Patents by Inventor Kouzou Murakami

Kouzou Murakami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Surface acoustic wave device and method for producing the same
    Patent number: 6984540
    Abstract: A surface acoustic wave device includes a piezoelectric substrate, a first interdigital transducer and a second interdigital transducer formed on the substrate so that the first and second interdigital transducers are opposed to each other. The substrate includes a doping region that is doped with a substance in at least one form selected from the group consisting of atoms, molecules and clusters in a surface between the first and second interdigital transducers.
    Type: Grant
    Filed: July 23, 2003
    Date of Patent: January 10, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Mitihiko Takase, Michio Okajima, Akihisa Yoshida, Kentaro Setsune, Kouzou Murakami, Kunihiro Fujii
  • Surface acoustic wave device and method for producing the same
    Publication number: 20040095038
    Abstract: A surface acoustic wave device includes a piezoelectric substrate, a first interdigital transducer and a second interdigital transducer formed on the substrate so that the first and second interdigital transducers are opposed to each other. The substrate includes a doping region that is doped with a substance in at least one form selected from the group consisting of atoms, molecules and clusters in a surface between the first and second interdigital transducers.
    Type: Application
    Filed: July 23, 2003
    Publication date: May 20, 2004
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Mitihiko Takase, Michio Okajima, Akihisa Yoshida, Kentaro Setsune, Kouzou Murakami, Kunihiro Fujii
  • Surface acoustic wave device, method for producing the same, and circuit module using the same
    Patent number: 6710682
    Abstract: A surface acoustic wave device of the present invention includes a piezoelectric substrate, a plurality of comb electrodes for exciting a surface acoustic wave, disposed on a principal plane of the piezoelectric substrate, a plurality of bumps disposed on the principal plane, and an insulating sheet disposed so as to be opposed to the principal plane, wherein the bumps and the comb electrodes are connected electrically to each other, and the bumps penetrate through the insulating sheet.
    Type: Grant
    Filed: October 3, 2001
    Date of Patent: March 23, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Keiji Onishi, Akihiro Nanba, Hiroki Sato, Katsunori Moritoki, Yoshihiro Bessho, Kunihiro Fujii, Kouzou Murakami
  • Surface accoustic wave device, method for producing the same, and circuit module using the same
    Publication number: 20020101304
    Abstract: A surface acoustic wave device of the present invention includes a piezoelectric substrate, a plurality of comb electrodes for exciting a surface acoustic wave, disposed on a principal plane of the piezoelectric substrate, a plurality of bumps disposed on the principal plane, and an insulating sheet disposed so as to be opposed to the principal plane, wherein the bumps and the comb electrodes are connected electrically to each other, and the bumps penetrate through the insulating sheet.
    Type: Application
    Filed: October 3, 2001
    Publication date: August 1, 2002
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Keiji Onishi, Akihiro Nanba, Hiroki Sato, Katsunori Moritoki, Yoshihiro Bessho, Kunihiro Fujii, Kouzou Murakami