Patents by Inventor Kouzi Eguchi

Kouzi Eguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Manufacturing method for a semiconductor device having a bias sputtered insulating film
    Patent number: 5182235
    Abstract: To cover a conductive interconnection (2) of a semiconductor device (1) at high speed with an insulating film (3) having good step coverage, a conductive dummy pattern (8) is provided around the interconnection (2) in spaced relationship therewith. The dummy pattern (8) and interconnection (2) are then covered with insulating film 3 using the bias sputtering method. The dummy pattern (8) and interconnection (2) are preferably applied simultaneously to the substrate using a single mask.
    Type: Grant
    Filed: May 22, 1991
    Date of Patent: January 26, 1993
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventor: Kouzi Eguchi
  • Semiconductor device
    Patent number: 5028982
    Abstract: To cover the interconnection (2) on a semiconductor device (1) at high speed with an insulating film (3) having good step coverage, a dummy pattern (8) is provided around the interconnection (2) and the dummy pattern (8) and the interconnection (2) are covered with the insulating film (3) using the bias sputtering method.
    Type: Grant
    Filed: June 8, 1987
    Date of Patent: July 2, 1991
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventor: Kouzi Eguchi
  • Semiconductor device and manufacturing method therefor
    Patent number: 5028981
    Abstract: To cover a conductive interconnection (2) of a semiconductor device (1) at high speed with an insulating film (3) having good step coverage, a conductive dummy pattern (8) is provided around the interconnection (2) in spaced relationship therewith. The dummy pattern (8) and interconnection (2) are then covered with insulating film 3 using the bias sputtering method. The dummy pattern (8) and interconnection (2) are preferably applied simultaneously to the substrate using a single mask.
    Type: Grant
    Filed: July 25, 1988
    Date of Patent: July 2, 1991
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventor: Kouzi Eguchi