Patents by Inventor Koutaro DEGUCHI

Koutaro DEGUCHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Device mounting board, semiconductor module, and method for fabricating the device mounting board
    Patent number: 9271389
    Abstract: A device mounting board includes a metallic substrate, an oxide film formed such that the surfaces of the metallic form are oxidized, an insulating resin layer disposed on the oxide film facing one main surface of the metallic layer, and a wiring layer disposed on the insulating resin layer. The film thickness of a certain partial region of the oxide film disposed below a first semiconductor device is greater than that of the other regions surrounding the partial region of the oxide film. Conversely, the film thickness of the insulating resin layer underneath a second semiconductor device is less than that of the insulating resin layer underneath the first semiconductor device.
    Type: Grant
    Filed: November 25, 2013
    Date of Patent: February 23, 2016
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Yasuhiro Kohara, Masayuki Nagamatsu, Koutaro Deguchi
  • DEVICE MOUNTING BOARD, SEMICONDUCTOR MODULE, AND METHOD FOR FABRICATING THE DEVICE MOUNTING BOARD
    Publication number: 20140078687
    Abstract: A device mounting board includes a metallic substrate, an oxide film formed such that the surfaces of the metallic form are oxidized, an insulating resin layer disposed on the oxide film facing one main surface of the metallic layer, and a wiring layer disposed on the insulating resin layer. The film thickness of a certain partial region of the oxide film disposed below a first semiconductor device is greater than that of the other regions surrounding the partial region of the oxide film. Conversely, the film thickness of the insulating resin layer underneath a second semiconductor device is less than that of the insulating resin layer underneath the first semiconductor device.
    Type: Application
    Filed: November 25, 2013
    Publication date: March 20, 2014
    Applicant: SANYO ELECTRIC CO., LTD.
    Inventors: Yasuhiro KOHARA, Masayuki NAGAMATSU, Koutaro DEGUCHI