Abstract: Provided are a composite molding composition such as a composite film and a composite fiber that have properties such as an improved tensile strength, strain and toughness as a result of blending a peptide or polyamino acid having a ?-sheet structure with a natural or artificially modified fibroin-derived protein; a method for producing such composite molding composition; and a method for improving the physical properties of a composite molding composition containing a fibroin-derived protein.

Abstract: Provided are a composite molding composition such as a composite film and a composite fiber that have properties such as an improved tensile strength, strain and toughness as a result of blending a peptide or polyamino acid having a ?-sheet structure with a natural or artificially modified fibroin-derived protein; a method for producing such composite molding composition; and a method for improving the physical properties of a composite molding composition containing a fibroin-derived protein.

Abstract: A sheet switch module including a circuit board (22), at least one key switch (25) disposed on the circuit board, and a flexible light guiding sheet (31) which is disposed on the key switch and configured to cover the circuit board, the light guiding sheet being configured to flexibly fit over and follow the shape of the key switch along an outer surface of the key switch, when the light guiding sheet is disposed on the circuit board.

Abstract: A light emitting diode comprising a light emitting diode element 20 mounted on a glass epoxy substrate 12, this light emitting diode element 20 being protected at its surface side by a resin seal member 33, in which: a light emitting diode element for blue luminescence, formed of gallium nitride type compound semiconductor is used as the above-mentioned light emitting diode element 20; and a fluorescent material containing layer 21 composed of a fluorescent material containing layer 21 composed of a fluorescent material dispersed into an adhesive is arranged on the back side of this light emitting diode element. On the back side of the light emitting diode element 20, blue luminescence is converted in wavelength to produce white luminescence of high intensity.

Abstract: A light emitting diode comprising a light emitting diode element 20 mounted on a glass epoxy substrate 12, this light emitting diode element 20 being protected at its surface side by a resin seal member 33, in which: a light emitting diode element for blue luminescence, formed of gallium nitride type compound semiconductor is used as the above-mentioned light emitting diode element 20; and a fluorescent material containing layer 21 composed of a fluorescent material containing layer 21 composed of a fluorescent material dispersed into an adhesive is arranged on the back side of this light emitting diode element. On the back side of the light emitting diode element 20, blue luminescence is converted in wavelength to produce white luminescence of high intensity.

Abstract: A light emitting diode 21 in which a through hole 25 is provided in a glass epoxy substrate 22 which extends from the upper surface 26a to the lower surface 26b thereof, a transparent resin section 27 is used to fill the through hole 25, a light emitting diode element 29 made of a gallium nitride based compound semiconductor with a transparent element substrate of sapphire glass 30 is fixed on top of the transparent resin section 27 using a transparent adhesive 37, and light blocking electrodes 33, 34 are provided on the upper surface of the light emitting diode element 29, and light emitted from the light emitting diode element 29 passes through the transparent resin section 27 and is guided out through a bottom surface 26b of the glass epoxy substrate 22.