Patents by Inventor Kousuke Yagi

Kousuke Yagi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and method of manufacturing the same
    Patent number: 6521509
    Abstract: A highly reliable semiconductor device is provided. A silicon nitride film having an opening is formed on a main surface of a silicon substrate. The opening is formed with a side surface. The silicon substrate is etched using the silicon nitride film as a mask to form a trench. The side surface of the silicon nitride film is altered in quality to form a silicon oxide film. A silicon oxide film filling the trench is formed in contact with the silicon oxide film. The silicon nitride film is removed with the silicon oxide film in contact with the silicon oxide film remaining.
    Type: Grant
    Filed: June 25, 2001
    Date of Patent: February 18, 2003
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Akinobu Teramoto, Kousuke Yagi, Hiroshi Umeda
  • Semiconductor device and method of manufacturing the same
    Publication number: 20020081818
    Abstract: A highly reliable semiconductor device is provided. A silicon nitride film having an opening is formed on a main surface of a silicon substrate. The opening is formed with a side surface. The silicon substrate is etched using the silicon nitride film as a mask to form a trench. The side surface of the silicon nitride film is altered in quality to form a silicon oxide film. A silicon oxide film filling the trench is formed in contact with the silicon oxide film. The silicon nitride film is removed with the silicon oxide film in contact with the silicon oxide film remaining.
    Type: Application
    Filed: June 25, 2001
    Publication date: June 27, 2002
    Applicant: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Akinobu Teramoto, Kousuke Yagi, Hiroshi Umeda
  • Molding compound for articles including a cellulose fiber and a method for molding the same
    Patent number: 6254814
    Abstract: There is disclosed a molding compound for making an article including a cellulose fiber, which is prepared by mixing a cellulose fiber added with at least starch, water and a long chain fatty acid salt of a non-alkali metal. There is also described a method for molding an article including a cellulose fiber by employing the above compound and, further, a mold for molding an article including a cellulose fiber with a cavity formed by a stationary side and a movable side which is used therefore.
    Type: Grant
    Filed: February 11, 1999
    Date of Patent: July 3, 2001
    Assignee: Daiho Industrial Co., Ltd.
    Inventors: Seiichi Ueda, Seio Higaki, Manabu Sudo, Kousuke Yagi, Masahiko Funaki