Abstract: Disclosed is a photosensitive resin composition which does not contain any halogenated compound or any antimony compound that has a high risk of putting a load on the environment, which exerts good flame retardancy after being cured, and which particularly meets the recent exacting requirements with respect to bending resistance and insulation reliability. Specifically disclosed is a photosensitive resin composition comprising: (A) a (meth)acrylate compound represented by the general formula (1); (B) a polyimide precursor; and (C) a photopolymerization initiator [in the formula, R1 represents a hydrogen atom or a methyl group; R2 represents a hydrogen atom or a univalent organic group; n and m independently represent an integer of 1 to 5; p represents an integer of 0 to 6; q and r independently represent an integer of 0 to 4; and s represent an integer of 0 to 6, provided that the sum of p, q, r and s is 6, and the sum total of p and s may range from 3 to 6 and is preferably 6].

Abstract: The invention provides a resin composition which develops excellent flame retardance after curing in spite of its being free from halogen-containing compounds and antimony compounds, which are liable to cause environmental load, and which can give a film meeting the recent sever demands for higher flexing resistance and insulation reliability. Specifically, the invention provides a resin composition which comprises (A) a polyimide precursor and (B) an adduct of an organophosphorus compound represented by formula (1) with a compound having four or more (meth)acrylate groups. It is preferable that the resin composition further contain (C) a phosphazene compound.

Abstract: A photosensitive resin composition which is effective in avoiding troubles in the step of plating with various metals in printed wiring board production, such as under-film metal deposition and film peeling, and which forms a wiring-protecting film excellent in adhesion, flexibility, insulation reliability, and heat resistance. The photosensitive resin composition comprises (A) a carboxylated polymer, (B) a compound having at least two photopolymerizable unsaturated double bonds, (C) a photopolymerization initiator, and (D) a nitrogen compound represented by a specific feature.

Abstract: A photosensitive resin composition which is effective in avoiding troubles in the step of plating with various metals in printed wiring board production, such as under-film metal deposition and film peeling, and which forms a wiring-protecting film excellent in adhesion, flexibility, insulation reliability, and heat resistance. The photosensitive resin composition comprises (A) a carboxylated polymer, (B) a compound having at least two photopolymerizable unsaturated double bonds, (C) a photopolymerization initiator, and (D) a nitrogen compound represented by a specific feature.

Abstract: Disclosed is a photosensitive resin composition which does not contain any halogenated compound or any antimony compound that has a high risk of putting a load on the environment, which exerts good flame retardancy after being cured, and which particularly meets the recent exacting requirements with respect to bending resistance and insulation reliability. Specifically disclosed is a photosensitive resin composition comprising: (A) a (meth)acrylate compound represented by the general formula (1); (B) a polyimide precursor; and (C) a photopolymerization initiator [in the formula, R1 represents a hydrogen atom or a methyl group; R2 represents a hydrogen atom or a univalent organic group; n and m independently represent an integer of 1 to 5; p represents an integer of 0 to 6; q and r independently represent an integer of 0 to 4; and s represent an integer of 0 to 6, provided that the sum of p, q, r and s is 6, and the sum total of p and s may range from 3 to 6 and is preferably 6].

Abstract: The invention provides a resin composition which develops excellent flame retardance after curing in spite of its being free from halogen-containing compounds and antimony compounds, which are liable to cause environmental load, and which can give a film meeting the recent sever demands for higher flexing resistance and insulation reliability. Specifically, the invention provides a resin composition which comprises (A) a polyimide precursor and (B) an adduct of an organophosphorus compound represented by formula (1) with a compound having four or more (meth)acrylate groups. It is preferable that the resin composition further contain (C) a phosphazene compound.

Abstract: The present invention is to provide a resin composition having sufficient rigidity and superior in the workability as well even if the thickness is as thin as 0.2 mm or less, and a prepreg and a laminate obtained from the resin composition. The resin composition comprises resin component containing a (A) compound having a maleimide group and (B) calcinated talc, wherein the calcinated talc is contained not less than 30 weight parts and not more than 250 weight parts to 100 weight parts of the total amount of the resin component containing a (A) compound having a maleimide group.

Abstract: The present invention is to provide a resin composition having sufficient rigidity and superior in the workability as well even if the thickness is as thin as 0.2 mm or less, and a prepreg and a laminate obtained from the resin composition. The resin composition comprises resin component containing a (A) compound having a maleimide group and (B) calcinated talc, wherein the calcinated talc is contained not less than 30 weight parts and not more than 250 weight parts to 100 weight parts of the total amount of the resin component containing a (A) compound having a maleimide group.

Abstract: The present invention is to provide a laminate which is halogen-free, has sufficient flame retardancy even when a thickness is not more than 0.2 mm, and has sufficient humidity resistance and hygroscopic solder heat resistance. A resin composition comprising: (A) a compound having at least two or more maleimide groups; (B) a phenolic resin; and (C) an epoxy resin; wherein at least one of said (B) or (C) has a naphthalene ring; the total weight of the naphthalene ring when calculated using the OH equivalent and epoxy equivalent of (B) and (C) respectively is not less than 20 weight % to the total weight of (A), (B) and (C) components; and the total sum of the content ratio of the (A) component and that of the naphthalene ring is not less than 65 weight % to the total weight of the (A), (B) and (C) components, and a prepreg and laminate obtained from the same.