Abstract: A substrate includes: a first layer that is a ceramic insulation layer including a plurality of first through holes; and a second layer layered on the first layer, the second layer being a ceramic insulation layer including at least one second through hole. The plurality of first through holes each have a diameter of from 10 ?m to 50 ?m, and the diameter of the at least one second through hole is larger than the diameter of each of the plurality of first through holes. At least some of the plurality of first through holes overlap the at least one second through hole.

Abstract: A wiring conductor includes a first electrode located on a bottom surface of a recessed portion, a second electrode located on a first surface between a frame portion and the recessed portion, a first external electrode located on a second surface, and a second external electrode located on the second surface and electrically connected to the second electrode. A conductive sheet is electrically connected to the second electrode and extends over an opening of the recessed portion above the first surface.

Abstract: To realize a substrate shape capable of ensuring a required substrate thickness while improving acoustic characteristics. A package on which a microphone element is to be mounted, the package including a substrate includes at least one recessed portion in a region corresponding to a mounting portion of the microphone element in the package. A bottom surface of the recessed portion in the substrate is a thin plate portion that is thinner than thicknesses of other regions. The substrate includes a plurality of through holes in the thin plate portion.

Abstract: A photosensor package includes a wiring board having a first main surface, a second main surface opposite to the first main surface, a first pore and a second pore that extend therethrough from the first main surface to the second main surface, the first pore having first opening in the first main surface and a second opening in the second main surface, the second pore having a third opening in the first main surface and a fourth opening in the second main surface, the fourth opening accommodating a light-emitting element that includes a light-emitting part, and a recess in the second main surface by which the first pore and the second pore are in communication with each other, the recess accommodating a light-receiving element that includes a light-emitting part; and a plurality of external connection conductors on the wiring board.