Abstract: In a semiconductor package in which a cover and a substrate are combined with each other in a sealed state, metallized portions consisting of a material of a high solder wettability are provided on the joint surface, which is opposed to the substrate, of the cover, outer side surfaces of the cover, and the portions of the inner side surfaces of the cover which are in the vicinity of the joint surface. These metallized portions are formed so that the height thereof on the outer side surfaces of the cover is larger than that on the inner side surfaces thereof. The metallized portions on the outer side surfaces are formed so that the height thereof at the corner portions of the cover is larger than that at the intermediate portions of the four sides thereof, and the metallized portions on the inner side surfaces are formed so that the height thereof at the intermediate portions of the four sides of the cover is larger than that at the corner portions thereof.