Patents by Inventor Kousuke IGAWA

Kousuke IGAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230416434
    Abstract: An object of the present invention is to provide a light-curable resin composition having reduced soot residue at the time of mold preparation and reduced occurrence of cracks and fractures. The present invention has found that a light-curable resin composition including a (meth)acrylate-based UV-curable resin (A) (with proviso that the following compound (B) is omitted), and a compound (B) having an alkylene glycol skeleton represented by a specific chemical formula in a structure allows the soot residue at the time of mold preparation to be reduced and occurrence of cracks and fractures to be reduced, whereby the above object is achieved.
    Type: Application
    Filed: November 4, 2021
    Publication date: December 28, 2023
    Applicant: DIC Corporation
    Inventors: Kousuke IGAWA, Shigetoshi NISHIZAWA