Patents by Inventor Kouzou Matsusita

Kouzou Matsusita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus for inspecting wafer surface, method for inspecting wafer surface, apparatus for judging defective wafer, method for judging defective wafer, and apparatus for processing information on wafer surface
    Patent number: 7383156
    Abstract: It is possible to inspect scratches and staining on a wafer surface on the basis of an LPD map obtained from a particle counter 11, by providing a means 21 for detecting aggregation of clustered point defects (LPD) from two-dimensional distribution information 30 for such fine LPD on the surface of a silicon wafer, and an improvement in the inspection efficiency and the precision of judgements of “defective” status can be achieved. Furthermore, the system is devised so that the trend of generation of scratches and staining in a specified process can easily be detected by accumulating wafer surface information such as scratch information, staining information and the like for the wafer surface detected by a wafer surface inspection device 11 (especially as image information or numerical information), and superposing sets of information thus accumulated. Plans for improving processes can be made by both the wafer supplier and wafer consumer by sharing such information with both parties.
    Type: Grant
    Filed: September 5, 2001
    Date of Patent: June 3, 2008
    Assignee: Sumco Techxiv Kabushiki Kaisha
    Inventors: Kouzou Matsusita, Yukinori Matsumura, Tomikazu Tanuki, Mitsuo Terada, Kotaro Hori, Kiyoharu Miyakawa, Akira Nisi, Hirobumi Miwa
  • Apparatus for inspecting wafer surface, method for inspecting wafer surface, apparatus for judging defective wafer, method for judging defective wafer, and apparatus for processing information on wafer surface
    Publication number: 20040036863
    Abstract: It is possible to inspect scratches and staining on a wafer surface on the basis of an LPD map obtained from a particle counter 11, by providing a means 21 for detecting aggregation of clustered point defects (LPD) from two-dimensional distribution information 30 for such fine LPD on the surface of a silicon wafer, and an improvement in the inspection efficiency and the precision of judgements of “defective” status can be achieved. Furthermore, the system is devised so that the trend of generation of scratches and staining in a specified process can easily be detected by accumulating wafer surface information such as scratch information, staining information and the like for the wafer surface detected by a wafer surface inspection device 11 (especially as image information or numerical information), and superposing sets of information thus accumulated. Plans for improving processes can be made by both the wafer supplier and wafer consumer by sharing such information with both parties.
    Type: Application
    Filed: August 25, 2003
    Publication date: February 26, 2004
    Inventors: Kouzou Matsusita, Yukinori Matsumura, Tomikazu Tanuki, Mitsuo Terada, Kotaro Hori, Kiyoharu Miyakawa, Akira Nisi, Hirobumi Miwa