Abstract: According to one embodiment, in a defect inspection apparatus, a controller acquires an image of a second actual pattern in a first shot region which corresponds to a design pattern identical to a design pattern corresponding to a first actual pattern, which is consistent in a first comparison process, and which is consistent in a second comparison process. The controller replaces the image of one actual pattern of the first actual pattern and the second actual pattern in the first shot region with the image of the other actual pattern so as to generate a reference image of the first shot region. The controller compares the reference image and the image of the second shot region so as to perform a defect inspection of the second shot region.

Abstract: According to an embodiment, an inspection apparatus includes an irradiation mechanism, an imaging device, a movable mechanism, and a control processor. The irradiation mechanism irradiates an inspection target with light. The imaging device captures an image of the inspection target through a lens. The movable mechanism changes, with respect to an axis extending in an inspection direction for the inspection target, an angle between the lens and a horizontal plane or an angle between the imaging device and the horizontal plane such that a sample surface of the inspection target, a principal face of the lens, and an imaging face of the imaging device conform to the Scheimpflug principle. The control processor adjusts sensitivities in an image of the sample surface captured by the imaging device at different levels in the image depending on a position in a perpendicular direction to the inspection direction.

Abstract: According to one embodiment, in a defect inspection apparatus, a controller acquires an image of a second actual pattern in a first shot region which corresponds to a design pattern identical to a design pattern corresponding to a first actual pattern, which is consistent in a first comparison process, and which is consistent in a second comparison process. The controller replaces the image of one actual pattern of a first actual pattern and the second actual pattern in the first shot region with the image of the other actual pattern so as to generate a reference image of the first shot region. The controller compares a reference image and the image of the first shot region so as to perform a defect inspection of the first shot region.

Abstract: In accordance with an embodiment, a coordinate correcting method includes generating a pattern image for matching from an SEM image acquired by an electron microscope in accordance with a defect coordinate, performing matching between a defect image and the pattern image, superimposing the defect image and the pattern image between which the matching has been performed on a difference image, specifying a position to which a defect position on the difference image corresponds on the pattern image, and converting the corresponding position on the SEM image to a coordinate on a wafer. The defect coordinate, the defect image and the difference image are obtained by a defect inspection apparatus.