Abstract: Provided is an electronic circuit substrate in which any excess space is not necessary around an electronic component, and position deviation at a time of mounting the electronic component can be prevented with high precision. An electronic circuit substrate 100 includes a printed wiring board 10 and an electronic component 20. The printed wiring board 10 has a first land 11 and a second land 12. The electronic component 20 has a first bond portion 24 which is bonded to the first land 11 with solder, and a second bond portion 25 which is bonded to the second land 12 with solder. The bond area of the first land 11 and the first bond portion 24 is larger than the bond area of the second land 12 and the second bond portion 25. In one direction D1, the position of an outer side edge 24b of the first bond portion 24 is set so as to match the position of the outer side edge 11b of the first land 11.

Abstract: Provided is an electronic circuit substrate in which any excess space is not necessary around an electronic component, and position deviation at a time of mounting the electronic component can be prevented with high precision. An electronic circuit substrate 100 includes a printed wiring board 10 and an electronic component 20. The printed wiring board 10 has a first land 11 and a second land 12. The electronic component 20 has a first bond portion 24 which is bonded to the first land 11 with solder, and a second bond portion 25 which is bonded to the second land 12 with solder. The bond area of the first land 11 and the first bond portion 24 is larger than the bond area of the second land 12 and the second bond portion 25. In one direction D1, the position of an outer side edge 24b of the first bond portion 24 is set so as to match the position of the outer side edge 11b of the first land 11.