Patents by Inventor Kousuke IKEDA

Kousuke IKEDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • RESIN COMPOSITION, CURED PRODUCT, SEALING MATERIAL, ADHESIVE, INSULATING MATERIAL, COATING MATERIAL, PREPREG, MULTILAYERED BODY, AND FIBER-REINFORCED COMPOSITE MATERIAL
    Publication number: 20230383047
    Abstract: Provided is a resin composition comprises a cyanate ester compound (A), an amine adduct compound (B) and a borate ester (C).
    Type: Application
    Filed: March 9, 2023
    Publication date: November 30, 2023
    Inventors: Kousuke IKEDA, Yoshihiro YASUDA, Masayuki KATAGIRI
  • Electronic device
    Patent number: 10950522
    Abstract: An electronic device has an electronic module having an insulating substrate 60, a conductor layer 20 provided on the insulating substrate 60, an electronic element 40 provided on the conductor layer 20 and a heat dissipation layer 10 provided on the insulating substrate in an opposite side of the electronic element 40 and a cooling body 100 which abuts on the heat dissipation layer 10. The cooling body 100 has a divided part 110 being provided at a portion which abuts on the heat dissipation layer 10 and being a plurality of divided regions.
    Type: Grant
    Filed: February 13, 2017
    Date of Patent: March 16, 2021
    Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
    Inventors: Junya Yuguchi, Kousuke Ikeda, Kenichi Suzuki
  • Electronic module
    Patent number: 10770439
    Abstract: An electronic module comprising a first electronic unit 51 which has a first insulating substrate 61 and a first electronic element 41 provided on the first insulating substrate 61 via a first conductor layer 21, a second electronic unit 52 which has a second insulating substrate 62 and a second electronic element 42 provided on the second insulating substrate 62 via a second conductor layer 22, a connecting body 29 provided between the first electronic unit 51 and the second electronic unit 52 and a coil 70 wound around the connecting body 29.
    Type: Grant
    Filed: February 13, 2017
    Date of Patent: September 8, 2020
    Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
    Inventors: Junya Yuguchi, Kousuke Ikeda, Kenichi Suzuki
  • ELECTRONIC DEVICE
    Publication number: 20200258813
    Abstract: An electronic device has an electronic module having an insulating substrate 60, a conductor layer 20 provided on the insulating substrate 60, an electronic element 40 provided on the conductor layer 20 and a heat dissipation layer 10 provided on the insulating substrate in an opposite side of the electronic element 40 and a cooling body 100 which abuts on the heat dissipation layer 10. The cooling body 100 has a divided part 110 being provided at a portion which abuts on the heat dissipation layer 10 and being a plurality of divided regions.
    Type: Application
    Filed: February 13, 2017
    Publication date: August 13, 2020
    Applicant: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
    Inventors: Junya YUGUCHI, Kousuke IKEDA, Kenichi SUZUKI
  • ELECTRONIC MODULE
    Publication number: 20200258851
    Abstract: An electronic module has an insulating substrate 60, a conductor layer 20 provided on the insulating substrate 60, an electronic element 40 provided on the conductor layer 20, and a heat radiation layer 10 provided on the insulating substrate 20 in an opposite side of the electronic element 40. The heat radiation layer 10 has a plurality of heat radiation layer patterns 15 divided in a plane direction.
    Type: Application
    Filed: February 13, 2017
    Publication date: August 13, 2020
    Applicant: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
    Inventors: Junya YUGUCHI, Kousuke IKEDA, Kenichi SUZUKI
  • ELECTRONIC MODULE
    Publication number: 20190057956
    Abstract: An electronic module comprising a first electronic unit 51 which has a first insulating substrate 61 and a first electronic element 41 provided on the first insulating substrate 61 via a first conductor layer 21, a second electronic unit 52 which has a second insulating substrate 62 and a second electronic element 42 provided on the second insulating substrate 62 via a second conductor layer 22, a connecting body 29 provided between the first electronic unit 51 and the second electronic unit 52 and a coil 70 wound around the connecting body 29.
    Type: Application
    Filed: February 13, 2017
    Publication date: February 21, 2019
    Applicant: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
    Inventors: Junya YUGUCHI, Kousuke IKEDA, Kenichi SUZUKI