Patents by Inventor Kousuke Hiroki

Kousuke Hiroki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Magnetic particle dispersion
    Patent number: 11320430
    Abstract: The present invention relates to a magnetic particle dispersion, and the magnetic particle dispersion includes a magnetic particle, an isothiazoline compound, and an aqueous medium.
    Type: Grant
    Filed: December 27, 2017
    Date of Patent: May 3, 2022
    Assignees: JSR CORPORATION, JSR LIFE SCIENCES CORPORATION, JSR Life Sciences, LLC, JSR Micro N.V.
    Inventors: Hirokazu Kai, Kousuke Hiroki, Yuuichi Ueya
  • MAGNETIC PARTICLE DISPERSION
    Publication number: 20190271696
    Abstract: The present invention relates to a magnetic particle dispersion, and the magnetic particle dispersion includes a magnetic particle, an isothiazoline compound, and an aqueous medium.
    Type: Application
    Filed: December 27, 2017
    Publication date: September 5, 2019
    Applicants: JSR CORPORATION, JSR LIFE SCIENCES CORPORATION, JSR Micro, Inc., JSR Micro N.V.
    Inventors: Hirokazu KAI, Kousuke HIROKI, Yuuichi UEYA
  • Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof
    Patent number: 8028402
    Abstract: Disclosed is a manufacturing method of a multi-layer wiring board, which method includes: preparing connection boards, the connection boards having respectively an insulating resin composition layer, a connection conductor formed so as to pass through the insulating resin composition layer and a conductor circuit formed on the insulating resin composition layer and connected to the connection conductor; aligning the connection boards; and laminating the aligned connection boards by heating and pressing, so that the connection conductors, or the connection conductor and the conductor circuit, are conductively connected with each other, and the connection boards are mechanically connected with each other by the insulating resin composition layer. The connection boards are formed by specified processing, including use of a three-layer composite metallic layer.
    Type: Grant
    Filed: July 10, 2007
    Date of Patent: October 4, 2011
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Hidehiro Nakamura, Akishi Nakaso, Shigeharu Arike, Fumio Inoue, Tetsuya Enomoto, Norio Moriike, Kousuke Hiroki
  • Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof
    Publication number: 20090008141
    Abstract: The present invention provides a connection board that is formed by an insulating resin composition layer made of one layer or two or more layers and a connection conductor that is formed so as to pass through the insulating resin composition layer in its thickness direction at a position where a conductor circuit is connected, and a multi-layer wiring board, a substrate for semiconductor package and a semiconductor package using the connection board, and methods for manufacturing them.
    Type: Application
    Filed: September 2, 2008
    Publication date: January 8, 2009
    Inventors: Hidehiro Nakamura, Akishi Nakaso, Shigeharu Arike, Fumio Inoue, Tetsuya Enomoto, Norio Moriike, Kousuke Hiroki
  • CONNECTION BOARD, AND MULTI-LAYER WIRING BOARD, SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE USING CONNECTION BOARD, AND MANUFACTURING METHOD THEREOF
    Publication number: 20080289868
    Abstract: The present invention provides a connection board that is formed by an insulating resin composition layer made of one layer or two or more layers and a connection conductor that is formed so as to pass through the insulating resin composition layer in its thickness direction at a position where a conductor circuit is connected, and a multi-layer wiring board, a substrate for semiconductor package and a semiconductor package using the connection board, and methods for manufacturing them.
    Type: Application
    Filed: July 30, 2008
    Publication date: November 27, 2008
    Inventors: Hidehiro Nakamura, Akishi Nakaso, Shigeharu Arike, Fumio Inoue, Tetsuya Enomoto, Norio Moriike, Kousuke Hiroki
  • CONNECTION BOARD, AND MULTI-LAYER WIRING BOARD, SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE USING CONNECTION BOARD, AND MANUFACTURING METHOD THEREOF
    Publication number: 20080010819
    Abstract: The present invention provides a connection board that is formed by an insulating resin composition layer made of one layer or two or more layers and a connection conductor that is formed so as to pass through the insulating resin composition layer in its thickness direction at a position where a conductor circuit is connected, and a multi-layer wiring board, a substrate for semiconductor package and a semiconductor package using the connection board, and methods for manufacturing them.
    Type: Application
    Filed: July 10, 2007
    Publication date: January 17, 2008
    Inventors: Hidehiro NAKAMURA, Akishi Nakaso, Shigeharu Arike, Fumio Inoue, Tetsuya Enomoto, Norio Moriike, Kousuke Hiroki
  • Connection substrate, multi-layer wiring board using the connection substrate, substrate for semiconductor package, and methods for manufacturing them
    Publication number: 20060162956
    Abstract: The present invention provides a connection board that is formed by an insulating resin composition layer made of one layer or two or more layers and a connection conductor that is formed so as to pass through the insulating resin composition layer in its thickness direction at a position where a conductor circuit is connected, and a multi-layer wiring board, a substrate for semiconductor package and a semiconductor package using the connection board, and methods for manufacturing them.
    Type: Application
    Filed: December 24, 2002
    Publication date: July 27, 2006
    Inventors: Hidehiro Nakamura, Akishi Nakaso, Shigeharu Arike, Fumio Inoue, Tetsduya Enomoto, Norio Moriike, Kousuke Hiroki