
    Type: Grant
    Filed: September 19, 1995
    Date of Patent: June 3, 1997
    Assignee: NEC Corporation
    Inventors: Atsuhiko Izumi, Takehito Inaba, Kousuke Azuma