Patents by Inventor Kouzou Yamagishi

Kouzou Yamagishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6619132
    Abstract: A pressure sensor (1) has a circuit board (5) having a circuit portion (11) for amplifying an electric signal detected by a pressure detecting element (2C) and attached with an IC die (16), and a terminal (12) for inputting and outputting the electric signal from the circuit portion (11). The circuit portion (11) and the terminal (12) have a frame (11A, 12D) formed by a metal plate, the metal plate being provided with resin molds (14, 15). The circuit portion (11) and the terminal (12) are continuously formed, so that steps for soldering etc. is not necessary.
    Type: Grant
    Filed: January 31, 2002
    Date of Patent: September 16, 2003
    Assignee: Nagano Keiki Co., Ltd.
    Inventors: Atsushi Imai, Kouzou Yamagishi, Yoshihiro Tomomatsu
  • Patent number: 6584851
    Abstract: A pressure sensor has a joint (1) having a pressure port (13), a pressure detecting device (2) bonded to the joint (1) to convert fluid pressure to an electric signal and a housing (5) provided to an output side of the pressure detecting device (2), the pressure sensor further including a flange member (3) bonded to the joint (1) and having a through-hole (26) for the pressure detecting device (2) to be inserted and a connector (6) bonded to the flange member (3) to fix the housing (5).
    Type: Grant
    Filed: November 29, 2001
    Date of Patent: July 1, 2003
    Assignee: Nagano Keiki Co., Ltd.
    Inventors: Kouzou Yamagishi, Yoshihiro Tomomatsu, Atsushi Imai
  • Patent number: 6474170
    Abstract: A pipe having a through-hole of smaller diameter than a pressure port is disposed in the pressure port. Therefore, a volume of the pressure port can be reduced by the thickness of the pipe, thereby improving response of a pressure sensor. Furthermore, there is no need for the pressure port having smaller diameter to be provided by drill processing, so that a volume in the pressure port can be easily adjusted. Accordingly, the volume in the pressure port can be reduced with a simple structure to improve response of the pressure sensor.
    Type: Grant
    Filed: December 10, 1998
    Date of Patent: November 5, 2002
    Assignee: Nagano Keiki Co., Ltd.
    Inventors: Kouzou Yamagishi, Toshiaki Okumura, Kunihiro Yamaura, Takayuki Yokoyama, Kenji Kobayashi
  • Publication number: 20020100331
    Abstract: A pressure sensor (1) has a circuit board (5) having a circuit portion (11) for amplifying an electric signal detected by a pressure detecting element (2C) and attached with an IC die (16), and a terminal (12) for inputting and outputting the electric signal from the circuit portion (11). The circuit portion (11) and the terminal (12) have a frame (11A, 12D) formed by a metal plate, the metal plate being provided with resin molds (14, 15). The circuit portion (11) and the terminal (12) are continuously formed, so that steps for soldering etc. is not necessary.
    Type: Application
    Filed: January 31, 2002
    Publication date: August 1, 2002
    Inventors: Atsushi Imai, Kouzou Yamagishi, Yoshihiro Tomomatsu
  • Publication number: 20020062697
    Abstract: A pressure sensor has a joint (1) having a pressure port (13), a pressure detecting device (2) bonded to the joint (1) to convert fluid pressure to an electric signal and a housing (5) provided to an output side of the pressure detecting device (2), the pressure sensor further including a flange member (3) bonded to the joint (1) and having a through-hole (26) for the pressure detecting device (2) to be inserted and a connector (6) bonded to the flange member (3) to fix the housing (5).
    Type: Application
    Filed: November 29, 2001
    Publication date: May 30, 2002
    Inventors: Kouzou Yamagishi, Yoshihiro Tomomatsu, Atsushi Imai
  • Patent number: 6298730
    Abstract: A pressure sensor (1) having a first terminal (35), the first terminal (35) including a horizontal portion (61) and a vertical portion (62) at an intermediate portion thereof and being elastically deformable. A portion of the first terminal (35) being inserted and soldered to a circuit substrate (33) has a collar portion (63) being abutted around a through-hole (51) of the circuit substrate (33). The first terminal (35) is fixed at a state being pressed to the circuit substrate (33) by the collar portion (63) and being slightly compressed between a base member (32). When the circuit substrate (33) and the base member (32) are spaced apart by circumambient heat, the first terminal (35) can follow by the compressed margin. When the first terminal (35) itself is thermally expanded, the first terminal (35) can follow by an elastic deformation of the horizontal portion (61) and the vertical portion (62).
    Type: Grant
    Filed: December 10, 1998
    Date of Patent: October 9, 2001
    Assignee: Nagano Keiki Co., Ltd.
    Inventors: Kouzou Yamagishi, Toshiaki Okumura, Yoji Serizawa, Haruhiko Sekiya, Takayuki Yokoyama, Yasutaka Ide, Ikuya Miyahara, Yasuo Watanabe, Shuzi Tohyama, Hayato Kobayashi