Abstract: Disclosed is a workpiece processing apparatus that performs a predetermined processing on a workpiece. The workpiece processing apparatus includes: a workpiece table configured to place the workpiece thereon; a processor configured to process the workpiece placed on the workpiece table; a movement mechanism configured to relatively move the workpiece table and the processor; a position measuring device configured to measure a position of the movement mechanism; a detector configured to detect a position of the workpiece placed on the workpiece table; and a corrector configured to calculate a positional correction amount of the workpiece table based on a measurement result of the position measuring device and a detection result of the detector.

Abstract: A droplet ejecting apparatus includes a workpiece table configured to place a workpiece thereon, a droplet ejecting head configured to eject droplets onto the workpiece placed on the workpiece table, a Y-axis linear motor configured to move the workpiece table in a main scanning direction (Y-axis direction), a position detector configured to detect a position of a carriage mark, and a control unit configured to calculate the positional deviation amount in the main scanning direction between a detection position detected by the position detector and a reference position of the carriage mark and correct a droplet ejecting timing of the droplet ejecting head based on the positional deviation amount.

Abstract: Disclosed is a workpiece processing apparatus that performs a predetermined processing on a workpiece. The workpiece processing apparatus includes: a workpiece table configured to place the workpiece thereon; a processor configured to process the workpiece placed on the workpiece table; a movement mechanism configured to relatively move the workpiece table and the processor; a position measuring device configured to measure a position of the movement mechanism; a detector configured to detect a position of the workpiece placed on the workpiece table; and a corrector configured to calculate a positional correction amount of the workpiece table based on a measurement result of the position measuring device and a detection result of the detector.

Abstract: A droplet ejecting apparatus includes a workpiece table configured to place a workpiece thereon, a droplet ejecting head configured to eject droplets onto the workpiece placed on the workpiece table, a Y-axis linear motor configured to move the workpiece table in a main scanning direction (Y-axis direction), a position detector configured to detect a position of a carriage mark, and a control unit configured to calculate the positional deviation amount in the main scanning direction between a detection position detected by the position detector and a reference position of the carriage mark and correct a droplet ejecting timing of the droplet ejecting head based on the positional deviation amount.

Abstract: A local exposure method includes steps of: dividing a large block into a plurality of small blocks; setting irradiation illuminances different in a stepwise fashion; controlling light emission of light emitting elements based on the irradiation illuminances respectively set for the small blocks for a photosensitive film on a substrate moving with respect to light emitting elements; developing the photosensitive film having been subjected to exposure processing by irradiation by the light emitting elements; measuring a residual film thickness of the photosensitive film for each of the small blocks to obtain correlation data between the illuminance set for the small block and the residual film thickness; and obtaining a required illuminance of irradiation to each of the large blocks from a target residual film thickness of the photosensitive film set for each of the large blocks based on the correlation data.

Abstract: A local exposure method includes steps of: dividing a large block into a plurality of small blocks; setting irradiation illuminances different in a stepwise fashion; controlling light emission of light emitting elements based on the irradiation illuminances respectively set for the small blocks for a photosensitive film on a substrate moving with respect to light emitting elements; developing the photosensitive film having been subjected to exposure processing by irradiation by the light emitting elements; measuring a residual film thickness of the photosensitive film for each of the small blocks to obtain correlation data between the illuminance set for the small block and the residual film thickness; and obtaining a required illuminance of irradiation to each of the large blocks from a target residual film thickness of the photosensitive film set for each of the large blocks based on the correlation data.