Patents by Inventor Kouzou Hirokawa

Kouzou Hirokawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Epoxy resin composition for sealing photosemiconductor element and photosemiconductor device sealed with the epoxy resin composition
    Patent number: 5641840
    Abstract: An epoxy resin composition for sealing a photosemiconductor element includes(A) an epoxy resin component which comprises an epoxy resin having at least three epoxy groups per molecule,(B) a phenolic resin component which is represented by the following general formula (I) and has a phenolic hydroxyl group equivalent weight (g/eq) of 200 to 800, and(C) a cure accelerator component, ##STR1## wherein n is an integer of from 0 to 14, the phenolic resin component being a mixture of at least two phenolic resins represented by the general formula (I) with at least two different values of n, the resin with n=0 being not more than 20% by weight of the phenolic resin component;and a photosemiconductor device is sealed with the epoxy resin composition.
    Type: Grant
    Filed: May 16, 1996
    Date of Patent: June 24, 1997
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Satoru Tsuchida, Masahiko Osaka, Kouzou Hirokawa, Yasuaki Nakamura